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What is flip chip?
A type of semiconductor mounting technique that does not require any wire bonds. The final wafer processing step deposits solder bumps on the chip pads, which are used to connect directly to the associated external circuitry.
total search495 articles
2007-05-14 DDR2 IP and configurability
The process of creating a PHY for a specific design is unique to every chip. The planning process traditionally starts with the pad frame design, although designs for the package and even the PCB can precede it
2002-07-02 Dallas Semi battery monitor enables recovery of fully depleted battery
The DS2761 high-precision Li-ion battery monitor incorporates precise current, voltage, temperature measurements, nonvolatile data storage, and Li-ion protection circuitry into a 16-pin TSSOP or die-sized flip-chip package.
2002-12-05 Cisco shifts from ASICs to COT designs
Cisco Systems Inc. is shifting from the use of ASICs to an approach that relies on customer-owned tooling for many of its high-end, high-volume chip designs, hoping to shave hundreds of millions of dollars from its silicon design costs
2006-01-30 BMZF resistors deliver 'outstanding' power to size ratio
Vishay announced its VFCP series of ultra-high-precision, surface-mount BMZF resistors in a flip chip configuration that promises to deliver an outstanding power to size ratio.
2006-08-07 Automatic die bonder offers increased precision, accuracy
Designed for fully automatic, high accuracy precision microelectronics assembly, Palomar's new die bonder performs adhesive dispense, component placement, die attach and flip chip operations over a 720inch2 work area.
2002-09-18 Assemblon component mounter features 9?m accuracy
The D-9, a new flip chip placement system from Assemblon BV, provides a placement throughput of 2,700 flip-chips per hour with 9?m at 3 sigma.
2005-07-29 Amkor, STATS ChipPAC still spilling red ink
Two major chip packaging and test vendors - Amkor and STATS ChipPAC - continue to spill red ink amid slumping demand and severe price pressures in the market
2014-04-22 Altera adopts fine-pitch copper packaging for Arria FPGAs
TSMC's flip chip ball grid array package technology utilises fine-pitch copper bumps measuring less than 150?m, providing excellent bump joint fatigue life, improved performance in electro-migration current and low stress on the ELK layers.
2006-11-08 90nm structured ASICs out to replace FPGAs
Seeking to displace FPGAs and other chip technologies in the marketplace, eASIC Corp. came out of its shell with a bang by unveiling a new 90nm structured ASIC line
2007-11-01 45nm designs demand efficient floorplans
With the migration to 45nm cores, optimized I/O planning and placement will become even more critical. These challenges beg the question: Who should take charge of a chip's I/O plan along with the considerations for the package and the rest of the system
2012-03-07 100Gb/s optical engine targets data centers, HPC
Kotura's silicon photonics platform features flip chip attached lasers, high performance WDM de/multiplexers, fast low power modulators and high-speed detectors.
2002-05-14 SoC test reels out of control
System-level IC testing, already complicated by increasing chip capacity and the growing use of third-party intellectual property (IP), is now being threatened from another quarter
2013-01-25 Reduce power estimation time from weeks to hours
Find out how to automatically generate a chip design's gate-level waveform from the RTL design environment without having to bring up the gate-level environment
2013-11-12 Nvidia, TI to bring next-gen HUD tech
TI with its DLP technology and Nvidia whose graphic chip is now making deeper inroads into the automotive market, say they're contributing to the evolution of the automotive head-up display
2007-09-04 IBM tech hints at supercomputer the size of dust
IBM's Zurich Research Lab has presented a molecular switch that could replace current silicon-based chip technology with processors so small that a supercomputer could fit on a chip the size of a speck of dust
2014-09-23 Future memory devices: 10 technologies to keep in mind
While current memory types are smarter and built with higher density, the succeeding memory technologies will integrate new types of materials, as well as smarter algorithms that make storage a hierarchy off-chip in a way that cache memory is hierarchical on-chip
2003-03-26 Fairchild eyes GEM deal for proliferation of MOSFET packs
Fairchild Semiconductor Corp. is negotiating with GEM Services Inc. to make the latter a third-party licensor of the technology and tooling for Fairchild's new "bottomless" MOSFET BGA and flip-leaded molded packages
2009-12-11 Coming soon: Nanoelectromechanical systems
According to experts on emerging chip technologies, nanoelectromechanical systems, or NEMS are underappreciated and could be the next big thing in semiconductor technology
2009-07-06 Cisco's digital camcorder carries clean design
A teardown reveals that the Flip UltraHD's insides are proven technology and that its simple design is even cleaner than its predecessor
2008-09-01 Calling video IP vendors to consolidate
With a few exceptions, the video IP market is characterized by a large number of small players. This market fragmentation is problematic for both IP vendors and their customers. If you're designing a video-oriented SoC, how do you go about choosing components that will work together? It's difficult to evaluate the video performance of a single IP block or chip
2014-11-18 Addressing the problem of X unknowns in simulation
The sheer complexity and common use of power management schemes raise the probability of an unknown X state in the design, translating into a functional bug in the final chip
2003-09-03 XGI merges with Trident graphics processor division
XGI Technology Inc., a newly formed company by Silicon Integrated Systems Corp., has merged with the graphics processor division of U.S.-based Trident.
2002-01-09 WEDC MCP for embedded control apps packs RISC processor, SSRAMs
The WED3C741016M-400BX multichip package combines a PowerPC 7410 AltiVec RISC processor with 2MB SSRAM L2 cache, and is aimed at embedded control applications where density and performance are required.
2002-10-15 VJ Electronix inspector provides 5000x magnification
The VJ-2000 LS automated x-ray inspection system is capable of inspecting boards up to 609.6-by-914.4mm and provides up to 5000x magnification for BGAs.
2003-04-23 Virage adds I/O cells to complete 'silicon platform'
Virage Logic is rolling out I/O cells as the final piece of a "silicon platform" aimed at companies developing SoC products.
2005-10-14 UTAC drawing strength from overseas partnerships
United Test and Assembly Center Ltd. (UTAC) is on track to nearly double its earnings this year thanks in part to a series of partnerships and customer wins in China and South Korea, UTAC CEO J.C. Lee said Wednesday (Oct. 12).
2004-11-29 Upgraded tool speeds IC package analysis
Fluent's new offering may help prevent some of the packaging problems that have come to plague PCB designers.
2008-06-20 Unisem, FlipChip deal zeroes in on wafer technologies
Unisem and its subsidiary Unisem-Advanpack Technologies Sdn Bhd (UAT) have entered into an agreement with FlipChip International LLC (FCI) for the licensing of FCI's wafer bumping and wafer level packaging technologies.
2005-05-13 TSMC to get wafer bumping service from STATS
Taiwan Semiconductor Mfg Co. (TSMC) customers will receive 300mm wafer bumping service from STATS ChipPAC Ltd.
2008-04-30 TSMC IC design collaboration strategy stirs controversy
TSMC has unveiled a new and possibly controversial strategy that involves more collaboration in the early stages of the IC design process.
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