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2007-07-16 TSMC pulls curtains off 45nm design process
Taiwan Semiconductor Manufacturing Co. Ltd unveiled its latest and most ambitious design methodology for IC production at the challenging 45nm node.
2007-12-12 TSMC develops 32nm process sans high-k
TSMC said that it has developed a 32nm, low-power technology without having to resort to high-k gate dielectric and metal gates to achieve its performance characteristics.
2011-04-29 TowerJazz SiGe process enables high-speed interfaces
The SiGe process enables high-speed interfaces in communication protocols such as Thunderbolt, optical fiber and high-data rate wireless by improving performance while reducing noise and power usage
2011-09-26 Specialized foundry processing yields high-performance analog IC
Learn about the impact of foundry process on achievable specifications.
2005-05-26 Samsung licenses foundry process design tools from IBM, Chartered
Samsung Electronics Co. Ltd has licensed the 90nm "common design enablement technology" utilized by IBM and Chartered, Chartered said.
2007-06-11 Russia's Mikron teams with ST for 180nm process
JSC Mikron is pushing ahead with its partnership with STMicroelectronics for the 180nm CMOS foundry process.
2005-08-25 Rambus, UMC expand process technology licensing pact
Rambus Inc. and United Microelectronics Corp. (UMC) have extended the availability of Rambus' patented PCI Express PHY cells to UMC's 180nm, 150nm and 90nm processes.
2006-08-11 Korean foundry teams up with Cadence on process design kit
Dongbu Electronics said it has developed process design kits (PDKs) for high-voltage semiconductor devices
2008-10-03 IBM 'fab club' details foundry roadmap
IBM Corp.'s "fab club" has outlined its foundry process road map including a 28nm "half-node" technology, and, in some cases, positioned its 32nm offering as a better alternative to 40nm.
2003-06-10 Group wants to standardize process design kits
A small group of long-time EDA industry insiders is quietly pulling together a study group to discuss standardization of foundry PDKs
2008-08-01 FPGAs are all set for next process nodes
Altera Corp. today is expected to become the first FPGA vendor to launch a family of 40nm FPGAs. In addition, Altera will announce the 40nm HardCopy IV structured ASICs, as well as corresponding software tools for both device types. The families promise to enable a new class of single-chip, multicore and related complex devices.
2011-03-14 Foundry vendors announce partnerships
Dongbu HiTek, TowerJazz, UMC forge partnerships to strengthen capabilities and boost product portfolios.
2006-11-14 EDA panelists call for standardized process design kits
Standardization of foundry process design kits will provide major benefits for analog and custom IC designers, according to panelists at the Synopsys EDA Interoperability Developer's Forum.
2009-11-02 Dongbu aims to be analog foundry powerhouse
South Korea foundry Dongbu HiTek Co. Ltd is looking for respect in the foundry business and aims at being the "TSMC" in analog and mixed-signal
2007-08-22 CMD, MagnaChip sign foundry, process tech deal
California Micro Devices (CMD) and MagnaChip Semiconductor Ltd announced that they have inked a strategic foundry business and process technology transfer agreement.
2005-11-11 Atmel offers wireless foundry process
Semiconductor maker Atmel Corp. rolled out a new, 0.18-micron process technology for wireless customers
2005-01-04 Addressing foundry SoC challenges associated with advanced technologies
As process technologies continue to shrink to 90nm and below, new opportunities are presented to designers that allow them to combine the functions of entire systems onto a single piece of silicon
2009-06-12 0.18?m foundry solution targets Hall sensors
X-FAB Silicon Foundries has introduced the what it claims to be the first foundry process for the production of integrated Hall sensor ICs in 0.18?m; technology.
2005-01-20 ZMD, 1st Silicon team up for automotive chips, foundry
ZMD AG and 1st Silicon (Malaysia) Sdn. Bhd have formed a partnership for the development and supply of automotive extensions to manufacturing processes, the two companies announced Tuesday (Jan. 18).
2002-01-24 Zarlink to sell its Bromont foundry to DALSA
Zarlink Semiconductor has signed a definitive agreement with DALSA Corp. to sell its foundry facility in Bromont, Quebec, Canada, and related business to DALSA
2002-12-19 Zarlink offers high-voltage process for foundry work
Zarlink Semiconductor Inc. has introduced a commercial foundry service for producing analog chips based on its high-performance, high-voltage process.
2002-12-20 Zarlink launches "all silicon' process for analog chips&quot
Zarlink Semiconductor Inc. has introduced a new commercial foundry service for producing high-voltage, high-speed analog chips
2004-10-19 Xilinx, Toshiba form foundry relationship
Xilinx Inc. and Toshiba Corp. have formed a strategic foundry relationship under which Toshiba will manufacture Xilinx field programmable gate array (FPGA) products
2004-07-30 Xilinx invests in China foundry
Programmable chips supplier Xilinx Inc. has invested in China-based foundry He Jian Technology (Suzhou) Co. Ltd
2012-09-14 X-Fab claims the first open platform MEMS 3D process
X-Fab's 3-D sensor process is suitable for applications ranging from mobile devices, consumer goods, games and toys, automotive, robotics, industrial and medical equipment
2003-03-21 Winbond lends Flash memory process NexFlash
Winbond Electronics Corp. of Taiwan has agreed to a foundry agreement with NexFlash Technology Inc
2005-05-10 Wi-Fi startup selects Atmel for SiGe foundry work
Fabless semiconductor company WiDeFi Inc. has selected Atmel Corp. as foundry partner for a family of 802.11 wireless LAN "repeater" chipsets implemented in silicon germanium, the company said
2014-10-10 Wafer foundry market teeters on edge of growth
The market's growth has fluctuated between a high of 39.4 per cent in 2010 and a low of 6.8 per cent in 2013, due mainly to the differentiation in wafer foundry industry
2012-06-06 VIS adopts Sagantec's process migration sol'n
According to Sagantec, the solution will enable VIS' library development to meet customer's tight prototyping schedule.
2012-12-21 UMC touts 55nm display driver IC process
The 55nm SDDI process claims to feature an ultra-small SRAM size and provides an ideal balance of power consumption, performance and chip size for integration into high-end Full-HD smartphones
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