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What is flip chip?
A type of semiconductor mounting technique that does not require any wire bonds. The final wafer processing step deposits solder bumps on the chip pads, which are used to connect directly to the associated external circuitry.
total search495 articles
2005-12-07 Fujitsu advances use of nanotubes as IC heatsinks
Fujitsu has developed carbon nanotube-based heatsinks for use in high frequency power amplifiers targeted at mobile communications infrastructure.
2012-06-13 FPGAs boast high density for wired, wireless communications
Lattice Semiconductor's low cost, low power LatticeECP4-190 FPGA features 6G SERDES in low cost packages, powerful DSP blocks and built-in hard IP-based communication blocks.
2006-05-31 FlipChip, Engent to develop 3D wafer level CSP tech
FlipChip and Engent announced an alliance aimed at accelerating the development and deployment of 3D wafer level CSP technologies for stacked die packaging applications.
2003-04-03 FEI offers system to modify 90nm chips
The company has announced the development of a new focused ion beam system capable of accessing and rewiring the metal stacks on 90nm ICs.
2004-03-18 Fairchild ships out MOSFETs in SuperSOT-6 FLMP
Fairchild Semiconductor has introduced its FDC6000NZ dual n-channel MOSFET that combines the company's PowerTrench MOSFET silicon technology with a SuperSOT-6 FLMP.
2008-11-17 Fab tech roll call: survival of the fittest
Manufacturers are rolling out 45nm ICs, with 32nm designs in the works; 22nm and even smaller devices are in R&D. But delivery of chips at 32nm and beyond won't be a cool breeze.
2014-08-28 Examining Intel's embedded DRAM
With its astronomical manufacturing costs, SRAM's viability is being questioned and the industry is looking for alternatives. This article examines an intriguing option in the form of embedded DRAM.
2007-05-23 ESD/EMI protection ICs optimized for 800MHz to 2.7GHz
Semtech Corp.'s new EClamp239xP series of inductor-capacitor (L-C) protection devices feature greater attenuation, steeper amplitude roll-off and lower clamping voltage.
2009-09-03 ESD protection devices keep HBLEDs lit up
This ESD protection solution for HBLED applications is the first to feature a 100V breakdown voltage.
2006-03-03 EMI filters integrate ESD protection
Vishay Intertechnology has launched six EMI filter arrays with integrated ESD protection diodes in ultra-small leadless, plastic packages.
2008-09-12 EMI filters integrate diodes for ESD protection
OnChip has introduced a family of EMI low-pass RC Pi filter arrays with on-board diodes for ESD protection.
2004-06-15 EM Micro RFID ICs support contactless ID systems
EM Micro released a family of RFID ICs that operate at 13.56MHz for contactless identification systems.
2010-06-23 Elpida, PTI, UMC team on 3D IC integration for 28nm
Elpida Memory Inc., Powertech Technology Inc. (PTI), and United Microelectronics Corp. have reached a three-way cooperation to advance 3D IC integration technologies for advanced processes including 28nm.
2015-07-15 E-band cost, reliability concerns in MMIC packaging
Traditional semiconductor packaging approaches either cost too much or suffer from signal integrity issues. However, new techniques are becoming available that can address these problems.
2005-07-25 Duplexer tailored for CDMA800 apps
Murata Mfg disclosed that it has started commercializing a small, light-weight SAW duplexer for CDMA800 terminals
2011-04-19 Double-zone acoustic scanning of plastic-encapsulated ICs
Learn about the double-zone scanning system and how it can increase throughput.
2007-02-02 DC/DCs supply clean output voltage to portables
Supplying clean output voltage with very low ripple and fast transient response, ON Semi's new DC/DC converters are suitable for use in power-sensitive applications such as micro HDDs found in multimedia portable devices.
2003-05-14 Darpa takes on optical interconnects challenges
Darpa is overseeing development of optical interconnects that will be able to achieve 1,000 times the speed per power and volume of electronic interconnects.
2002-08-16 Dallas battery monitor allows trickle charging
The DS2761 Li ion battery monitor provides a charge path that enables trickle charging to the battery cell until such time that normal charging methods can be used.
2005-02-03 Crolles2 alliance pools CMOS process efforts
The Crolles2 alliance partners Freescale Semiconductor, Philips and STMicroelectronics have extended the scope of their joint semiconductor activities to include R&D related to wafer testing and packaging, in addition to the original development of sub 100nm CMOS process technologies.
2007-12-28 Commentary: A few fabless fables
As the fabless companies jostle and compete for market positioning and market share, they are subject to the larger trends that transact in the fabless supply-chain world.
2005-11-15 CMOS LDO regulator ICs deliver high-accuracy output voltage
Toko announced that they have begun shipping samples and mass-produced products of its TK631xxB/H/S-G and TK637xxB/H/S-G positive voltage CMOS LDO regulator ICs.
2003-05-21 ChipPAC PBGA packaging targets high-power ICs
ChipPAC Inc. has announced the availability of its thermally-enhanced PBGA packaging TEBGA-II and TEBGA-IIplus.
2014-08-11 China erects first 12in IC manufacturing supply chain
The joint venture between SMIC and JCET can benefit from Jiangyin's unique location and mature industrial environment to set up the 12in wafer bumping and CP testing production line.
2002-11-22 Chiaro router employs optical phased array switching
Chiaro Networks Inc. has emerged from stealth mode after signing a contract with the California Institute for Telecommunications and Information Technology for an optical-networking grid program.
2008-11-20 CDR transceiver enhances HD-SDI video signals
Vitesse targets the VSC3406, its latest clock and data recovery transceiver, at high-definition video broadcast equipment.
2013-03-28 Car SoCs aimed at multimedia, navigation systems
Renesas' R-Car Series can deliver more than 25,000 DMIPS and is powered by the ARM CortexA-15 quad-core configuration running an additional ARM CortexA-7 quad-core.
2006-08-22 Camera-in-a-pill takes pictures of digestive tract
Given Imaging Ltd's PillCam is an ingestible diagnostic tool that provides images of the small intestine without invasive surgery or probes.
2006-07-28 Buck regulator with LDO targets slim wireless designs
ON Semi said the NCP1526 is the first integrated converter on the market that is housed in an ultrathin 0.55mm UDFN package, which fits nicely into a slim portable design.
2014-01-22 Besi, Imec partner on thermocompression for 3D IC bonding
Imec and Besi have announced that they are collaborating to develop a thermocompression bonding solution for narrow-pitch die-to-die and die-to-wafer bonding with high accuracy and high throughput.
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