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What is flip chip?
A type of semiconductor mounting technique that does not require any wire bonds. The final wafer processing step deposits solder bumps on the chip pads, which are used to connect directly to the associated external circuitry.
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2015-03-12 Smallest dual-channel filter targets ZigBee RF4CE remotes
STMicroelectronics introduced the market's smallest dual-channel filter with 1.2x3.4mm2 footprint, targeting ZigBee RF4CE remotes and consumer electronics equipment.
2007-01-29 SiP lacks EDA tool support
System-in-package (SiP) may be an increasingly attractive alternative to SoCs, but EDA tool support is sorely lacking.
2009-02-24 Silicon tuner provides artifact-free reception
Maxim Integrated Products has developed a single-conversion silicon tuner that employs a single downconversion step from RF to 36MHz to provide artifact-free reception of analog signals and high-quality reception of digital signals.
2012-12-26 Silicon photonics paves the way for 100G networks
Learn how silicon photonics can enable widespread adoption of 100G networks.
2009-09-02 Silicon circuit board trumps ASICs
Startup siXis Inc. has selected foundry SVTC Technologies to fabricate its embedded silicon board computing modules, which claims to bridge the gap between PCB prototypes and ASIC-based designs.
2006-10-26 Sigrity unveils new IC package characterization suite
Promising a new suite of tools that will enable 'fast, easy, accurate and complete' IC package characterization, Sigrity Inc. this week is releasing its SpeedPKG Suite.
2002-08-22 SiGe Semi WLAN amplifier cuts current consumption by half
The SE2522L 2.4GHz power amplifier combines a SiGe architecture with power control circuitry to reduce current consumption by as much as 50 percent over competing products.
2007-05-30 SerDes core is PCIe 2.0-compatible
At last week's PCI-SIG Developers Conference in the U.S., NEC Electronics America has introduced a new SerDes core based on its advanced 90nm process technology.
2006-04-07 Semtech protection devices serve 3G/CMDA phones
Semtech's EClamp 237xP devices protect 3G/CMDA mobile phones from electrostatic discharge, increased levels of electromagnetic interference and radio frequency interference.
2005-02-18 Semtech offers USB port protection from ESD, EMI
Semtech International AG announced last week the release of its new protection device that can work with both upstream and downstream USB 2.0 (full speed) and on-the-go (OTG) ports in portable electronics and peripherals.
2004-05-04 Semtech device protects LCD screens from damage
Semtech's EClamp 2340C protection device is designed to safeguard high resolution color LCD screens from damage or upset caused by EMI, RFI, and ESD.
2004-03-16 SEMI: Semiconductor packaging materials market to reach $11.7B
The market for semiconductor packaging materials is expected to grow from $7.9 billion in 2003 to $11.7 billion by 2008, according to SEMI and TechSearch International's latest report entitled
2007-11-20 Security MCUs boost functions of SIM cards
Infineon Technologies has unveiled its new product family of security MCUs specifically designed for use in SIM cards.
2005-11-10 SDK rolls GaN-based LEDs
Showa Denko K.K.'s nnounced its proprietary gallium-nitride-based near ultraviolet and green LED chips
2013-07-17 Saving embedded PCB design with forensic tech
Find out how forensics inspections can alleviate OEM concerns over maintaining high reliability for their systems and sub-systems.
2013-05-08 SATS market saw modest but hopeful growth in 2012
Gartner saw the global SATS market totalled $24.5 billion in 2012, which is a 2.1 per cent increase from 2011
2002-05-08 Sanmina-SCI yields HDI PCBs at Costa Mesa plant
EMS provider Sanmina-SCI Corp. is producing high density interconnect (HDI) multilayer PCBs at its HDI manufacturing and research center in Costa Mesa, California.
2003-12-04 Sandia: Output/wavelength firsts for deep-UV LEDs
Sandia National Laboratories is reporting new levels of wavelength/power output for deep-ultraviolet LEDs, which are critical to future comms apps.
2015-04-14 Samsung catches up with Intel, delivers its 14nm
Samsung's Exynos 7420 fabbed with a 14nm FinFET process is now out. But whose 14nm process was it?
2002-04-24 RVSI rolls out gold bump wafer inspection system
Designed specifically to inspect wafers that employ gold bump technology, the WS-2510 from Robotic Vision Systems Inc. contains a sensor that can inspect micron-sized gold bumps at production speeds.
2002-06-11 RVSI receives order for 3-D wafer inspection system
Robotic Vision Systems Inc. has received an order for a WS series bumped wafer inspection system from an undisclosed major supplier of materials for BGA semiconductors.
2007-07-19 RFMD expands Beijing plant capability
RF Micro Devices Inc. will expand its Beijing facility to include increased assembly capacity and new advanced capabilities.
2011-04-14 RFID solutions boast improved performance, low cost
Alien Technology has introduced a trio of high-performance, business-class technologies: the Higgs 4 IC, ALH-900x family of mobile handheld readers and Squiggle inlay.
2007-07-12 RF antenna switch claims highest throw count
Peregrine Semiconductor has announced the 0.5?m PE42693 SP9T RF antenna switch, reporting that it is the highest throw-count RF CMOS antenna switch available on the market today.
2013-05-29 Removing field failures at wafer level (Part 1)
Here's a look at Sonoscan's new automated wafer inspection system and its advantages.
2006-05-22 RC network provides memory termination
TT electronics BI Technologies Electronic Components Division's resistor-capacitor network provides a space-saving termination for high-speed memory busses.
2009-01-06 R-C protection devices target 3G handsets
Semtech Corp.'s EClamp237xK family of resistor-capacitor (R-C) protection devices tout low capacitance, high attenuation and low clamping voltage needed for high-resolution color LCD interfaces in GSM and CDMA-based 3G handsets.
2007-07-13 R-C filters protect LCD interfaces in 3G handsets
Semtech's new family of R-C filters have the low capacitance, high attenuation and low clamping voltage needed for high-frequency color LCD interfaces in 3G handsets.
2011-11-22 Power IC market sees 72% CAGR until 2015
IGBTs and MOSFETs are forecast to drive the market to grow from $14.2 billion this year to $16.7 billion in 2013.
2004-10-06 PMC-Sierra multiprocessor with two E11K CPU cores
PMC-Sierra introduced its third generation highly integrated 64bit MIPS-Powered multiprocessor at the Fall Processor Forum.
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