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2003-09-17 u?t Photonics photoreceivers use Inphi amps
u?t Photonics AG has developed with Inphi Corp. two differential pin-TIA photoreceivers for SONET OC-768/SDH STM-256 fiber optic networks.
2002-09-11 Inphi, u2t develop 40Gbps photoreceiver
The XPRV2021 40Gbps photoreceiver combines Inphi Corp.'s 4334TA TIA and u2t Photonics AG's waveguide-integrated pin photodiode into an SMD package ready for integration into OC-768 communication systems.
2005-12-20 Inphi tapes out high-speed chip with Cadence platform
Cadence announced that Inphi has successfully taped out a complex high-speed chip using the Cadence Encounter digital IC design platform.
2002-07-26 Inphi RZ converter exhibits <1ps jitter
The 13705RZ NRZ to RZ support data rates of 12.5Gbps and exhibits a typical jitter of <1ps.
2003-12-05 Inphi logic ICs come in QFN plastic packages
Inphi Corp. has released a low-cost QFN plastic package version of its 13GHz high-speed digital logic devices with a 3mm? small form factor package.
2003-08-20 Inphi logic devices offer 13Gbps, 20Gbps
Inphi Corp. has introduced two high-speed digital logic devices for serial data transmission systems and broadband test and measurement equipment.
2003-09-01 Inphi ICs suit broadband test systems
Inphi Corp. has released eight high-performance ICs that are targeted for use in broadband test and measurement applications.
2013-09-18 Inphi debuts JEDEC .95 compliant DDR4 register
The Inphi iDDR4RCD-GS02 register supports up to DDR4-2666 memory and provides up to 20 per cent lower operating and idle power as compared to the current DDR3 generation at the same speed.
2003-05-06 Inphi amps consume up to 100mW
Integrated transimpedance/limiting amplifiers from Inphi Corp. target 10GbEs, SONET/SDH modules, and broadband instrumentation systems.
2002-05-10 Inphi 40Gbps TIAs suitable for OC-768 apps
The 4330TA, 4332TA, and 5030TA transimpedance amplifiers from Inphi Corp. achieve transmission speed of 40Gbps and are suitable for integration into SONET OC-768 and SDH STM-256 optical receivers.
2004-12-20 Cadence makes 'strategic' investment in Inphi
Cadence Design Systems has made a strategic investment in communications IC specialist Inphi Corp., participating in the latest funding round that raised $18 million.
2006-03-20 TIA technology enhances optical receiver performance
Inphi claims their integrated linear TIAs can operate at data rates up to 11.3Gbps.
2006-04-24 THAs target UWB apps
Inphi claims to have set a new industry standard with the launch of its GigaTrack family of 2GSps track-and-hold amplifiers that deliver ultra-wide 18GHz analog bandwidth.
2005-10-20 New FB-DIMM features low size, latency and power consumption
The IN581AMB fully-buffered DIMM from Inphi is said to be the first device that includes an interface between the high-speed serial interface and DDR2 SDRAM and is fully compliant with the JEDEC AMB specs.
2005-10-20 Differential amps span DC to 10GHz
Inphi announced three new differential amplifiers developed specifically to meet the challenges encountered in designing broadband test and measurement equipment, ATE and a wide range of aerospace and military apps
2005-05-03 Buffer's parity checking exceeds DDR2-800 rates
Inphi has developed the first DDR2 (double data rate) configurable registered buffer with parity checking operating at 800Mbps.
2006-07-17 Buffer line handles all DDR2 speeds
A line of configurable, registered memory buffers developed by Inphi Corp. lets designers cover all DDR2 speed grade requirements with just a single chip.
2011-09-22 Transimpedance amp designed for 100GbE
Inphi's IN2841TA can support data rates up to 28Gbit/s and touts a wide input dynamic range.
2006-02-13 Mux combines low jitter and high bit rate
Touting true operation from DC to 20GHz, Inphi's 4:1 broadband multiplexer was designed for accurate testing across a wide range of frequencies and applications.
2010-02-01 JEDEC-compatible memory enables LRDIMMs
Inphi Corp. has introduced what it claims to be the first JEDEC-compatible memory buffer delivering more than 4x the memory capacity and nearly double the bandwidth, while reducing power consumption.
2008-08-25 Improved clock driver responds to DDR3 server needs
Inphi offers a JEDEC-compliant DDR3 registered clock driver to support DDR3-1600 data rates at 1.35V, 5 percent. This new registering clock driver enables quad-rank support for enhanced capacity in server memory.
2008-05-07 DDR3 registered clock driver exceeds JESD47 spec
Inphi Corp. announced that its registered clock driver has passed validation, qualification and manufacturing readiness testing compliant to industry standard qualification requirements as defined by JEDEC Standard JESD47.
2007-09-27 DDR3 configurable buffer exceeds JEDEC specs
Inphi has introduced the INSSTE32882-GS02, a DDR3 configurable integrated register that exceeds JEDEC requirements and adds quad rank support.
2008-02-26 Chip takes place of three in XFP modules
A single-chip solution featuring 10Gbit/s dual Clock Data Recovery with Electronic Dispersion Compensation Engine for use in 10GBASE-LRM XFP modules has been announced by Inphi Corp.
2009-01-22 BER reference design rolls for 100G Ethernet testing
Inphi Corp. has launched a 28G Bit Error Ratio (BER) Receiver reference design for R&D or production testing of emerging high speed protocols.
2007-07-31 Tech extending Opteron systems' memory footprint underway
AMD is working with IC makers to develop a technology that's expected to extend the total memory footprint in future Opteron processor-based systems.
2014-10-10 Specs available for 400Gb/s interoperable hot pluggable modules
Aimed at resource-hungry applications in telco, networking and enterprise computing environments, the CDFP interface enables 25Gb/s over 16 lanes for an aggregate of 400Gb/s on a single module.
2014-02-12 SNIA facilitates quick adoption of NVDIMM
A memory module that combines a volatile DRAM and non-volatile flash allows transfer of data within the DRAM to the flash during a power failure, and back when normal conditions resume.
2012-10-08 Samsung plans Silicon Valley innovation centre
Samsung Electronics is planning to open several innovation centres outside South Korea as part of a project to reinvent the company and catch the next wave of business opportunities.
2014-06-10 Samsung joins medical, fitness wearables race
Samsung gave a preview of a multi-function bracelet that is meant to accommodate a wide array of fitness and medical sensors. The Simband platform integrates Imec's sensing technologies to measure ECGs, bio-impedance, skin temperature, acceleration, and more.
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