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2004-12-29 TSMC verifies 90nm chips using immersion lithography tools
Taiwan Semiconductor Mfg Co. (TSMC) said that it used immersion lithography tools to produce fully functional 90nm devices.
2003-12-05 Nikon to introduce immersion scanner by 2006
Nikon Corp. said it will begin selling immersion lithography tools by 2006, joining the two other major lithography vendors, ASML and Canon.
2006-07-13 Lithography vendors unveil next-gen scanners
Top lithography vendors are coming to market with next-generation immersion scanners for the 45nm node and beyond. Many will enter the arena at this week's Semicon West trade show
2003-07-15 IBM study finds no ill effects on lithography
Researchers confirmed that early pattern imaging at IBM Corp.'s Almaden Research Center on wafers immersed in water has performed much better than expected.
2007-02-27 IBM pushes for immersion at 22nm
IBM outlined last week its lithography roadmap, saying that it would extend 193nm immersion lithography down to the 22nm node for logic production
2004-09-22 TSMC to use 193nm immersion lithography for 12-inch wafers
Taiwan Semiconductor Mfg Corp. (TSMC) will begin producing 12-inch wafers using 193nm immersion lithography by October after adopting the process to its Fab 12
2006-11-01 Tool reduces need for immersion at 45nm
Invarium Inc. offers patterning-synthesis software promising, among other things, to limit the number of advanced layers that will require immersion at 45nm. This will allow customers to get more mileage out of existing lithography equipment
2006-09-20 Tool limits need for immersion lithography at 45nm
Invarium will roll out new patterning-synthesis software this week, promising, among other things, to limit the number of advanced layers that will require immersion at 45nm
2004-07-09 Sematech to open R&D center for immersion lithography
International Sematech on Tuesday (July 6, 2004) announced the formation of an R&D center to develop and push immersion lithography into the marketplace
2010-04-07 Quest for the right road to lithography
The industry has long known that without a viable NGL solutionwhich most assumed would be EUVMoore's Law scaling would slow and the secular growth rate of the IC industry would decline.
2003-09-11 Modeling tools aid in immersion litho quest
A German company is fielding modeling tools that can help chip makers assess the promise of immersion lithography.
2006-08-01 Lithography efforts trailing 32nm target
The chip industry is enjoying a short reprieve as immersion lithography continues Moore's Law of scaling for the next few years. But for chips with a 32nm half-pitch, lithographers are counting on either extreme ultraviolet or immersion 193nm scanners enhanced with high-index fluids
2011-11-22 Issues of EUV lithography
Chip makers need EUV to be ready well in advance of when they plan to use it in volume manufacturing so they can establish chip design rules and tweak their manufacturing processes.
2006-02-24 Immersion lithography 'nearly ready,' says TSMC
Taiwan Semiconductor Manufacturing Co. Ltd said that immersion lithography is "nearly production ready
2004-09-16 Immersion effort looks to new crystals, liquids
Pushing 'wet' 193nm lithography to 45nm half-pitch takes more than water, experts say
2013-02-08 IBM: EUV lithography not ready until 7nm node
IBM warns that EUV lithography will not be ready until the 7nm node but Globalfoundries and Samsung say they are on track to offer 14nm FinFET manufacturing by 2014
2005-08-16 ASML debuts hyper NA immersion
The XT1700i is ASML's answer to Nikon's efforts in the hyper numerical aperture market.
2010-02-24 Intel extends immersion litho to 11nm, delays EUV
Intel Corp.'s lithography roadmap plans to extend its 193nm immersion to the 11nm logic node and delay extreme ultraviolet (EUV)again
2013-10-09 IMEC, ASML collaborate to optimise lithography systems
The joint effort between IMEC and ASML will research ways immersion and EUV lithography systems can automatically adjust parameters to maintain an optimal process window
2006-12-07 ASML, TEL team on advanced litho tools
Tokyo Electron and ASML Holding NV are joining forces to develop next generation R&D and manufacturing tools
2007-02-01 Logic chipmakers seek 32nm breakthroughs
Even as they put the finishing touches on their 45nm process technologies and tweak them for low power, leading-edge logic chipmakers are scrambling to find manufacturing breakthroughs for the 32nm node and beyond.
2008-07-16 Litho options falling behind process needs
Who killed high-index lithography, and was politics the cause? These questions remain for chipmakers looking for a route to next-gen manufacturing in a shifting lithography landscape
2010-04-28 EUV light source achieves 104W output
Japan's Extreme Ultraviolet Lithography System Development Association (EUVA) claims to have achieved the highest output for EUV light source at 104W
2008-07-22 EUV delays drive shift to double-patterning
With the probable delays for EUV lithography, ASML, Canon and Nikon are racing each other to capitalize on the shift towards double-patterning technology at the 32nm node and beyond
2010-01-27 Analyst: Is Moore's Law slowing down?
An analyst cited that the 450mm fabs and extreme ultraviolet (EUV) lithography delays may be a possible sign that Moore's Law is in danger of slowing down
2009-04-28 'First' 22nm SRAM cells from EUV litho debut
IMEC has presented what it claims is to be the first functional 22nm CMOS SRAM cells made using extreme UV (EUV) lithography. The SRAM cells are made with FinFETs and have both the contact and metal-1 layer printed using a full-field EUV alpha demo tool from ASML
2012-04-20 TSMC shifts from multiple to single-only process at 20nm
Shang-yi Chiang, EVP at TSMC, said the firm might also offer an 18nm or 16nm process node after 20nm if lithography technology is not available to make 14-nm devices cost effectively
2014-12-09 TSMC guns for 7nm with EUV scanners
ASML said on November 24 that TSMC has ordered two NXE:3350B EUV systems for delivery in 2015 with the intention to use the systems in production.
2013-04-15 TSMC FinFET production set in 2013
Company executives detailed the new processes and how they aim to get there and also gave an update on 3D chip stacks and their on-going ramp of today's 28nm process node.
2009-03-03 TSMC details litho roadmap, taps maskless
Taiwan Semiconductor Manufacturing Co. Ltd has detailed it lithography roadmap and said it is still backing maskless technology at the SPIE Advanced Lithography conference
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