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What is flip chip?
A type of semiconductor mounting technique that does not require any wire bonds. The final wafer processing step deposits solder bumps on the chip pads, which are used to connect directly to the associated external circuitry.
total search495 articles
2012-04-17 Addressing integration concerns with SiP technologies
Learn about the benefits and drawbacks of system-in-package technologies.
2015-03-10 Addressing difficult thermal analysis problems
Find out how a simple analogue ASIC can be used to solve a difficult thermal analysis problem. It allows system designers to fully model, measure and modify designs before committing to costly silicon.
2011-09-27 A primer on 3D-IC design challenges
Know the 3D-IC design challenges such as system exploration, floorplanning, analysis, and design for test (DFT), and learn how designs will evolve as 3D-IC goes on to become a necessity for managing power, performance, form factor, and cost goals.
2015-07-28 A closer look inside SK Hynix's 1st high bandwidth memory
SK Hynix's HBM has a 1,024-wide bus. It employs a base logic die as an interface between the four DRAM die stack and an interposer that supports both the HBM modules and the AMD GPU.
2014-09-29 5G cellular spawns air interfaces, MIMO antennas
Focused on integration of multiple spectrums and technologies, the awaited 5G cellular will drive developments of new air interfaces, MIMO antennas and Gbit-class LTE.
2009-09-30 40nm PHY cuts validation, dev't costs in HDDs
LSI Corp. has begun shipping samples of the 40nm multi-interface PHY IP designed for notebook, desktop and enterprise hard disk drive (HDD) market segments.
2008-09-01 3D-TSVs spark packaging revolution
Chips face the so-called "More-than-Moore" 3D integration route in order to pursue the continued aggressive scaling demanded by the historical law. 3D integration with through-silicon vias (3D-TSV) will accelerate the consolidation happening in CMOS wafer fabs and the shift toward the fabless foundry model.
2012-11-30 2D thin-film magnetic cores feature WLM tech
Enpirion claimed to extend micro-fabrication and materials technology with what it touts as the world's first 2D thin-film magnetic cores with new wafer level magnetics technology.
2008-06-06 XO-1 teardown reveals why they can't sell for $100
The OLPC XO-1's displays, batteries, CPUs, fancy enclosures and the rest all add up to a BOM that sits uncomfortably far from the $100 target.
2010-10-13 Will WHDI make it into mobile by 2012?
Wireless High-definition Interface will be in handsets by 2012, says Yoav Nissan-Cohen, chairman and CEO of Amimon, the company that developed the technology.
2007-09-17 Weigh power, heat factors in new resistors
Resistor manufacturers are now addressing demanding requirements by beefing up their power lines to offer more power and better heat dissipation in same-size or smaller packages.
2010-11-10 VTI makes consumer-grade MEMS
VTI Technologies Oy takes its automotive MEMS expertise into the consumer arena with consumer-grade MEMS chips targeting mobile handsets, gaming consoles and TV remote controls.
2014-07-17 Utilising ARM Cortex-M based SoCs (Part 1)
Learn how internal SoC peripherals, such as an op-amp, ADC, PWM, and most importantly a processor core, are used to develop a system with the least number of components on the PCB.
2015-08-20 USB Type-C: Amid the promises and confusion
The latest iteration of the USB truly affords a wealth of benefits, especially with its power delivery feature, but analysts may bring potential confusion to consumers.
2004-01-21 Two IP vendors pave the road to low power
The push for low-power ICs in advanced processes has produced little consensus beyond the notion that no single fix will do.
2012-01-03 Top smartphone trends of 2011
As we begin the new year, it is worth recording some of the more significant episodes that left their mark on the mobile market in 2011.
2013-05-30 ToF measurements pave the way for user-interaction
Discover how time-of-flight measurements open up user-interaction scenarios.
2007-04-02 TI Fellow details digital micromirror apps
Larry Hornbeck, Emmy winner for his invention of the digital micromirror device, told EE Times that TI has still more applications up its sleeve for the digital micromirror.
2009-06-09 Three alternatives challenge HDMI
At least three companies are fielding new wired alternatives to the HDMI hopes to leapfrog the HDMI 1.4 specification by providing more bandwidth, reach or networking capabilities.
2011-10-14 The move toward 3D chips
Semiconductor fabrication is moving toward 3D ICs and by next year, 3D chips will be available for commercialization.
2015-05-07 The MCU guy's guide to FPGAs: The hardware
Embedded design engineers usually come from MCU background, so they often have only a vague idea as to what an FPGA is. In this article, we'll consider the hardware aspects of the FPGA universe.
2007-06-18 The intricate dance of cutting power consumption
Key players in the industry are collaborating to deliver low-power solutions that bring more automated EDA tools, smarter IP, standard formats and more power-stingy processes together into true end-to-end solutions. EDA and IP companies have worked within the Accellera standards organization to develop the Unified Power Format (UPF).
2007-06-15 Test your blood in a Breeze
Unlike traditional meters, Bayer's Ascensia Breeze brings a level of convenience to glucose monitoring by the use of a disk containing the chemistry needed for measurements.
2006-01-11 Techwell processor targets car LCD displays
Techwell announced the expansion of its line of LCD display processors with the introduction of the TW8804, TW8806 and TW8807.
2015-04-27 Teardown: Chromecast for your inspection
Suspecting either hardware failure or a flawed automatic firmware update, the author gave up trying to revive his Chromecast and instead put it on top of the teardown pile. Here it is for your inspection.
2015-04-30 Taking advantage of TSMC's 28HPC process
Here are five areas where designers can take advantage of this new process with logic library technology to optimise the performance, power and area of their system on chips.
2008-05-05 Take a peek inside Sony's OLED TV
Sony released the first commercial OLED TV in December of 2007 with the code name XEL-1 that offered amazing technical specifications in an extremely small form factor.
2008-05-16 Startups give virtualization new spin
Two startups debuted last month, together giving virtualization a new twist to help create large systems using multiple x86 servers.
2013-02-06 Solving SoC and FPGA prototyping debug issues
Read about the accelerated development, verification and debugging of ASIC hardware and software.
2011-09-06 SMD placement system touts speed of 600C800cph
The EXPERT-SAFP is designed for rapid prototyping, and is available in manual and semi-automatic models.
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