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What is flip chip?
A type of semiconductor mounting technique that does not require any wire bonds. The final wafer processing step deposits solder bumps on the chip pads, which are used to connect directly to the associated external circuitry.
total search495 articles
2004-01-22 ASAT to provide flip-chip technology to Shanghai Fudan
ASAT Holdings Ltd and ASAT Inc. will provide flip-chip land grid array (LGA) technology to Shanghai Fudan Microelectronics Co. Ltd.
2003-08-11 ASAT SiP includes flip-chip, wirebond processes
ASAT Holdings Ltd has developed a system-in-package that integrates multiple components into a single high performance module.
2013-04-24 Applied Materials reclaims top spot in chip equipment market
In 2012, Applied Materials reclaimed the No. 1 spot based on its relative strength in deposition and process control, Gartner said.
2002-08-30 Amkor, PMC-Sierra begin 2G flip-chip production
Amkor Technology Inc. and PMC-Sierra have released for production its jointly developed second generation flip-chip packaging solutions.
2002-07-19 Amkor, IBM partner on flip-chip technology offerings
Amkor Technology Inc. and IBM have agreed to collaborate on the design and production of flip-chip substrates and packaging.
2012-07-11 Advanced flip chip packaging tech unveiled
STATS ChipPAC's fcCuBE technology features copper column bumps, bond-on-lead (BOL) interconnection and enhanced assembly processes for high volume production.
2004-06-18 Add-drop multiplex functions packed in one chip
PMC-Sierra released a device that combines a full OC-3/OC-12 add-drop multiplexer on a single chip with associated circuitry
2006-07-31 AC process streamlines Pb-free flip-chip assembly
Henkel's NCP materials provide an alternative to traditional, mechanical soldering by bonding bumps to the substrate through a Pb-free compatible thermal compression process.
2011-02-23 Toshiba develops power-saving flip-flop circuit
Toshiba's new flip-flop boasts power dissipation up to 77 percent less than that of a typical flip-flop. When used in a WLAN chip, it can reduce total power consumption by up to 24 percent.
2004-03-03 Spin valves open organic chip era
A research technique for making organic spin-valve electronics could herald the coming of nonvolatile semiconductors melded with optical emitters, transducers and sensors.
2002-02-12 Scaling debate stalks chip conference
From the wide range of panels and tutorials at the International Solid-State Circuits Conference, from the myriad papers, from the conversations in the hotel halls, a single gnawing issue grew from hints and whispers to a groundswell of concern: Will IC technology continue to scale?
2002-04-02 PDF asks software to improve chip yields
Taking its semiconductor yield enhancement technology into the chip design world, PDF Solutions Inc. has rolled out Design-Based Yield Improvement, a services and software offering aimed at fabless semiconductor providers
2004-02-23 Parallel clocking extends chip operating speed
NEC researchers have developed a parallel clocking approach for circuits that operate at 10GHz, which is capable of setting clock frequency separately from the operating frequency of a chip
2016-04-11 Machine learning methods is the future of chip routing
The recently concluded design contest of the International Symposium of Physical Design in the U.S. saw the introduction of machine learning of a power distribution network by NTU.
2001-04-04 Latches and flip-flops with PLS153
This application note discusses the use of the logic functions of the PLS153 PLD in implementing memory functions, such as latches and edge-triggered flip-flops, with a relatively small part of the chip and without external wiring.
2005-08-08 Introduction to Programmable Systems-on-a-Chip
There are a variety of programmable SoCs complete with underlying architectures and technologies. Tradeoffs exist between different programmable SoC devices.
2013-02-22 Imec, Holst chip functions at near-threshold voltages
Imec and Holst Centre have unveiled an ultra-low power processor that operates reliably at near-threshold voltages.
2014-11-06 Enhance SoC efficiency with multi-bit flip-flops
Here's a look at the architecture of multi-bit flip-flops, its merits and drawbacks. It also tackles the results of its implementation in a particular design and the various areas of concern
2004-12-01 Digitalizing analog circuits cuts chip area, increases performance
By replacing analog functions with digital equivalents, you can achieve more predictable performance, simplify testing and reduce chip area
2003-04-04 Chip designers debate asynchronous resets
Chip designers are divided when it comes to choosing synchronous or asynchronous resets, according to postings in the latest E-Mail Synopsys Users Group 409 bulletin
2003-12-22 Atmel FLIP adds increased functionality, power
Atmel Corp. has announced the availability of the second generation of FLexible In-system Programmer (FLIP), its enhanced PC-based FLexible In-system Programmer software
2007-12-17 Chip-on-MEMS' enables wafer-level calibration
A new technique called "chip-on-MEMS" bonds ASIC dice atop an entire MEMS wafer before dicing, according to developer VTI Technologies
2008-06-06 Will 3D through-silicon vias break into mainstream?
The 3D technology based on through-silicon vias technology took center stage at the IEEE 2008 International Interconnect Technology Conference but there is still no consensus just how the industry will bring the long-awaited technology into the mainstream.
2011-11-22 Wafer packaging fab opens in Taiwan
STATS ChipPAC has increased production capacity with the completion of its 300mm wafer bump and WLCSP facility.
2008-05-16 Vishay tips ultrahigh-precision voltage divider
Vishay's new ultrahigh-precision SMT flip-chip voltage divider is built on the company's 'Z- foil' technology, which reduces the resistive component's sensitivity to ambient temperature variations and applied power changes.
2006-07-11 VIA unrolls 'first' single chipset for ultra mobile PCs
VIA Technologies has added the VX700 core logic chipset to its Ultra Mobile PC (UMPC) product portfolio, claiming it is the first single chipset for UMPCs.
2001-06-16 UltraVia thin-film substrate for advanced BGA apps
A reliable high-routing-density substrate is needed to meet future market requirements. Thin-film build-up substrates offer unique advantages.
2009-04-23 TI ramps production in Philippine test plant
Texas Instruments Inc.'s new assembly/test facility within the Clark Freeport Zone in the Philippines is now fully operational and ramping production with the latest packaging technologies.
2007-11-22 TFFC LED shines 200 lumens in cool-white
Philips Lumileds announced its cool-white Luxeon K2 LED with thin-film flip-chip technology.
2004-02-12 STATS to merge with ChipPAC
ST Assembly Test Services (STAT) and ChipPAC have agreed to merge their businesses to create an independent semiconductor assembly and test solutions company.
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