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2003-04-23 TSMC will expand test, assembly services to spur demand
In an effort to remove barriers to chip production, Taiwan Semiconductor Mfg Co. will announce an expansion of its test and assembly services and additional guidance for chipmakers on how to prevent manufacturing delays
2003-09-15 Toshiba deploys Keithley IC test system
Toshiba Corp. has selected Keithley Instruments' S630DC/RF parametric test system to support production of its new generation of semiconductors
2000-09-06 Test vector compression by RTZ/RTO formatting
This application note explains how CBIC test vectors can be compressed by changing some pin formats into RTZ (Return-To-Zero) or RTO (Return-To-One
2005-03-07 Tessolve opens IC test facility in Bangalore
Tessolve Inc. has started providing test services at its facility coming up in Bangalore, the first time an independent company has done so in India
2003-08-14 Teradyne test system to be deployed by ULi
Teradyne has announced that ULi Electronics, a developer of core logic chipsets and related host-based peripherals, has selected its Tiger test system as the characterization and production solution for their Northbridge and Southbridge PC chips
2004-03-17 Teradyne blasts U.S. export controls on test gear to China
IC test supplier Teradyne Inc. blasted new U.S export controls for China despite an effort to relax the rules on exports of automatic test equipment to China.
2004-01-16 Tackling test for next-gen WLAN RF ICs
The emerging generation of WLAN chips would accelerate the demand for more differentiated WLAN RFICs.
2002-07-19 Sorensen 600W test supply fits in 1U, half rack
The DLM 600W supply, now available from the Sorensen division of Elgar, comes in three high-voltage models.
2003-03-07 Samsung adopts Agilent smart card IC test solution
Samsung Electronics Co. Ltd has selected Agilent Technologies Inc.'s Versatest Series Model V3300 contactless smart card IC solution to test combi-smartcards for use in transportation, banking and identification applications.
2002-10-16 Passing the SoC test with flying colors
The key concern of product developers, SoC design houses and wafer fabs is to provide higher performance and functionalities of SoC at the lowest cost.
2003-06-16 OSE, Winstek collaborate for high-end IC testing
Orient Semiconductor Electronics, an IC packaging and testing firm, has partnered with IC testing firm Winstek, to increase its testing capabilities
2005-11-11 New IC test handler from Epson
Seiko Epson announced that it will begin sales of the NS-7160W, newest model of its NS-7000 series.
2008-10-30 New IC test group consolidates ATE standards
Advantest, Amkor, Infineon, Intel, LTX-Credence, Qualcomm, Roos Instruments, Teradyne, and Verigy have collaborated under a new group to foster precompetitive partnership and standards in automatic test equipment
2000-12-08 Nanosecond pulse handling techniques in IC interconnections
This application note is intended to discuss the most common, yet perhaps not well-known, pitfalls of measurement systems, a method of detecting them and possible solutions.
2006-01-26 Mentor, STARC ink IC design agreement
Mentor Graphics announced a joint development agreement with STARC, a research and development consortium co-founded by eleven major Japanese semiconductor companies.
2006-06-16 Low-power IC test can be trying
For designers, power management means controlling leakage power lost during standby mode and dynamic power consumption when multiple transistors switch in unison to perform desired functions.
2006-08-25 JFET op-amp targets semiconductor test apps
NEC Electronics has rolled out PC835, a JFET-class dual operational amplifier for IC test applications.
2002-07-24 Intel, Advantest back open test platform
Advantest Corp. is spearheading an effort to create an industrywide platform for IC test that addresses the often rocky relationship between chip suppliers and ATE providers.
2003-11-27 Intel crafts 65nm test SRAM
Using 65nm design rules, Intel Corp. announced that it has made fully functional 4Mb SRAMs with a cell size of 0.57?m.
1999-11-01 Integrating handling for test, inspection, marking and packing
Deploying individual handling systems for testing, inspection, marking and packing leads to inefficiency, under-utilization of IC test equipment, and can even cause bottlenecks that can slow down related back-end processes. Not only do multi-function automated systems circumvent these problems, they also improve throughput and occupy far less floor space.
2002-11-27 Innovative optical imaging method seen to lower IC test costs
A group of physicists led by Dr. Caesar A. Saloma of the National Institute of Physics at the University of the Philippines have developed an inexpensive optical imaging technique to detect IC defects
2003-07-30 Infineon co-establishes IC test firm in China
Infineon and China-Singapore Suzhou Industrial Park Venture have agreed to set up a joint venture company for the assembly and testing of memory ICs.
2000-11-01 Increasing IC complexity disrupts the test model
On-chip test circuitry is becoming crucial to the success of today's big designs. ATE manufacturers should beware
2002-02-08 IC test center breaks ground in Guangzhou, says MII
The Ministry of Information Industry has revealed that an IC test center with proprietary IP is being establish in Guangzhou.
2015-01-19 High-speed IC test handler offers flexible control
Aimed at smartphone makers, the NS8040SH from Epson supports additional test modes and packs sophisticated robots that reliably handle the devices under test
2012-03-28 Heterogeneous 3D IC test vehicle uses CoWoS Process
Altera claims to be the first chip company to develop and complete characterization of a heterogeneous test vehicle using TSMC's Chip-on-Wafer-on-Substrate process
2001-03-01 Embedded test complicates SoC realm
SoC devices today implement a variety of specialized microelectronic functions. Those functions, sometimes with embedded systems, typically comprise of hardware or software design objects.
2003-05-02 EDA, test vendors ponder interoperability at DATE
EDA tool vendors, test companies, and IP providers sat down at the recent DATE conference to discuss how they can better address interoperability issues
2002-05-31 Credence RF IC tester targets 802.11, 3G devices
Credence Systems Corp. has introduced the ASL 3000RF mixed-signal, RF IC test system designed to meet the test requirements of RF ICs for wireless applications, including 802.11 WLAN and 3G devices.
2007-03-16 Cooperation sparks hope for new IC test standard
With the OCI effort, the four largest EDA vendors�Cadence, Synopsys, Mentor Graphics and Magma Design Automation�were able to set politics aside and work together to come up with a solution. Maybe the time has come to take a further step.
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