Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > insulator

insulator Search results

?
?
total search554 articles
2009-01-06 Top 15 challenges to conquer for 22nm
What are the big challenges involved at the 22nm node?
2005-01-17 Tokyo group makes transparent transistors manufacturable
Now, a group at the Tokyo Institute of Technology claims to have solved these problems at room temperature by adding gallium and indium to ZnO, opening the gates to mass-production of transparent circuitry using industry-friendly sputtering, and at temperatures low enough for direct deposition on cheap, flexible polymers.
2008-08-04 Tiny audio connectors withstand extreme outdoor use
ITT has developed a miniature audio connector solution. The circular device features quick one-touch connect/disconnect and allows withstanding extreme field use.
2004-05-19 TI rolls out IC controller, PoE power module
Texas Instruments Inc. has launched an IC controller and a Power-over-Ethernet (PoE) plug-in power module that reduces design time and eases implementation of Ethernet-powered industrial and commercial devices.
2011-03-08 TI perfects graphene growth methods
TI is perfecting large-domain graphene growth in hopes that new methods would lead engineers to further increase the size of the single crystal graphene and improve graphene's electrical characteristics.
2004-01-14 TI hot swap controllers have power limiting feature
Texas Instruments has disclosed that its TPS2490 and TPS2491 are the industry?s first hot swap power managers to feature programmable power limit functions.
2011-10-14 The move toward 3D chips
Semiconductor fabrication is moving toward 3D ICs and by next year, 3D chips will be available for commercialization.
2012-10-23 TCAD eases FinFET design and variability analysis
FinFET is the first fundamental change in transistor architecture since the time MOSFET replaced bipolar transistor as the transistor of choice for logic applications.
2014-04-08 Taking a closer look at 20nm bulk CMOS
Foundry vendors planned to migrate to 16/14nm FinFETs rather than 20nm bulk CMOS, but the reality of FinFETs is that the present device structures do not give cost competitive products through 4Q17.
2004-10-08 Taiwan's Via to enter 64-bit processor market
During the Microprocessor Forum here on Tuesday (Oct. 5), Taiwan's Via Technologies Inc. disclosed plans to enter the x86-based, 64bit processor market.
2015-11-11 Synopsys, GlobalFoundries team up for 22nm FD-SOI sol'n
The Synopsys Galaxy Design Platform, enabled for the GlobalFoundries' 22FDX platform, claims to offer FinFET-like performance and energy-efficiency at a cost comparable to 28nm planar technologies.
2006-06-02 Symposium to mull 45nm challenges
Technologists attending the 2006 Symposium on VLSI Technology in mid-June will hear about multiple facets of 45nm processes
2016-04-11 SuVolta: The demise of the promising start-up
SuVolta said it was going after opportunities in mobile processors, DRAM and IoT but was probably not helped by the fact that the Japanese semiconductor industry was experiencing its own turmoil.
2013-09-06 Suvolta enlists Fujitsu for image processor IC production
SuVolta's MB86S22AA Milbeaut image processor IC includes an ARM Cortex-A5MP and is capable of performing lens distortion and lens resolution correction at a rate of 12 fps across 24 megapixels.
2012-09-06 Suntech Power, Hanwha Solar sign collaborative research deal
An advanced processing technology being pioneered at UNSW to improve the efficiency of first generation silicon solar cells has the competing solar makers into unlikely collaborators.
2005-09-27 Strained silicon to take IEDM spotlight
With high-k dielectrics apparently delayed beyond the 45nm node, this year's International Electron Devices Meeting will focus on second-generation strained-silicon techniques as the main pathway to faster transistors.
2004-12-21 STMicro has full 65nm IC, offers 65nm design platform
STMicroelectronics said Dec. 16 that it has completed the design, and tape-out, of a complex IC that demonstrates its 65nm manufacturing process technology.
2002-12-26 Startup taps digital holography for wafer inspection
A metrology startup is pitching the use of digital holography to peer into the narrow and deep spaces, such as contacts and trench capacitors, on semiconductor wafers.
2014-07-31 Start-up bares gas sensors for mobiles
The sensors employ tungsten MOSFET heaters embedded in an SOI membrane, which form a micro-hotplate that heats the sensing material, allowing it to react with gas molecules.
2013-12-05 Stanford team says stanene may be better than graphene
The new material, according to the researchers, conduct electricity on next-generation microchips with "100 percent efficiency" at room temperature and above.
2013-11-08 ST, Memoir Systems combine memory, process tech
When integrated into products made using ST's FD-SOI, Memoir's Algorithmic Memories claim to deliver uncompromised performance as a result of FD-SOI's recognised power and performance advantages.
2013-02-22 ST's FDSOI process churns out 3GHz processor engines
The 28nm version of STMicroelectronics' process has produced application processor "engines" that are capable of operating at clock frequencies in excess of 3GHz.
2004-12-22 ST unveils 65nm CMOS design platform
ST's 65nm CMOS design platform will allow designers and customers to start developing next-gen SoCs for low-power, wireless, networking and consumer apps.
2013-03-20 ST takes 2G and 3G, Ericsson gets LTE modem
CEO Carlo Bozotti promised support for existing products and customers of ST-Ericsson but has revealed STMicroelectronics is wary of an increasingly vertically-integrated mobile devices market.
2012-12-13 ST ready to roll out 28nm FDSOI
ST boasted that the FDSOI planar process holds advantages over other manufacturing process variants in terms of trade-offs between performance, power consumption and manufacturability.
2010-06-09 ST readies 20nm tape out in 2012
STMicroelectronics NV chief technology officer Jean-Marc Chery announced the company will be ready to tape out designs using a 20nm CMOS low-power (LP) process technology in Q4 2012.
2014-04-30 ST pares R&D, centres on embedded processing
The Swiss chipmaker's first quarter results showed a 0.7 per cent year-over-year revenue improvement, driven by its joint-venture exit and operating expenses adjustments. ST CEO Carlo Bozotti said the company will move forward with a focus on embedded processing solutions.
2014-05-16 ST finds FD-SOI partner in Samsung
Samsung will work with ST's 28nm FD-SOI design platform, making its foundry services accessible to the broader semiconductor industry. The companies hope their partnership will encourage designers to adopt the process.
2013-01-23 ST closes in on FDSOI deal with Globalfoundries
ST claims that at 28 nm, its FDSOI process can provide 30 per cent more performance than bulk 28nm CMOS at the same power consumption.
2013-05-20 ST bags design wins for 28nm FDSOI
ST has claimed three design wins for its FDSOI manufacturing process, a move that could draw out support from EDA software and IP providers.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top