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2003-12-05 Intel and MCI ink services deal
Intel Corp. signed an unusual joint marketing deal with MCI, formally still incorporated as WorldCom.
2004-05-14 inSilica, GDA ink Gigabit IP license deal
inSilica Inc. and GDA Technologies Inc. have signed a license agreement for 10 Gigabit (XGEMAC) and 1 Gigabit Ethernet MAC IP cores.
2014-07-11 Ink promises shapely future for electronics
Japanese researchers developed an ink that allows charge transfer in order to facilitate printing at room temperature. This broadens options for flexible plastics that can be used to print semiconductor devices.
2005-03-24 Infineon, Rambus settle patent dispute, ink licensing pact
Infineon Technologies AG and Rambus have reached an agreement settling all claims between them and licensing the Rambus patent portfolio for use in current and future Infineon products.
2002-03-12 Infineon, NewLogic ink cross-licensing, multi-technology pact
Infineon Technologies AG and NewLogic Technologies AG have signed a cross-licensing and multi-technology agreement encompassing Infineon's and NewLogic's WLAN IP
2002-11-19 Infineon, Nanya ink DRAM joint venture
Infineon Technologies and Nanya Technology Corp. have signed final contracts concerning a strategic cooperation on standard memory chips.
2009-04-22 Infineon, Ident ink license deal for game consoles
Ident Technology has signed up Infineon Technologies AG as a license partner from the semiconductor industry.
2009-03-23 Infineon, Huawei ink framework purchase agreement
Infineon Technologies AG has signed a letter of intent for framework purchase agreement amounting $68 million with China's Huawei Technologies Co. Ltd. This deal is intended to supply end-to-end chip solutions to Huawei's wireline and wireless communication systems.
2006-08-03 Infineon and subsidiary ink licensing agreement with Tessera
Infineon Technologies and its subsidiary Qimonda announced the conclusion of license agreements with Tessera.
2005-08-26 India, Japan ink pact for R&D, JVs
India and Japan have signed three agreements during a ministerial forum to identify possible joint ventures and stand-alone projects in broadband, mobile communication, information security, R&D and ubiquitous computing.
2008-09-24 Improved tech to bring e-ink display mainstream
The original designer of the e-paper display for Sony's eBook and Amazon.com's Kindle model offers an improved technology for its own third-generation iRex 1000 digital reader.
2008-10-30 Immersion, Samsung ink TouchSense license pact
Immersion Corp. reveals that Samsung Electronics Co. Ltd has signed a worldwide license for its TouchSense technology for digital audio devices.
2006-04-27 IMI, BuS Elektronik ink strategic alliance
Philippine-based EMS provider Integrated Microelectronics Inc. has formed a strategic alliance with BuS Elektronik, an EMS company based in Riesa, Germany.
2006-03-08 IDT, KTI ink AMD collaboration
IDT disclosed its collaboration with King Tiger Technology. Based on terms of the alliance, KTI will use IDT's AMB production device as a benchmark to develop full-featured, FB-DIMM manufacturing testing on its KT-2Pro test system.
2008-05-21 IAR, Renesas ink development deal on RX MCU tools
IAR Systems has signed an agreement with Renesas Technology Corp. to develop a range of software tools and commercial software for the new Renesas RX MCU family.
2004-02-25 Hynix, ProMOS ink memory development pact
Hynix Semiconductor and ProMOS Technologies have signed a MoU to initiate a long term strategic alliance in technology licensing.
2007-10-02 Hynix, Ovonyx ink PRAM cross-licensing deal
Hynix Semiconductor has entered into a cross-licensing deal with Ovonyx to develop PRAM chips using the latter's patented technology.
2007-04-18 Hua Hong NEC, Cypress ink embedded NVM licensing pact
Hua Hong NEC Electronics Co. Ltd and Cypress Semiconductor Corp. have signed an agreement whereby Cypress will license its 0.13?m SONOS embedded nonvolatile memory technology to Hua Hong NEC.
2007-11-28 Hoku, Solarfun ink 8-year polysilicon supply agreement
Hoku Scientific and Solarfun Power Hong Kong have signed a definitive contract for Hoku's sale and delivery of polysilicon to Solarfun over an eight-year period beginning in mid-2009.
2005-12-22 Hoku Scientific, Sanyo ink fuel cell testing pact
Hoku Scientific, a developer of membrane electrode assemblies and non-fluorinated membranes, has entered into a testing agreement with Sanyo Electric.
2009-08-11 HKSTP, IBM ink PowerPC IP core tie-up
Hong Kong Science and Technology Parks Corp. (HKSTP) and IBM Corp. have signed an agreement to make the latter's PowerPC SoC IP available through HKSTP's new Secure Virtual IP Chamber.
2008-06-04 HKSTP, Canada government ink deal on tech biz
Hong Kong Science and Technology Parks Corp. and The Ministry of Advanced Education and Technology of the government of Alberta, Canada have signed a memorandum of understanding to help firms from Alberta find an easier path to Hong Kong and China's expanding markets.
2015-01-23 Hitachi, Johnson Controls ink global HVAC joint venture
The Johnson Controls-Hitachi joint venture will allow both companies to deliver the most diverse technology portfolio in the heating, ventilation, air conditioning and refrigeration industry.
2005-09-14 Groups ink licensing deals for ZigBee apps
Wireless networking groups Sensicast Systems and Software Technologies Group have agreed a cross licensing deal covering developments in Zigbee compliant devices.
2011-12-05 Graphene ink-jet printing targets flexible electronics
Researchers from the University of Cambridge used the N-methylpyrrolidone as a low-cost way to print thin-film transistors for transparent electronics.
2009-03-24 Gennum, Tundra ink acquisition agreement
Gennum Corp. and Tundra Semiconductor Corp. have entered into a definitive agreement providing for the acquisition by Gennum of all of the issued and outstanding shares of Tundra.
2003-12-11 Gemplus, Bell ID ink reseller agreement
Gemplus Int. S.A., a provider of smart card solutions, has entered into a global reseller agreement with Bell ID, the designer and supplier of ANDiS smart card management technology and a subsidiary of London-based Bell Group plc.
2008-08-08 Fujitsu-TSTT, Trinidad gov't ink multimillion-dollar contract
Getting Trinidad and Tobago to reach a developed nation status is set upon completion of a multimillion dollar contract awarded jointly to Fujitsu and Telecommunications Services of Trinidad and Tobago.
2006-09-11 Fujitsu, Hopling ink WiMAX SoC agreement
Fujitsu and Hopling Technologies have signed an MoU on the mutual goal of enabling faster and smoother integration of the WiMAX baseband SoC into a Linux-based wireless equipment environment.
2003-11-12 Fuji Electric, Siemens ink process automation agreement
Fuji Electric Systems Co. Ltd and Siemens Automation and Drives have signed a joint cooperation for the process automation business.
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