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What is flip chip?
A type of semiconductor mounting technique that does not require any wire bonds. The final wafer processing step deposits solder bumps on the chip pads, which are used to connect directly to the associated external circuitry.
total search495 articles
2011-04-27 Fabless race still led by U.S. firms
Nine U.S. companies landed on the 2010 top 10 global chip vendors list while 13 made it to the top 20
2014-05-23 Enable accelerated SoC physical design at RTL
In this article, we provide a review of the essential points to consider in order to ensure a smooth transition between the logical and physical worlds.
2010-02-23 DLP chips enable nHD pico projectors for handsets
Texas Instruments Inc. has launched its latest digital light processor (DLP) chip that will enable nHD resolution pico projector modules for the smallest of mobile phones
2009-02-19 Analyst skeptical on Broadcom's 3G design wins
The announcement that Broadcom will be a supplier to some of Nokia's next-gen HSPA-based handsets should position the company to gain share in the cellular handset market in years to come, according to Craig Berger, an analyst with FBR Capital Markets.
2003-04-23 TSMC will expand test, assembly services to spur demand
In an effort to remove barriers to chip production, Taiwan Semiconductor Mfg Co. will announce an expansion of its test and assembly services and additional guidance for chipmakers on how to prevent manufacturing delays
2016-03-21 TSMC unveils silicon plans
TSMC will enable silicon interposers larger than 1,200mm21.5x the reticle sizeat 7nm to enable giant 2.5-D stacks of logic and memory for the next gen of Cowos- chip on wafer on substrate
2005-09-23 Synopsys unveils its latest floorplanning, analysis solution
Synopsys extended its floorplanning solution with the introduction of JupiterIOan enabling technology for concurrent die and package floorplanning and analysis that targets flip chip design flows.
2005-10-20 STATS ChipPAC wants to be 3D king
Nearly two years after the big merger, Singapore's STATS ChipPAC Ltd is treading slightly above stormy waters in the competitive chip packaging and test market
2005-05-17 STATS ChipPAC to offer 300mm electroplated wafer bumping services
STATS ChipPAC Ltd announced it will offer 300mm electroplated wafer bumping services in the third quarter of 2005 to complete its full turnkey service offering for advanced flip chip applications.
2006-01-19 Statistics engine liberates processor in IP-based networks
Integrated Device Technology has developed a chip that tracks statistics in IP-based networks, allowing packet processors to focus on other computer-intensive tasks
2006-11-10 Solution targets next-gen SONET/SDH platforms
PMC-Sierra has introduced the PM5336 ARROW 2488, a feature-rich, high-capacity single-chip solution for next-generation compact and scalable chassis-based SONET/SDH platforms
2014-05-19 Silicon photonics oil the works for high-speed switching
Optical components are integrated with multi-chip modules using packaging advancements with micro bumps and module substrates. The next target is to scale the technology in a cost-efficient approach
2015-01-26 SFP+ active optical cable promises lower power consumption
The fibre optic raw cable has been engineered with the latest flip-chip optical sub-component VCSEL technology working at 850nm and optimised for low power consumption of about 250mW.
2003-12-10 SDK LEDs three times brighter
Showa Denko K.K. (SDK) has developed aluminum indium gallium phosphide (AlInGaP) LEDs that are three times as bright as existing ones. Designed for use in outdoor displays, illumination, mobile phones and automotive devices, the product features a flip chip structure and emits red and orange light with high levels of brightness compared with existing products on the market.
2009-03-19 Power management for optimal design
This article describes a holistic approach for managing and optimizing the power in a design. Effective power management involves proper understanding the application of a chip, technology selection, design techniques and methodology
2006-01-19 Power amp IC extends battery life
ST announced a compact Class D power amplifier chip intended for the new generation of mobile phones and other products seeking to provide higher audio power output while preserving and extending battery life
2011-10-14 MEMS production uses TSV
The ST-patented TSV technology claims to offer space savings and higher interconnect density than wire bonding or flip chip stacking.
2007-10-09 Master the I/O planning puzzle
Systemwide I/O planning is an exercise in coordinating device placement with associated pin and net assignments across the chip-package-board system to maximize system quality for the target application. Achieving this goal is a multidomain balancing act of tradeoffs and iterations
2005-11-24 Malaysia's Unisem plans expansion in 2006
Malaysian chip maker Unisem is set to expand its reach in early 2006 by launching a new bumping joint venture at its main site in Ipoh and commencing operations at a test and assembly plant in Chengdu, China, a company executive said
2007-02-15 Infineon chips support both DVB-H, DVB-T
Infineon has announced two highly integrated, power-efficient DVB-H/T chip solutions
2004-02-02 Indium epoxy fluxes have stable thermoset residue
Indium Corp. has launched the PK-001 and PK-002 flip-chip epoxy fluxes designed for use with Sn62 and Sn 63 eutectic solders.
2009-10-06 IMEC pushes 3D integration of DRAM on logic
IMEC and its 3D integration partners have prototyped a DRAM chip integrated on top of a logic IC
2015-03-02 imec announces WDM hybrid CMOS silicon photonics transceiver
The SiPh chip, fabricated on imec's 25Gb/s Silicon Photonics Platform, includes an array of four compact 25Gb/s ring modulators, coupled to a common bus waveguide to allow WDM transmission
2012-03-14 IBM optochip reaches 1Tb/s milestone
The transceiver IC includes 24 industry-standard vertical cavity surface emitting lasers tuned to operate at a wavelength of 850nm and 24 photodiodes that are flip-chip attached to the optochip.
2007-07-23 IBM fab starts using Pb-free packaging process
IBM Corp. has started using C4NP, a Pb-free process that reduces the cost of packaging flip-chip devices.
2005-10-03 Headphone driver IC designed for space-constraint portable apps
ST introduced a compact stereo headphone driver chip with an I�C bus control interface intended for portable apps such as mobile phones equipped with FM radio that need quality audio output and minimum additional components
2005-09-23 Fujitsu rolls 65nm ASIC, SoC process
Enabling the next wave of semiconductors, Fujitsu Ltd has rolled out its 65nm process technology for advanced ASIC and system-on-a-chip (SoC) designs
2007-11-06 Five-function memory card interface fits handhelds
STMicroelectronics has announced a tiny, highly integrated chip that provides five essential functions required by memory card interfaces in handheld devices
2007-01-03 Encapsulant suits image sensor assembly
Henkel has announced the commercial availability of a new non-conductive paste (NCP) underfill encapsulant for flip-chip image sensor applications.
2005-11-01 Die, package design get closer
Targeting designs headed for flip-chip packages, Synopsys' floor-planning and analysis tool enables concurrent die and package design flows.
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