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What is flip chip?
A type of semiconductor mounting technique that does not require any wire bonds. The final wafer processing step deposits solder bumps on the chip pads, which are used to connect directly to the associated external circuitry.
total search18 articles
2008-06-20 Unisem, FlipChip deal zeroes in on wafer technologies
Unisem and its subsidiary Unisem-Advanpack Technologies Sdn Bhd (UAT) have entered into an agreement with FlipChip International LLC (FCI) for the licensing of FCI's wafer bumping and wafer level packaging technologies.
2006-05-31 FlipChip, Engent to develop 3D wafer level CSP tech
FlipChip and Engent announced an alliance aimed at accelerating the development and deployment of 3D wafer level CSP technologies for stacked die packaging applications.
2006-02-14 FlipChip begins construction of bumping facility
FlipChip International announced that it started construction of an advanced bumping facility for a new joint venture in China with Millennium Microtech (Shanghai) Co. Ltd.
2004-02-12 Kulicke & Soffa sells flip-chip business
Kulicke & Soffa Ind. Inc. has sold all the assets associated with its advanced packaging technology segment.
2000-04-01 Centrifugal cleaning for advanced circuit assemblies
As a manufacturer, you face the simultaneous challenges of qualifying new cleaning compounds and equipment designs for improved cleaning results. Centrifugal cleaning may be the solution to overcome shortcomings of present cleaning processes.
2005-05-03 ASE, FCI ink wafer level packaging deal
Advanced Semiconductor Engineering Inc. (ASE) and FlipChip International LLC (FCI) have signed an expanded technology licensing agreement.
2001-09-18 TVS/Chip product overview
This application note outlines Microsemi's offerings of transient voltage suppressor (TVS) chip-size products that include TVS/Chip, TVS/Cell, SMT/Cell and TVS/FlipChip.
2009-03-18 FCI, SMIC: new 300mm flip chip allies
FlipChip International (FCI) has formed a partnership alliance with Semiconductor Manufacturing International Corp. for 300mm flip chip bumping and wafer-level packaging.
2011-06-17 FCI, Fujikura team up for IC packaging tech
FlipChip International and Fujikura Ltd are collaborating in innovating advanced semiconductor packaging technology.
2010-08-19 FCI, CESP sign polymer collar tech agreement
FlipChip International has announced the signing of a patent license agreement with Cookson Electronics covering the application of polymer collar technology to enhance the drop-shock and thermal cycling reliability of area array packages, particularly wafer level packages used for handheld devices.
2014-09-01 White-chip scale packages offer up to 80% cost reduction
Rated for input power up to 3W, the the ReadyMount Enhanced CSP from SemiLEDs is a fully packaged white emitter SMD component, ready for surface mounting on any board level module or COB application.
2014-09-18 SerDes platform speeds deployment of 100G network chips
The SerDes evaluation platform from Open-Silicon integrates a 28Gb/s SerDes quad macro, using PHY IP from Semtech, and meets the compliance needs of the CEI-28G-VSR, CEI-25-LR and CEI-28G-SR specifications.
2015-03-09 IoT drives chip packaging innovation
The need for high performance multi-functional devices in a single package is pushing the industry to innovate in multi-chip packaging. This high level of integration has presented huge challenge.
2007-09-12 Firms form forum to promote wafer-level CSP
Major industry firms have joined hands and formed the WLCSP Forum to promote the adoption of semiconductor devices using wafer-level CSP.
2011-11-16 Embedded die tech-based 3D package unveiled
ChipletT and ChipsetT enable packaging in the sub-250?m range, up to 50 percent less than alternative embedded die solutions, the companies claimed.
2011-12-08 Designing 3D-ICs (Part 2)
Here's the second instalment of this series that tackles the tools that can be used to handle a complete backend flow, and enable true 3D design partitioning, synthesis, placement, and routing.
2016-04-07 Boost functionality of industrial DC/DC converters
Know how modern packaging technology can help improve the performance of industrial DC/DC converters that require more functionality.
2014-12-11 20kV TVS diode arrays offer bidirectional ESD protection
The SP3022 series from Littelfuse can safely absorb repetitive ESD strikes over the maximum level specified in the IEC61000-4-2 international standard without compromising performance.
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