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What is flip chip?
A type of semiconductor mounting technique that does not require any wire bonds. The final wafer processing step deposits solder bumps on the chip pads, which are used to connect directly to the associated external circuitry.
total search637 articles
2013-07-29 Vishay Precision Group debuts foil resistor flip-chip
VPG's FRFC 0805 ultra-high-precision Z1-Foil flip-chip resistor noise-free and provides ESD protection of 25kV or more for increased reliability.
2007-07-10 Understanding flip-chip and chip-scale package technologies and their applications
This article first defines the terms "flip chip" and "chip-scale package" and explains the technical development of wafer-level packaging (WLP) technology.
2003-07-07 TSMC, Amkor partner on flip-chip packaging
Amkor Technology has developed and qualified wirebond and flip-chip packaging for devices manufactured on TSMC's advanced low-k process technologies.
2003-08-27 TriQuint, Amkor partner on flip-chip process
TriQuint Semiconductor Inc. has teamed with Amkor Technology Inc. to commercialize a low-cost flip-chip assembly process for GaAs semiconductors.
2011-02-23 Toshiba develops power-saving flip-flop circuit
Toshiba's new flip-flop boasts power dissipation up to 77 percent less than that of a typical flip-flop. When used in a WLAN chip, it can reduce total power consumption by up to 24 percent.
2010-07-09 TI turns to pillar flip-chip for 45-/40nm node
Texas Instruments Inc. is embracing an emerging technology called fine-pitch copper pillar flip-chip packages for devices at the 45-/40nm node and below.
2007-10-11 Thermal pillar copper tech helps cool flip-chips
Nextreme claims to have solved the overheating problem with modern flip-chips with its thermal copper pillar bumps, which can either help cool chips, or can be used in reverse to generate energy from waste heat.
2001-02-01 Testing dimensional limits of high I/O flip-chip design
The study characterizes underfill materials, examining some large package geometries and design manufacturing processes to avoid defects for I/O counts.
2002-03-22 SUSS flip-chip bonder has up to 200kgf handling force
The FC259 flip-chip bonder features a handling force of 10gf, which is suitable for handling brittle substrates used for optoelectronic devices, but can be configured up to 200kgf for thermocompression processes.
2010-12-15 STATS ChipPac flip chip biz grows over 50%
Semicon test and packaging provider STATS ChipPAC announced its flip chip business grew more than 50 percent in 2010. The company shipped more than 250 million flip chip packaging units.
2005-09-02 Singapore packager to expand flip-chip capacity
Assembly and test company STATS ChipPAC Ltd is expanding its capacity for flip-chip assembly.
2008-04-30 Singapore inventor gets patent for flip-chip IC assembly tech
Teck Kheng Lee of Singapore has been granted U.S. patent for his development of a method for assembling a flip chip semiconductor device.
2004-10-29 SDK blue LED features flip chip structure
Showa Denko K.K. announced that it has developed a blue LED based on gallium nitride.
2007-06-19 RF switch packs four switches in flip-chip housing
Peregrine Semiconductor Corp. has unveiled the UltraCMOS PE42110 multiple switch IC for advanced multi-band WCDMA handsets.
2001-07-16 Reworking CSPs, ?BGAs and flip-chips
Rework of CSPs and flip-chip is required to achieve systems that are reliable, repeatable and cost effective.
2001-08-01 Preventing flip-chip solder joint failures
Learn about the degradation of solder joints in FCOBs as a result of thermal cycling. The article also seeks to answer how solder joint cracks are initiated and propagated.
2006-12-01 Port expanders for flip-cell phones save cost and space
This application note discusses the features available in recent-design port expanders, which are particularly relevant for the design of space-limited, cost-sensitive flip phones.
2002-09-16 ON Semi flip-flop occupies 2.1-by-3mm footprint
The NL17SZ74US edge-triggered, D flip-flop from ON Semiconductor occupies a 2.1-by-3mm footprint and is suitable for use in laptops, portable video game consoles, and cable and DSL modems.
2000-06-01 Novel ACF for flip-chip attach
This paper focuses on determining the advantages achieved with the new 'ordered' ACF on actual flip-chip assemblies. In particular, the distribution of conductive particles are determined on the flip-chip bumps and results are compared to theoretical predictions.
2011-04-15 New flip-chip techs, apps loom ahead
Factors such as the rising cost of gold used for wire bonding, need for low-thickness devices and continued CMOS downscaling have triggered interest in flip-chip technologies.
2001-04-04 Latches and flip-flops with PLS153
This application note discusses the use of the logic functions of the PLS153 PLD in implementing memory functions, such as latches and edge-triggered flip-flops, with a relatively small part of the chip and without external wiring.
2005-02-25 Kyocera expands flip-chip assembly
Kyocera America Inc. has expanded its flip-chip assembly operations to include 12-inch (300mm) wafer dicing.
2004-02-12 Kulicke & Soffa sells flip-chip business
Kulicke & Soffa Ind. Inc. has sold all the assets associated with its advanced packaging technology segment.
2005-01-03 Jetting of flux for flip chips
In flip chip assembly, the jetting of liquid flux material onto the substrate has advantages over the dipping of the attached balls into flux.
2010-06-04 IPAD 500?m Flip Chip: package description and recommendations for use
This application note provides package and usage recommendation information for 500?m pitch Flip Chips.
2007-11-30 Indian startup seeks funds for ATMP facility for flip-chips
India-based semiconductor manufacturing startup SemIndia is in talks to raise $100 million to help launch operations.
2001-09-16 Improving compression-type flip-chip bonding
This technical article describes the compression-type flip-chip bonding technique that enables high-quality, high-density and low-cost processes in LSI packaging.
2005-09-29 IDT's flip-chip packaged monolithic NSEs now RoHS-compliant
IDT disclosed that it has begun volume production of its RoHS-compliant flip-chip packaged monolithic 512Kx36 (18Mb) and 256Kx36 (9Mb) network search engines with dual Network Processor Forum Look Aside interfaces.
2005-09-21 IDT offers network engines in RoHS-compliant flip-chip packaging
Integrated Device Technology Inc. (IDT) has begun volume production of its RoHS (Restriction on Hazardous Substances)-compliant flip-chip packaged monolithic 512Kx36 (18Mbit) and 256Kx36 (9Mbit) network search engines (NSEs) with dual Network Processor Forum (NPF) Look Aside (LA-1) interfaces.
2001-05-30 How to make padstacks flip with SMD parts
This application note shows the proper procedure to create SMD padstacks that will flip when the component is flipped.
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