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What is flip chip?
A type of semiconductor mounting technique that does not require any wire bonds. The final wafer processing step deposits solder bumps on the chip pads, which are used to connect directly to the associated external circuitry.
total search495 articles
2006-03-02 Interface ICs suit telecom, networking apps
ON Semiconductor introduced the NB7L32M, NB4N11M, NB4N11S, and NB4L52 fully differential interface ICs.
2010-03-01 Intel, TSMC put Atom partnership on hold
Intel has no immediate plans to bring to market any Atom chips manufactured by TSMC, confirming a report that the groundbreaking partnership has hit a lull.
2006-06-14 Inside Navman's 'go-wherever' GPS device
This article looks into the Navman iCN510 to see what makes it an efficient and truly portable navigation system.
2011-12-27 Industry screw-ups of 2011
This year will be remembered for its share of missteps in the electronics world. EE Times has compiled a list of 10 blunders from 2011 that we believe will be remembered for years to come.
2005-09-13 Indian researchers propose new SoC test method
With efficient test access architecture of much interest to the SoC design and test community, two researchers at an Indian technical institute have proposed a design-for-test method for digital SoC designs using a Test Access Mechanism (TAM) switch.
2014-06-27 IBM fab sale: Retracing its x86 steps
IBM's focus on servers for businesses prevented it from seeing and responding to what one former employee calls "the biggest server buying spree in a decade."
2011-08-22 How to reset an FPGA
Know the various reset options available for FPGAs, as well as their advantages and disadvantages.
2016-02-15 How to prevent latchup in CMOS chips
Latchup becomes a real problem when you try to power up and down different sections of your design to save power. Find out how to address this issue.
2004-12-27 How can they learn?
Part Rube Goldberg, part Tinker Toys, Jack's retro toys are taught the basics of digital logic and computer programming in an unusual way.
2016-04-25 Guard against latchup in CMOS chips
Find out how to deal with latchup, which becomes a real problem when you try to power up and down different sections of your design to save power.
2012-08-08 Grasping power awareness in RTL design analysis
Find out how formats such as CPF and UPF play a key role in capturing power intent for RTL design analysis and verification.
2015-03-19 Grasping capacitors, ripple and self-heating
Ripple can be a necessary design function, and the considerations can be quite straightforward. In this article, we will take a look at ripple ratingsor how to cook a capacitor.
2008-02-22 Gennum debuts integrated ROSA line for 10GbE
Gennum will debut a range of short- and long-wave ROSAs for 10GbE and Sonet applications spanning data center to ultra-longhaul distances.
2004-04-02 Fujitsu extends AccelArray line
Fujitsu has developed two families of structured ASIC devices: one incorporating a 200MHz ARM 9 CPU, the other including various combinations of Gigabit PHY blocks.
2004-12-16 FPGA array touts reconfigurability, high density
M2000 has released details of its embedded FPGA architecture, but certain trade-offs need to be addressed.
2015-04-28 Exploring the failure analysis process
Determining the root cause of electronic system failures requires a disciplined and systematic analytical process, along with sophisticated tools for testing and visualizing the behaviours of sample devices.
2014-12-19 Examining structural faults that lead to glitches
Learn about the structural faults that can lead to glitches in clocks. We will also tackle some bad design practices that lead to glitches in data.
2013-05-22 Enhance functional safety in embedded designs
Find out how to increase functional safety in networked embedded designs.
2005-05-27 Embedded systems survey: Operating systems up for grabs
This issue marks the second installment of our large-scale survey of embedded systems developers from around the world.
2003-06-18 EDA startup claims power management breakthrough
Claiming to reduce ASIC power consumption by as much as 25 percent, EDA startup Golden Gate Technology launched the GoPower ofering, which is said to be the first toolset to provide a complete solution for low-power layout.
2015-07-30 Diamond substrate unleashes GaN potential
Diamond substrates and heat spreaders enable GaN devices to operate near its peak power output without degradation in lifetime.
2013-06-14 DesignWare HPC Kit expanded for core optimisation
Synopsys' broad portfolio of DesignWare IP includes silicon-proven embedded memory compilers and standard cell libraries that support a range of foundries and processes from 180nm to 28nm.
2007-06-25 Designing in the age of 3D systems
The optimal utilization of the third dimension requires a careful design of the overall 3D system architecture.
2013-06-26 Designing highly reliable FPGA designs
Learn how to protect FPGA designs from soft errors.
2012-02-29 Designing high frequency synchronizer with programmable MTBF features
Read about a high frequency synchronizer circuit with programmable mean-time-between-failure capabilities that is well suited for high frequency clock gating and input signal synchronization applications.
2003-09-16 Design challenges and sign-off criteria in nanometer era
In nanometer era, traditional STA and physical verifications are no longer sufficient. The nanometer sign-off flow must comprise SI-validated analysis engines that account for the interactions of multiple-noise sources.
2004-08-24 Cypress brings reference book on SER in SRAM design
Cypress Semiconductor Corp. has revealed the publication of "SER - History, Trends, and Challenges: A Guide for Designing with Memory ICs."
2013-05-06 Conquering FinFET challenges
Here's a look at the challenges from custom/analogue, digital, parasitic extraction and signoff perspectives.
2007-02-01 CMOS MEMS oscillator enters realm of reality
In the future, the natural progression of MEMS oscillator is from digital to mixed signal to RF.
2013-11-13 CMOS image sensor for automotive view cameras
Toshiba's TCM5126GBA integrates a high dynamic range (HDR) function that reproduces high quality images of objects backlit by the sun and vehicle headlights.
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