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What is flip chip?
A type of semiconductor mounting technique that does not require any wire bonds. The final wafer processing step deposits solder bumps on the chip pads, which are used to connect directly to the associated external circuitry.
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2002-04-18 Bay network processor sustains 16Gbps line rate
Designed with a deterministic pipeline architecture, the Montego programmable packet processor from Bay Microsystems Inc. is claimed to process 31.24 million packets per second, and sustain a line rate of up to 16Gbps for all traffic patterns and conditions.
2010-05-19 Baseband processor runs 600MHz at <10W
Mindspeed Technologies Inc. has launched two new members of the Transcede family of wireless baseband processors designed for small-cell 3G and 4G base stations.
2010-05-25 Baluns simplify Bluetooth-antenna connection
ST's BAL-2593D5U and BAL2690-D3U integrated baluns are designed to convert the antenna signal to a balanced pair of signals as required by the Bluetooth transceiver.
2003-11-24 AVX SAW filters measure 1.6-by-1.4-by-0.6mm
AVX Corp. has introduced a series of SAW filters that are designed for use in PCS, cellular, and GPS band receptions.
2009-09-16 Automobile LED delivers more than 850 lumens
Philips Lumileds releases Luxeon Altilon power LEDs that are suited for vehicle forward lighting.
2006-11-08 Audio amps tout zero pop-and-click noise
ON Semiconductor's new op-amp-based audio amplifiers tout fast turn-on time, zero pop-and-click noise and minimal power consumption.
2009-02-16 At ISSCC, transceivers reach giga-heights
Researchers pushed wireless transceivers to new giga-heights at the International Solid State Circuits Conference (ISSCC), with Fujitsu describing what it claimed was the world's first working 77GHz, and an NEC researching discussing UWB device capable of 2.88Gbit/s data rate.
2002-02-12 Asymtek dispensing system uses CAN bus architecture
The Axiom X-1020 mid-range inline dispensing system for semiconductor package and PCB assembly uses a CAN bus that enables it to introduce the Dynamic Dispensing Control for the dispense head through closed-loop servo technology.
2005-05-03 ASE, FCI ink wafer level packaging deal
Advanced Semiconductor Engineering Inc. (ASE) and FlipChip International LLC (FCI) have signed an expanded technology licensing agreement.
2008-04-09 Arria GX FPGA boosts speed to 3.125Gbit/s
Altera Corp. has upgraded its Arria GX FPGA family by offering support for transceiver speeds up to 3.125Gbit/s, additional serial protocols and reduced static power.
2011-10-21 ARM-based SoC targets car navigation
The R-Car H1 features quick-boot, backup camera support and media processing using an MME based on Renesas' SH4A core.
2007-06-18 Applying CTMs on FPGA-based devices
This article discusses better ways to predict temperature for these faster and denser FPGA components in a system environment.
2013-07-31 Antenna switches boost 4G/LTE-A mobile wireless apps
The PE42128x devices from Peregrine support simultaneous multi-band operation of up to 14 frequency bands while promising exceptional linearity, insertion loss performance and small size.
2010-03-24 Analysts highlight IC growth drivers
From their recent trips in Asia, Barclays Capital analysts enumerate growth areas to watch this year.
2009-10-14 Analysis: Will Tessera's optics venture pay off?
Realizing the need for new engine for growth Tessera ventured into the imaging and optics market in hopes to replicate its success in DRAM IP.
2005-04-04 Amplifier delivers 1.2W RMS power
ST's new audio amplifier is capable of delivering 1.2W of continuous RMS power into an 8? load at 5V, with a total harmonic distortion of 1 percent, measured at 1KHz.
2003-04-10 Ampire begins production of color STN-LCD modules
Ampire Co. Ltd is set to start mass production of diagonal color STN-LCD modules for display and sub-display color mobile phones.
2005-04-08 Amkor, Asat sign cross-licensing agreement - again
Packaging companies Amkor Technology Inc. and Asat Holdings Ltd have entered into a multi-year cross-licensing agreement, Amkor said Wednesday (Apr. 6), a follow-on from a similar deal cut in November 2003.
2004-07-26 Amkor to take hold of Unitive
Amkor Technology Inc. has signed definitive agreements to acquire privately-held Unitive Inc., based in North Carolina (Unitive), and to obtain a majority interest of about 60 percent in Taiwan-based Unitive Semiconductor Taiwan Corp. (UST), a joint venture between Unitive and various Taiwanese investors.
2006-03-02 Amkor to commence wafer bumping in Singapore
Amkor Technology announced that it is establishing wafer bumping operations in Singapore using the same processes currently employed by Amkor's Unitive subsidiary in Taiwan.
2004-02-17 Amkor enters purchase deal for Ficta facility in Hsinchu
Amkor Technology Inc. has entered into an asset purchase agreement to buy a 354,000 square-foot assembly and test facility in Taiwan's Hsinchu Industrial Park from Ficta Technology Inc.
2006-02-10 Amitec sets up subsidiary in China
Prior-Tech and an unidentified Chinese company have agreed to establish a plant in Shanghai that will manufacture substrates designed by Amitec.
2006-12-21 AMD goes 'green' with Pb-free bumping tech
Advanced Micro Devices has entered into an agreement to license Amkor Technology's Pb-free electroplated wafer bumping technology.
2003-04-08 AMD adopts Unitive wafer bumping technology
Advanced Micro Devices Inc. has signed Unitive Inc. to provide its proprietary electroplated wafer bumping technology for AMD's microprocessor chipsets assembly process.
2007-07-06 Altera ships production-qualified Arria GX FPGAs
Altera Corp. is now shipping its first production-qualified Arria GX FPGAs, the EP1AGX50 device with 50,000 logic elements (LEs) and EP1AGX60 device with 60,000 LEs.
2002-10-10 Altera offers Stratix FPGAs in 484-pin BGA package
Altera's EP1S10 and EP1S20 Stratix FPGAs measure 17-by-17mm, comes in a 484-pin package with Quartus II support.
2007-05-09 Altera balances features, price point in new Arria GX
With the unveiling of its latest transceiver-based FPGA family, Altera Corp. claims it has succeeded in treading the thin line between feature set and price point.
2007-08-10 Altera Arria GX dev't kit clears PCI SIG compliance tests
Altera Corp. announced that its low-cost Arria GX FPGA Development Kit has passed PCI-SIG's compliance tests.
2005-03-11 Alphasem rolls out 'ultimate tool' for die sorting
Alphasem AG disclosed that its Easyline 8031T is the ultimate tool for die sorting into carrier tapes or onto surf tapes for subsequent processes like WLP, COB and FCOB.
2008-03-04 Advanced memory buffer is key in FB-DIMMs
The M88MB2000 advanced memory buffer is a key device in the emerging FB-DIMMs from Montage Technologies.
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