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2000-09-07 Zilog Z8 MCU I/O expander module
This application note explains how ROMless mode, which is supported by the Z8 MCU family of devices, may be used without sacrificing the normal I/O function of Port0 and Port1, and without adding additional hardware complications.
2004-10-13 Zener diode arrays provide ESD protection for high speed I/O ports
CAMD unveiled what it claims as the industry's lowest capacitance families of Zener diode arrays for electrostatic discharge protection.
2008-07-24 XPLA3 I/O cell characteristics
This paper describes the features and benefits of the I/O cells provided by Xilinx CoolRunner XPLA CPLDs.
2006-12-08 Xilinx unveils Spartan-3A I/O-optimized FPGAs
Xilinx has unveiled the Spartan-3A family of I/O-optimized FPGAs that promise a cost-reduced solution for applications where I/O count and capabilities matter more than logic density.
2002-11-22 Xilinx packs more I/O into its FPGA line
Xilinx Inc. has upgraded its top-selling FPGA line by packing in more I/O pins and logic resources.
2004-12-08 Xilinx new CPLDs with two I/O banks
Xilinx recently announced two new members of its CoolRunner-II CPLD product family.
2006-12-22 Xilinx announces low-cost I/O optimized FPGAs
Xilinx recently launched Spartan-3A FPGA optimized for IO intensive applications, its latest offering of its Spartan-3 generation.
2002-04-05 WIZnet ASSP integrates I?C interface
WIZnet Inc. has announced the release of the W3100A TCP/IP hardwired chip that features data rates of up to 6Mbps and includes an I?C serial interface.
2005-03-17 Winbond to acquire National Semi's PC Super I/O business
National Semiconductor Corp. has signed a definitive agreement to sell its PC Super I/O business to Taiwan-based Winbond Electronics Corp.
2003-04-11 Winbond ships I/O chip for latest Intel offerings
Winbond Electronics has launched the W83627THF I/O chip that supports Intel's recently launched Springdale 865 and Canterwood 875 devices.
2012-03-09 Wide I/O driving 3-D with TSV
Find out how wide I/O is leading the way to through-silicon vias-based heterogeneous die stacks.
2008-02-18 Why select a I>digital power converter?
What impact, if any, is there for designers wishing to use digital power converter modules in place of existing analog designs?
2012-02-29 Why I don't buy Eyal's 40G story
Although the latest chips can handle Infiniband or Ethernet, Mellanox admits 90 percent of its sales are for use in Infiniband networks that are typically deployed in large clusters of high-performance systems for specialized apps.
2008-01-16 What would I be, if not an engineer?
Being an engineer at heart, I find that most other careers provide only portions of what I love about engineering. The truth is, I would probably find most other careers too limited in variety and challenge.
2004-08-05 Wave Tech connector accepts Type I, Type II cards
Wave Tech's CF series of surface-mount compact Flash Memory Card connectors features zinc alloy shell and accepts Type I and Type II Cards.
2011-03-28 VPX board offers wide variety I/O processing, FPGA computing
Acromag's VPX board routes power and bus signals to a plug-in XMC or PMC mezzanine module with an 8-lane PCIe interface to enable a wide variety of I/O processing and FPGA computing options.
2005-02-01 Vout DAC features I?C interface in 3-by-3mm package
Linear Tech said its 16bit I?C serial interface DAC in a 3-by-3mm DFN package can significantly reduce the size of portable products.
2008-09-03 Voltage translators target I?C apps
Fairchild Semiconductor provides designers with an I?C voltage translator that operates over a wide voltage range (1.65V to 5.5V) to accommodate the needs of I?C and low-voltage applications.
2008-03-13 VMEbus SBCs tout max I/O for embedded computing
New SBCs have been announced by GE Fanuc Intelligent Platforms to meet the increasing importance of I/O connectivity in demanding defense applications for embedded computing.
2010-03-09 Virtex-5 USB delivers 32Mbit flash, 200 user I/Os
Opal Kelly offers is the fastest FPGA USB 2.0 integration module based on Xilinx Virtex-5 FPGA and delivers 256Mbyte DDR2, 36Mbit SRAM, 32Mbit flash and up to 200 high-speed user I/Os.
2008-12-25 Virtex-5 FPGA core drives XMC I/O module
Innovative Integration has announced the X5-TX, an XMC I/O module featuring four channels of 500MSps, 16bit DAC outputs driven by a Virtex-5 FPGA computing core, DRAM and SRAM memory, and eight lane PCIe host interface.
2003-04-23 Virage adds I/O cells to complete 'silicon platform'
Virage Logic is rolling out I/O cells as the final piece of a "silicon platform" aimed at companies developing SoC products.
2009-04-30 Video streaming on the i.MX27 multimedia applications processor
This application note discusses the steps for performing digital video streaming on the i.MX27 multimedia applications processor. It also presents an overview about the usage of Gstreamer on the i.MX27 processor.
2009-03-26 Video display signals and the MAX9406 DP-HDMI/DVI level shifterPart I
This application note examines current TV and PC display cable interfaces and covers the features of RGBHV, HDMI and VGA.
2008-09-12 Video connectivity using TMDS I/O in Spartan-3A FPGAs
This application note describes a set of reference designs able to transmit and receive DVI or HDMI data streams up to 750Mbit/s using the native TMDS I/O interface featured by Spartan-3A FPGAs.
2006-03-14 Vestel selects Freescale's i.MX31 processor for PMPs
Vestel Electronics announced plans to enter the burgeoning PMP market with its own product line, driven by Freescale's i.MX31 multimedia applications processor.
2004-02-02 Vectorless test: Best bet for high-speed I/O
An approach called vectorless test is emerging that offers the best of both approaches: the cost effectiveness of on-chip I/O BIST combined with ATE-based signal integrity measurements.
2014-05-27 Utilising four-wire interface I2C on KE06
Know the procedure to use the four-wire I2C interface on KE06 of Kinetis E family. The sample code provided in this application note is tested on KE06 through I2C master/slave communication.
2008-09-01 Using the PIC devices' SSP and MSSP modules for slave I?C communication
The purpose of this application note is to provide the reader with a better understanding of the I?C protocol and to show how devices with these modules are used as a slave device on an I&178;C bus.
2005-06-17 Using the MSSP module to interface I
This app note serves as a reference for communicating with Microchip's 24XXX series serial EEPROM devices with the use of the MSSP module featured on many PIC16 family devices
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