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2003-02-05 Xanoptix rolls "inside-out" heatsink
Xanoptix Inc. has introduced an "inside-out" heatsink that features a multitude of intersecting passageways for air or fluid flow.
2002-06-26 SynQor quarter-brick delivers 60W without heatsink
The DualQor dual output, quarter-brick dc/dc converter from SynQor is capable of delivering up to 60W of power at 112V, without the need for an attached heatsink.
2002-02-27 SynQor 15A quarter-bricks eliminate heatsink
Designed for low power applications that need a low profile, quarter-brick dc/dc converter, the PowerQor Mega series delivers up to 15A of output current at 3.3V and below, and 75W at 5V and above?without the need for an attached heatsink.
2004-01-26 Rotys heatsink cools up to 30W
The RFD-1 heatsink from Rotys Inc. is based on the company's Zero H flat motor technology, where a PCB technology is used to print copper coils for the stator.
2005-11-28 Power resistors tout heatsink design
Ohmite introduced a new series of 70W thick-film power resistors with a heatsink design that is suitable for apps that require non-inductive performance.
2012-10-12 Peak's high power DC/DC converters integrate heatsink
The heatsink of Peak electronics' PO/HS series of high power DC/DC converters can be specified to remove the heat according to the needs of the application.
2004-03-29 Maxim audio amps eliminate bulk heatsink designs
The 15W, mono, filterless, Class-D audio amplifier from Maxim Integrated Products eliminates the need for bulky, expensive heatsink designs.
2001-08-20 Heatsink issues for IGBT modules
This application note details the critical factors that should be considered when using heatsinks for IGBT modules.
2005-09-13 Heatsink delivers optimal cooling
Cool Innovations said a first of its kind UltraCool P line of splayed pin fin heatsink produces a cooling premium of 20 to 30 percent compared to standard pin fin heatsinks when operating in low air-speed environments.
2008-06-30 Guidelines on leadforming, trimming lead length, and heatsink mounting
The demand for smaller consumer products often results in semiconductor designers manipulating package configurations to fit intended designs, often requiring custom leadforming and module assembly.This application note introduces general guidelines to ensure basic protection to the integrity of the package, both mechanically and electrically.
2003-04-21 Furukuwa develops thinnest heatsink
Furukawa Electric Co. Ltd has announced the development of a sheet-type heatsink, which the company claims to be the world's smallest.
2003-01-14 dc/dc converters operate to 100C without heatsink
C&D Technologies (NCL) Ltd has released the WPA50 series of 50W dc/dc converters capable of operating at temperatures of up to 100C without a heatsink.
2002-03-01 Chomerics phase-change material simplifies heatsink removal
The T766 phase-change features a thermal impedance of 0.04C-inch?/W, providing a low thermal resistance interface path between hot components and heat inks, while allowing easy removal of sinks for rework operations.
2004-08-30 Astrodyne dc-dc converter incorporates finned heatsink
Astrodyne disclosed the availability of its ASD10H-48S5 MicroBrick open-frame dc-dc converters that feature an integrated finned heatsink.
2004-01-06 SynQor launches Asia-Pacific headquarters
SynQor has opened its new Asia-Pacific regional headquarters office in Singapore.
2003-09-23 Shunde Shunhua heatsinks target CPUs
Shunde Shunhua Aluminum Industry Co. Ltd has announced the availability of the S001 heatsink that is designed for use in CPUs.
2002-04-29 Radian CPU cooler cools up to 2.4GHz
Specifically designed to cool Pentium 4 Socket 478 up to 2.4GHz, Radian Heatsinks' P4 CPU coolers comes pre-assembled with a fan, attachment clip and Al 6063 heatsink.
2003-01-27 Permlight, CPS co-develop advanced LED lighting systems
Permlight Products Inc. has entered into an exclusive strategic relationship with Ceramics Process Systems Corp. , to jointly develop semiconductor-based lighting systems.
2010-12-22 PCB thermal management tech gets US patent
Viasystems' thermal management system for PCBs utilizes a copper heatsink as an integral part of the board rather than as an attachment. It holds US patent no. 7,741,566 B2.
2010-09-03 ORNL licenses graphite foam to LED North America
The technology, developed at the Department of Energy's Oak Ridge National Laboratory, has been licensed to LED North America.
2003-06-30 Mounting Guidelines for the SUPER-247
This application note discusses the procedures involved in clip mounting the SUPER-247 to heatsinks.
2003-06-20 Mounting Guidelines for the SUPER-220
This application note outlines the thermal options available to designers with regard to interface materials, clip types and the contact forces required to give good thermal contact and performance.
2003-06-20 Mounting Considerations for International Rectifier's Power Semiconductor Packages.
This application note discusses the proper practice/procedure in mounting power semiconductors packages.
1999-11-12 Mounting and handling of semiconductor devices
This application note will guide the user to the proper utilization of the company's devices, particularly the TO-220 and TO-202 epoxy packages.
2003-06-17 Molex CoolFin heatsinks maximize thermal efficiency
The 37430 series of CoolFin heatsinks from Molex reduce weight and save space while maximizing thermal efficiency for Pentium 4 microprocessors.
2002-05-10 Mechanical support components for S.E.C. cartridge processors
This application note provides procedures to exactly copy the design Intel is enabling through a set of mechanical specifications for a set of mechanical support components used for the Pentium II processor.
2005-07-28 Heatsinks designed for BGAs
Vette has announced the availability of its thermal solutions for ICs in ball grid array (BGA) packaging. The new BGA heatsinks target traditional high-volume motherboard, video card and networking board apps.
2006-02-08 Heatsinks cool BGAs in low air flow
Advanced Thermal Solutions has introduced maxiFLOW heatsinks for cooling BGAs and other hot components in restricted air-flow conditions.
2005-12-07 Fujitsu advances use of nanotubes as IC heatsinks
Fujitsu has developed carbon nanotube-based heatsinks for use in high frequency power amplifiers targeted at mobile communications infrastructure.
2001-08-21 Formulating technical enquiries
This application note presents some guidelines on how to formulate technical inquiries for thyristors, rectifiers or heatsink assemblies.
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