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2011-01-26 SrTiO3 offers multifunction possibilities
Researchers have found a way to create a conductive layer on the surface of strontium titanate that offers the possibility of enabling different functions on a single microelectronic device.
2003-10-30 Spire method obtains U.S. patent
Spire Corp. announced that they have secured a U.S. Patent on a method for implanting aluminum oxide in GaAs and other III-V semiconductor wafers.
2004-03-03 Spin valves open organic chip era
A research technique for making organic spin-valve electronics could herald the coming of nonvolatile semiconductors melded with optical emitters, transducers and sensors.
2011-03-14 Spin torque used to write info on memory devices
Researchers are exploring new magnetic devices that can write information using a spin torque instead of magnetic fields. They hope the study would pave the way for better non-volatile memory devices.
2008-06-30 Space project pushes Microchip engineers to extreme
What started out as an innocent call about their company's line of MCUs, locked a small cadre of Microchip Technology Inc. engineers into a multiyear, space-based design project that would push the boundaries of their professional knowledge and flexibility.
2004-05-26 Sony's 300mm fab starts test production of Cell processor
Sony Corp.'s Nagasaki 300mm fab has begun test production of Cell processors, Ken Kutaragi, Sony's executive deputy president and COO, acknowledged this week. He declined to elaborate.
2004-07-01 SONET CMOS transceiver hits 10Gbps
Xignal develops a single-chip full-rate 4:1 Serdes chip consuming <1W in a standard 0.13?m CMOS technology.
2013-07-09 Solar panels get a splash of colour
Together with a Fraunhofer team and scientists from the Friedrich-Schiller University in Jena, optics specialists are looking to increase the efficiency of solar panels and their design flexibility.
2013-11-28 Soitec, SunEdison sign patent license deal
The agreement provides each company with access to the other's patent portfolio for SOI technologies and ends all outstanding legal disputes between the companies.
2003-11-26 Soitec, KLA-Tencor team to enhance SOI wafer technology
Soitec and KLA-Tencor have announced a joint program aimed to improve the quality and cost of production of SOI wafers used in low-power consumption IC apps.
2003-12-03 Soitec upgrades equipment from SOI wafer production
Soitec announced that it is expanding its manufacturing capabilities to ensure broad industrial availability of strained SOI wafers.
2006-08-30 Soitec launches new 300mm fab in Singapore
SOI wafer supplier Soitec has started work on a new 300mm fab at Singapore. According to Soitec CEO Andre-Jacques Auberton-Herve, this new fab will play a key role in the company's growth strategy.
2003-04-04 Soitec acquires assets of France-based Picogiga
Soitec SA has acquired the assets of epitaxial wafer supplier Picogiga.
2008-07-21 SOI Industry Consortium welcomes Nvidia
Nvidia is the newest member of the SOI Industry Consortium.
2005-08-19 Soaring tool costs to delay 450mm fabs
Soaring IC-equipment development costs could push out the appearance of next-generation 450mm wafer fabs to between 2020 and 2025a delay of more than a decade from its current schedule, warned an analyst at VLSI Research Inc
2005-08-22 Soaring tool costs to delay 450mm fabs
Soaring IC-equipment development costs could push out the appearance of next-generation 450mm wafer fabs to between 2020 and 2025 ? a delay of more than a decade from its current schedule, warned an analyst at VLSI Research Inc
2006-08-29 SMT connectors suit 1.27mm board stacking apps
The B2B high-density SMT connectors from Advanced Interconnections are designed for 1.27mm pitch surface-mount board stacking applications.
2002-10-30 SMIC moves carefully towards 90nm development
Semiconductor Mfg Int. Corp. is gathering the tools it needs, including a 193nm scanner, to boost efficiency as it enters into 130nm manufacturing and prepares to begin basic development work for 90nm technology.
2011-05-18 Single-layer sensor delivers lower-cost capacitive touchscreens
Cypress has created proprietary algorithms that interface with a true single-layer sensor without bridges to deliver two-layer performance, enabling mobile device makers to save 30 percent on sensor costs.
2012-07-31 Simulation reveals double battery life thru FinFETs-on-SOI
Gold Standard Simulations performed TCAD simulations where fully depleted FinFET style transistors made on SOI wafers allowed between half and one-third the leakage current of FinFETs made on bulk silicon.
2003-03-12 Silicon Wave unveils Bluetooth radio processor
Silicon Wave has started sampling its single chip CMOS Bluetooth radio processor that is targeted for portable and cellphone apps.
2010-09-06 Silicon ReRAM beats graphene, say Rice researchers
Rice University researchers demonstrated a proof-of-concept 1Kb silicon ReRAM that they claim can be scaled beyond the densities of flash.
2008-02-29 Silicon photonics move to rule networks
Developments in silicon photonics have moved the technology into the mainstream, according to presenters at the 2008 Optical Fiber Communication Conference and Exposition.
2002-10-25 Sharp, SEL integrate processor into system-on-glass device
Sharp Corp. and Semiconductor Energy Laboratory Co. Ltd have integrated an 8-bit Z80 processor onto a glass substrate with an LCD.
2008-12-29 Shanghai clears way for AMD's 45nm shift
AMD moves to the 45nm technology node with the launch of its new Opteron server chip, code-named Shanghai.
2005-03-16 Semiconductor aerogels advance sensors
A university research team creates a variety of semiconducting aerogels to replace the common oxides used in ICs.
2012-04-23 Semicon derivative of graphene revealed
Researchers at UWM produced a derivative with oxygen atoms included within the hexagonal carbon-ring structure that characterizes graphene, which they are calling graphene monoxide.
2014-04-10 Self-cooling chips operate up to 300°C
A team at Fraunhofer IMS developed a type of high-temperature process that allows the fabrication of compact microchips that can keep their cool even at 300°C.
2002-02-12 Scaling debate stalks chip conference
From the wide range of panels and tutorials at the International Solid-State Circuits Conference, from the myriad papers, from the conversations in the hotel halls, a single gnawing issue grew from hints and whispers to a groundswell of concern: Will IC technology continue to scale?
2004-05-07 Scaling dead at 130nm, says IBM technologist
The traditional scaling of semiconductor manufacturing processes died somewhere between the 130nm and 90nm nodes, Bernie Meyerson, IBM's CTO, told an industry forum.
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