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2007-05-17 R&D center for high-end packaging opens in Singapore
STATS ChipPAC is laying the groundwork for its expansion into the high-end packaging market by building a new R&D center at its Singapore headquarters.
2004-12-14 China IC-packaging sector suffers from worker shortage
Research firm iSuppli Corp. has reported that China's IC packaging industry is under pressure from the scarcity of skilled workers
2007-11-12 Single-supply muxes suit high-end video products
Intersil has announced two new single-supply, triple 4:1 buffered multiplexers designed for use in high-end consumer video products
2007-08-17 Shifting trends in packaging industry favor big players
Industry insiders agree the packaging business is getting increasingly expensive, a trend that naturally favors larger players
2003-06-16 OSE, Winstek collaborate for high-end IC testing
Orient Semiconductor Electronics, an IC packaging and testing firm, has partnered with IC testing firm Winstek, to increase its testing capabilities
2012-01-19 IC market to tug chip packaging, testing sales
For Q1, testing and packaging firms forecast a dip in sales from 5-10 percent, although a rebound is forecast for Q3
2002-01-15 Huayue Microelectronics opens IC packaging firm in Shaoxing
Huayue Microelectronics Co. Ltd has opened an IC packaging firm, Zhejiang Huayue Package Electronics Co. Ltd, located in Shaoxing City, Zhejiang, China
2014-10-29 Advances in power supply packaging
Here's a look at where the power industry is going in terms of component integration and thermal management. It also covers the developments in DC/DC power converter density.
2012-10-04 French company plans 1024 high-end DSP cores on single die
Kalray has recently sampled a Purpose Processor Array MPPA-256 processor integrates 256 processors onto a single silicon chip and is planning a 1024 processor version.
2008-09-05 Alchip taps Sony Semi's packaging tech for ASICs
Open foundry ASIC provider Alchip Technologies Inc. has selected Sony Corp.'s Semiconductor Group to be their package partner in advanced SoC ASIC solutions for its worldwide customers.
2002-08-26 STATS EBGA package offers more I/O
STATS Ltd. has launched the EBGA Multi-Tier package that offers higher I/O and multiple wire bonding zones for power, ground, and signal connection.
2012-01-05 New 28nm platforms: Transforming Asia from world's factory to global R&D hub
The convergence of several long-term economic, market and technological trends are driving demand for a new class of devices that combine the capacity and customizability of ASICs, flexibility of FPGAs and cost effectiveness of ASSPs.
2002-06-17 K&S ball bonder targets HDM, SO packages
Specifically designed to be used with high-density matrix and SOP casings, the Nu-Tek automatic ball bonder from K&S Ind. Inc. is claimed to deliver up to 30 percent more productivity than the company's 8028-S.
2005-09-20 Is Singapore hitting the skids as electronics hub?
Despite this city-state's loss of some manufacturing operations to cheaper destinations such as China and Malaysia, officials and analysts insist Singapore can still count on its skilled workforce, first-rate infrastructure and pro-business policies to maintain its status as an Asian electronics hub.
2006-02-02 Camtek gets $1.9M order from Taiwan
Camtek announced that it has received two orders totaling $1.9 million from a Taiwan manufacturer of advanced IC substrates.
2002-01-29 Amkor to acquire Citizen's semiconductor assembly business
Amkor Technology Inc. has signed a definitive agreement to acquire the semiconductor assembly business of Japan-based Citizen Watch Co. Ltd.
2010-07-16 AMEC announces Asia expansion plans
Advanced Micro-Fabrication Equipment Inc. has grown rapidly since 2007, as proven by the milestones achieved by the company in three years.
2006-10-02 3D interconnects transmit at 100Gbps
NEC Electronics has launched a wafer-level packaging technology that allows more than 1,000 3D interconnections between the logic and memory dice used in an image-processing system
2008-07-17 Tiny load switches control high current rails in UMPC
Micrel Inc. has launched the MIC94040/1/2/3, a new family of high side load switches featuring a breakthrough packaging technology
2005-04-07 SMIC, QQ develop telecom ICs
SMIC and QQ Technology recently signed a Memorandum of Understanding (MoU) for the joint development of high-end telecommunication ICs
2002-05-14 Pericom unveils interface solutions for DDR DIMMs
Pericom Semiconductor Corp. has unveiled its next-generation interface solution for PC2700 DDR DIMM devices used in servers, workstations, and high-end PCs
2015-02-02 Optimising BGA signal routing in PCB designs
BGA packaging technology for embedded designs is steadily advancing, but signal escape routing is difficult. Know the strategies to ensure that a product is correct in terms of form, fit and function
2006-08-22 New dice interconnects support up to 100Gbps
NEC Electronics has a wafer-level packaging technology that it says permits more than 1,000 3D interconnections between the logic and memory dice used in an image-processing system
2002-10-24 NEC ships 8-, 32-bit MCUs for automotive apps
NEC Electronics has announced the availability of new Kx1 and Fx2 series MCUs for 8- and 32-bit designs in high-end safety systems for automotive systems
2007-04-11 MOSFET chipset targets high-current DC/DCs
International Rectifier has introduced a new DirectFET MOSFET chipset for high-current DC/DC converters used in notebook, high-end desktops and servers, and advanced telecom and datacom systems
2005-11-16 Microchip beefs up PIC18F family
Microchip announced a new series from its PIC18F high-end 8-bit MCU family that has an extra serial port for expanded connectivity and a faster ADC for quicker measurement
2007-07-16 Malaysia fights to keep post in electronics race
Squeezed by low-cost giants like China and India in the manufacturing space and by R&D centers like Singapore and Taiwan at the high end, Malaysia is struggling to maintain its place as an electronics hub
2008-06-10 IBM splashes water on hot 3D chips
IBM's Zurich recently demonstrated 3D chip stacks that are cooled with water. The team predicted high-end IBM multicore computers will migrate from the copper-plate water-cooling method to the 3D chip-stack in five to 10 years
2005-07-28 Heatsinks designed for BGAs
Vette has announced the availability of its thermal solutions for ICs in ball grid array (BGA) packaging. The new BGA heatsinks target traditional high-volume motherboard, video card and networking board apps
2004-10-26 Fujitsu expands high-speed interconnect system
Fujitsu added a new packaging option to its internal microGiGaCN mezzanine connector with the introduction of a right-angle surface mount plug connector
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