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What is flip chip?
A type of semiconductor mounting technique that does not require any wire bonds. The final wafer processing step deposits solder bumps on the chip pads, which are used to connect directly to the associated external circuitry.
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2006-10-18 India's Wipro now offers post-GDS services
Wipro, an Indian technology service company, has extended its portfolio of IC design services to include post-GDS services to both fabless semiconductor and IDMs.
2015-05-12 Impact of piling on package manufacturing
To accomplish various performance enhancements, packaging engineers should consider intriguing combinations being constructed at the chip to package level
2004-05-21 IBM jettisons IC-packaging units, sells plants to Amkor
IBM Corp. has moved to jettison its chip assembly and packaging operations, announcing a major deal with Amkor Technology Inc
2014-11-12 GQFN package shrinks devices by up to 60%
Aside from reducing package size, the grid array flat no-lead package also enables improved electrical performance through lower inductance and capacitance.
2004-12-01 Getting inside the SiP
Design teams are taking a harder look at the SiP alternative to conventional SoC design as the advantages of combining multiple dice into one package have been well-documented.
2006-02-14 FlipChip begins construction of bumping facility
FlipChip International announced that it started construction of an advanced bumping facility for a new joint venture in China with Millennium Microtech (Shanghai) Co. Ltd.
1999-10-01 Facing the challenges of advanced IC packages
This article chalks up the guidelines needed by IC, package, and board designers and engineers to bridge the gap between IC design, package design, package analysis, and board-level issues.
1999-09-01 Facing the challenges of advanced IC packages
This article chalks up the guidelines needed by IC, package, and board designers and engineers to bridge the gap between IC design, package design, package analysis, and board-level issues.
2000-07-01 Deciding how much automation is needed in die bonding
In order to make the appropriate equipment decision, OEM engineers need to take a hard look at the advantages and disadvantages of installing either a semi-automatic or automatic die bonder when process development and follow-on low volume production runs are involved.
2004-07-29 Cypress NSE IC gets a bead on IPv6 problems
Cypress' latest family of NSE chips address the larger lookup and classification requirements of emerging IPv6-enabled networking designs.
2003-05-16 Compeq to focus on HDI PCB production
PCB maker Compeq Mfg Co. Ltd will reduce its output for flip-chip IC substrates and will, instead, concentrate on making HDI PCBs as well as IC substrates.
2006-07-01 Comms DSP engine packs four StarCores
Freescale Semiconductor Inc. has developed a DSP engine, based on four StarCore SC3400 cores, aimed at communications infrastructure equipment and Internet Protocol multimedia subsystem gateways.
2006-06-01 Choosing the best bumping option
The flip-chip packaging market has rapidly grown in recent years, bolstered by market demands for increased package performance and smaller form factors, an increase in infrastructure, and finally, the development of new substrate technologies and assembly processes.
2003-01-10 Camtek selects KDC as distributor in Japan
Camtek Ltd has signed Kanematsu Devices Corp. to distribute its products for microelectronics manufacturing in Japan.
2014-02-13 Ball grid array replaces standard IC packaging
One of the disadvantages of flip-chip BGA packaging is the dissipation of power and data rates on the enclosed product.
2014-05-26 Assembly handling, thermal mgmt for lidless FC-PBGA
Here are recommendations on the assembly handling and application of thermal management solutions for lidless Flip Chip Plastic Ball Grid Array components.
2002-06-03 ASAT establishes European headquarters in Munich
ASAT Holdings Ltd and ASAT Inc. have launched their headquarters in Munich, Germany, to provide comprehensive support to their clients in Europe.
2006-10-19 Amkor opens new wafer bump facility in Singapore
Amkor Technology began operations of its new 300mm wafer bump factory in Singapore on Oct. 16.
2012-10-24 Advances in wireless bonding LED technology
Know how this LED technology provides greater brightness, superior heat dissipation and enhanced durability, while maintaining small footprints.
2014-06-05 Address SoC routing congestion with 2.5D SiP
The best of both worlds approach that the electronics industry has come up with to solve a design dilemma is the System in Package (SiP) in a 2D package.
2007-02-01 Address SI issues in high-speed board design
This article discusses some of the SI challenges and the factors associated with high-speed interface designs that are enabled with key features of a RapidIO switch.
2012-12-07 Synchroniser with programmable MTBF capabilities
Here's a high frequency synchroniser circuit with programmable mean-time-between-failure capabilities well suited for high frequency clock gating and input signal synchronisation applications.
2001-06-01 Single-mask simplicity needed for SoC
The move to multimillion-gate chips made it necessary to adopt design-reuse strategies for new SoC devices.
2004-12-01 Scan design called portal for hackers
Any chip that uses scan designand any system built around it--may be vulnerable to hackers
2002-08-22 Researchers offer alternative to common crossbar design
In a technical paper presented at the Hot Chips conference, Hong Kong University of Science and Technology (China) researchers offered an alternative pipeline approach to crossbar design.
2014-11-18 Reducing SoC power: Where should the focus be?
Typically, efforts to manage power consumption in SoC design are focused on the CPU and GPU. The SoC interconnect is one area that needs to be re-evaluated.
2014-12-09 Reduce power SoC consumption in the interconnect
Here's a modular approach to SoC interconnect for reducing power consumption. The modular concept is different because it consists of a distributed architecture of various components.
2007-03-05 Is MRAM right for your consumer embedded device application?
Available memories on the market have inherent limitations that prevent them from offering the best memory features. However, with further refinement, MRAM could someday be hailed as the universal memory.
2012-08-09 Improve SoC yields with diagnostic and repair tools for embedded memory
Learn about embedded memory test solutions, including fault detection in very deep submicron technologies, repair at the manufacturing level, as well as diagnosis for process improvement and field repair capabilities.
2002-04-30 Fairchild places 50 logic functions into MicroPaks
Fairchild Semiconductor International has released 50 single-, dual- and triple-input logic functions in its 1.45-by-1mm MicroPak chip-scale package, which is 65 percent smaller than an SC70
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