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2003-12-26 Xilinx, IBM assure of serdes interoperability
Xilinx Inc. has announced successful interoperability testing of the IBM High Speed serdes (HSS) core with Xilinx's Virtex-II Pro 3.125 serial transceivers.
2004-06-15 Xilinx parts with IBM on 90nm chip production
Programmable logic vendor Xilinx Inc. announced that it does not plan to produce 90nm FPGAs at IBM Microelectronics, and will instead continue to rely on Taiwan's United Microelectronics Corp.
2004-02-13 Xilinx in talks with IBM to revive foundry deal
Xilinx Inc. is renegotiating a foundry agreement with IBM Microelectronics in an effort to revive a plan for Big Blue to manufacture its FPGAs.
2002-08-27 Xilinx design tool integrates IBM bus analyzer
Xilinx Inc. will begin shipment next month of the ChipScore Pro v5.1i logic debug and verification tool that features IBM's CoreConnect integrated bus analyzer cores, core insertion tools, and an analyzer interface.
2005-06-28 Work begins on Hyderabad fab, doubt cast on IBM role
A ground-breaking ceremony for Nano-Tech Silicon India Pvt. Ltd - the first major semiconductor fabrication facility to be launched in India - was held Sunday (June 26) on the outskirts of Hyderabad in southern India.
2010-07-06 WiSpry, IBM co-develop tunable RF MEMS
WiSpry Inc. and IBM are collaborating to develop MEMS process technology and manufacture its tunable RF product roadmap.
2009-04-08 What's next after IBM-Sun merger talks fizzle?
With its proposed acquisition of Sun Microsystems apparently shelved, executives at IBM are breathing a sigh of relief while Sun managers need to figure out how to survive the on-going consolidation of the computer industry accelerated by the steep recession.
2016-01-29 Western Digital acquires more than 100 patents from IBM
Patents acquired by WD are in distributed storage, object storage, and emerging non-volatile memory, allowing the company to drive value creation for the company and its customers.
2007-10-01 Wavesat, IBM develop 4G Mobile WiMAX chipsets
Wavesat and IBM have developed a high performance, power-efficient 802.16e WiMAX chipset targeting consumer electronics devices supporting advanced mobile wireless broadband services.
2008-05-14 Vietnam academic portal relies on IBM cloud computing
IBM has announced that the Vietnam Information for Science and Technology Advance Innovation Portal goes live on an IBM cloud computing infrastructure.
2007-06-27 VeriSilicon adds IBM PowerPC processors to offerings
VeriSilicon has struck a deal with IBM to offer PowerPC 405 and 440 microprocessors to its customers.
2005-05-06 Valeo, IBM to team on automotive software
Valeo, a global automotive software supplier, and IBM have announced the launch of a new initiative to expand embedded software capabilities.
2009-05-04 Update: IBM faces union ire
Sparks were expected to fly at IBM Corp.'s shareholders last week, as a union is expected to urge the company to stop cutting and offshoring U.S. jobs.
2013-06-17 UMC, IBM augment FinFET venture to 10nm
UMC will send researchers to work on the development of 10nm FinFET process technology with IBM.
2012-07-03 UMC looks to catch up with competitors with IBM deal
UMC looks to drastically improve its position with 20nm low power process with FinFET development license from IBM.
2005-02-02 U.S. to review IBM-Lenovo sale
The U.S. House of Representatives has thrown a potential monkey wrench into the $1.25 billion sale of IBM's Personal Computer Division to China's Lenovo Group.
2005-01-27 U.S. reportedly probing IBM-Lenovo deal
An interagency oversight panel concerned about industrial espionage is reportedly investigating IBM Corp.'s proposed sale of its PC operations to China's Lenovo Group Ltd.
2008-06-05 Tundra ends product acquisition, license deal with IBM
Tundra Semiconductor Corp., a leader in system interconnect, has terminated its product acquisition agreement, announced in August 2007, with IBM effective June 1.
2002-06-20 Triquint acquires assets of IBM's wireless phone chipset business
TriQuint Semiconductor Inc. has acquired a portion of the assets of IBM's wireless chipset business.
2009-06-22 Toshiba, NEC join IBM alliance at 28nm tech
NEC Electronics and Toshiba have extended technology development agreements with IBM to participate in the development of a 28nm, HKMG, low-power chip technology.
2007-12-20 Toshiba, IBM extend R&D partnership to 32nm
IBM and Toshiba Corp. have extended their collaboration by entering into a joint development agreement on 32nm CMOS process technology.
2012-04-18 Toshiba eyes IBM's POS biz
The deal that is estimated to be valued at about $870 million would expand the global reach of Toshiba's half-owned Toshiba Tec, according to reports.
2011-01-20 Toppan-IBM photomask agreement to cover 193nm immersion lithography
Toppan Printing Co. Ltd and IBM have agreed to extend their joint photomask process development efforts involving the 14nm technology node for logic devices. The companies will now collaborate on ArF immersion lithography for the 14nm node.
2008-06-23 Toppan, IBM extend photomask partnership to 22nm
Toppan Printing Co. Ltd and IBM Corp. have entered a new development agreement on the last phase of 32nm and all phases of 22nm photomask process development.
2003-05-15 Tool vendor @HDL licenses solvers from IBM
@HDL has licensed formal verification technology from IBM Corp. and plans to incorporate the technology into its current product line in the coming months.
2003-04-08 Tera Systems technology enhances IBM ASIC design flow
Tera Systems Inc. has announced that TeraForm RTL Silicon Virtual Prototype (SVP) has been integrated into the IBM Blue Logic MidRange ASIC design flow.
2004-12-21 Tektronix, IBM partner on new SiGe chips
A partnership that began in 1996 between Tektronix and IBM Corp. is just beginning to show results with a new generation of SiGe chips for high speed instruments from the test and measurement vendor.
2002-02-11 Tektronix signs agreement with IBM
Tektronix Inc. has entered into an agreement with IBM to deploy IBM's next-generation 0.18?m SiGe technology into Tektronix test instrumentation used by customers.
2013-07-01 Tektronix employs IBM's 9HP SiGe process for 70GHz scopes
IBM's latest 9HP silicon-germanium chip-making process will be used along with other advances will create oscilloscopes with bandwidth capability of 70GHz.
2007-08-22 TDK, IBM form R&D partnership on MRAM
IBM and TDK have announced an R&D partnership focused on high-capacity MRAM technology using the spin momentum transfer effect.
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