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2006-12-11 SeaSolve, NI ink WiMAX collaboration in India
SeaSolve Software and National Instruments announced a partnership wherein the two companies will provide the hardware and software required for efficient testing, analysis and troubleshooting of fixed and mobile WiMAX stations and chipsets.
2010-06-08 Saxony, Abu Dhabi ink microelectronics R&D MOU
The German state of Saxony and Abu Dhabi's Executive Affairs Authority have signed an MOU to set up opportunities to share and exchange knowledge in microelectronics
2007-01-22 Sanyo, Hoku ink polysilicon deal
Hoku Materials, a division of Hoku Scientific Inc., has signed a polysilicon supply agreement with Japanese solar cell maker Sanyo Electric Co. Ltd.
2002-01-22 Sanyo Electric, Samsung ink MOA on fuel-cell technology
Sanyo Electric Co. Ltd and Samsung Advanced Institute of Technology have entered into a memorandum of agreement for the development of fuel-cell technology.
2009-06-01 SanDisk, Samsung ink flash license, supply deals
SanDisk Corp. and Samsung Electronics Co. Ltd have agreed to cross-license their flash memory semiconductor portfolios.
2007-07-03 SanDisk, Ritek settle dispute, ink license pact
SanDisk and Ritek have settled their patent litigations and entered into a royalty-bearing patent cross-license agreement.
2002-07-08 SanDisk, Lead Data ink memory card license patent deal
SanDisk Corp. and Lead Data Inc. have entered into a patent cross-license agreement for SanDisk's Flash memory card patents.
2007-03-23 SanDisk, Hynix ink NAND joint venture project
SanDisk Corp. and Hynix Semiconductor Inc. are planning a joint venture to develop flash memories and NAND memory systems based on four-bit-per-cell x4 flash technology.
2002-12-04 SAMSys, VerdaSee ink VAR deal
SAMSys Technologies Inc. has signed a value-added reseller agreement with RFID total solutions provider VerdaSee Solutions Inc.
2007-12-05 Samsung, Toshiba ink reciprocal deal on premium NAND flash
Samsung Electronics and Toshiba are sharing with one another the rights to produce, market and sell memory with the specifications and trademarks of Samsung's OneNANDTM and Toshiba' LBA-NANDTM memory chips.
2007-04-23 Samsung, Microsoft ink patent licensing pact
Samsung Electronics and Microsoft have entered into a broad patent cross licensing agreement to accelerate their respective product development efforts.
2007-07-11 Samsung, LM Ericsson ink patent cross-license deal
Samsung Electronics announced it has sealed a patent cross-license deal with Swedish wireless network maker LM Ericsson.
2007-08-10 Samsung, Denali ink simulation pact
Denali Software said it has become the exclusive commercial provider of simulation models for memory devices made by Samsung Electronics Company.
2006-09-14 Saifun, Tower Semi ink NROM agreement
Saifun and Tower Semi have signed a new agreement whereby Saifun extends the license of the Saifun NROM technology to Tower for the manufacture of embedded flash end Embedded EEPROM products.
2011-05-19 Russia, Crocus ink $300M MRAM production deal
Under the $300 million deal signed with Rusnano, Crocus will set up a Russian joint venture to manufacture ICs for MRAM using 90nm process technology.
2010-02-02 ROHM, MoSys ink 1T-SRAM license deal
MoSys Inc. announced that ROHM Co. Ltd has signed a major technology license agreement for MoSys' 1T-SRAM embedded memory technology.
2003-11-06 Rittal, Avnet Applied ink computing solutions alliance
Avnet Applied Computing Solutions, a division of Avnet Inc., has entered into a new alliance with Rittal Corp., a provider of electronic packaging products and enclosures.
2007-08-15 RFMD, Sirenza ink merger agreement
RFMD and Sirenza announced they have signed a definitive merger agreement.
2010-12-29 Rambus, Renesas ink logic integrated circuits licensing deal
Rambus Inc. and Renesas Electronics renewed their patent license agreement covering logic integrated circuits for a period of five years.
2010-08-17 Rambus, NVIDIA ink patent agreement
Rambus Inc. and NVIDIA announced the formal signing of a patent license agreement involving memory controllers.
2005-04-19 Rambus, NEC ink memory controller patent license deal
Rambus Inc. has signed a patent license agreement with NEC Electronics Corp. that follows the development and manufacture of memory controllers based on various Rambus innovations.
2006-01-05 Rambus, AMD ink patent licensing deal
Advanced Micro Devices is paying $75M over the next five years to use a range of Rambus technologies in a deal that specifically excludes AMD using the patents to manufacture Rambus-designed memory chips.
2010-03-15 Ralink, TrendChip ink merger deal
Ralink Technology Corp. and TrendChip Technologies Corp. have entered a merger agreement to create a technology leader in the home networking and broadband access semiconductor markets.
2006-06-13 Quantum3D, Radstone ink IDE agreement
Quantum3D and Radstone Embedded Computing announced an agreement to have Quantum's IData graphical interface development environment and tools available across the range of Radstone's graphics processors.
2004-05-04 Qualcomm, Techfaith ink CDMA modem card license pact
Qualcomm Inc. and Techfaith Wireless Communication Technology Ltd have signed a CDMA modem card license agreement.
2006-02-06 Qualcomm, SIM Tech ink modem card license agreement
Qualcomm and SIM Technology Group announced that they have entered into a commercial modem card license agreement.
2007-07-25 Qualcomm, Korean firm ink FLO chip deal
Qualcomm and Telechips have signed a royalty-free agreement that enables Telechips to use Qualcomm's patented technologies to design, manufacture and sell certain IC chip products that implement FLO technology.
2006-09-27 Qualcomm, India's HCL ink 3G CDMA license agreement
Qualcomm and Himachal Futuristic Communications have signed a commercial CDMA2000 subscriber unit and modem card license agreement.
2008-02-06 Qualcomm, Huawei ink Node B tech transfer deal
Qualcomm and Huawei Technologies have signed a technology transfer agreement for advanced Node B (base station) receiver design that can benefit all UMTS systems, Release 99 and onwards.
2006-09-20 Qualcomm, Continental ink CDMA2000 license agreement
Qualcomm and Continental have entered into a CDMA2000 telematics module license agreement.
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