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2004-05-07 Peregrine DSAs impress with IP3 spec
Peregrine has introduced a family of Digital Step Attenuators that demonstrate new levels of broadband linearity, attenuation accuracy, and programming flexibility.
2009-06-12 Passive mixer tailored for UHF-900MHz devices
Peregrine Semiconductor Corp. has released the 50? PE4150 quad MOSFET core device, designed for mixer designs requiring low conversion loss and high linearity.
2009-01-28 Passive equalizers augment transmission performance
The new series of CH6000 passive equalizer devices were designed to enhance performance of high data-rate transmission media. These new devices are ideally suited for HDMI, DisplayPort and other high-speed cabling, and for FR4 PCBs used as backplane system interconnects.
2006-04-17 Partners to rev PowerPC
AMCC and Intrinsity have joined forces to design a PowerPC core that could operate in the 3GHz range.
2012-12-17 Panel: No single approach in future of ICs
A group of experts at IEDM debated about the various technologies in semiconductor miniaturisation, with FinFETs being just one of many approaches.
2008-08-21 Panel receptacle boosts intermodulation in uplink comms
Designed for uplink communications applications, San-tron Inc. has released a 7/16 panel receptacle that consistently delivers intermodulation levels of -175dBc.
2008-10-13 Panasonic, Renesas bring partnership to 32nm
Panasonic and Renesas are now collaborating on the development of elemental process technologies for SoCs of the next-generation 32nm node.
2008-07-07 Panasonic comes up with GaN ICs for millimeter-wave comms
Panasonic has developed Gallium Nitride (GaN) ICs for the receiver in future millimeter-wave communication systems.
2006-05-16 Oscillator aims MEMS at the mainstream
SiTime Corp. attempts to revolutionize the quartz-crystal industry with a silicon MEMS alternative that's completely compatible with standard CMOS processing.
2010-11-25 Organic processors run hardcoded program
The 2011 International Solid State Circuits Conference will host papers on a 5.2GHz processor from IBM and an Intel Itanium chip packing 54Mbytes cache.
2016-01-04 Optoelectronic microprocessors promise lower power usage
Researchers at MIT, University of California at Berkeley and University of Colorado produced a working optoelectronic microprocessor that computes electronically but uses light to move information.
2013-01-15 Optocouplers for safe, reliable electrical systems
There are several technologies that can provide electrical isolation, but optocouplers deliver safety and protection unparalleled by any other isolation technology.
2001-04-15 Optimizing DSPs for wireless world
Complexities in next-generation requirements is taxing the capabilities of traditional DSP technology and design methodologies, causing a need for industry business models to be drastically redefined.
2006-02-16 Optical modulator leaps size, power bars
Electrical engineers at the University of Texas have demonstrated what they claim is the world's smallest silicon modulator.
2003-07-16 On-chip sensing stabilizes micromirror
For telecom systems' transition from 10Gbps to 40Gbps rates, signal paths using all-optical switches are becoming increasingly attractive.
2013-01-15 Omnetics unveils nanosized connectors
The PZN series connector touts military style pin and socket designs to offer uninterrupted electrical connections for portable applications that are exposed to high shock and vibration.
2002-12-12 Oki, Peregrine partner for CMOS-on-sapphire technology
Oki Electric Ind. Co. Ltd and Peregrine Semiconductor have formed an alliance to design, manufacture, and market LSIs based on an UTSi CMOS-on-Sapphire technology.
2003-05-23 OEA upgrades spiral inductor synthesis
OEA Int'l Inc. is claiming a major upgrade for Spiral, a 3D toolset for synthesizing embedded spiral inductors in analog and RF chips, hybrids, multichip modules, and PCBs.
2013-03-14 Numerical model to aid in nanophotonic designs
The numerical model developed by A*STAR researchers could be an invaluable tool for designers in nanophotonics as it can simulate the performance of circuits that rely on light.
2003-01-23 Nouling SPGA socket rated to 3A
Shenzhen Nuoling Electronic Co. Ltd's staggered type SPGA socket has a maximum current rating of 3A and operating voltage of 60V.
2006-06-21 Nintendo's New Wii console uses NEC' eDRAM
NEC Electronics announced that Nintendo Co. Ltd has selected its 90nm CMOS-compatible embedded DRAM (eDRAM) technology for Wii, Nintendo's new video game console.
2007-01-01 Nintendo woos casual gamers with intuitive Wii
A teardown of Wii shows a comparatively simple design with far fewer major components than its competittion's.
2006-12-19 Nintendo Wii woos casual gamers
Nintendo has built the Wii to be a more intuitive videogame console designed to attract new and casual gamers.
2009-02-09 New solutions to cut PC power consumption
NXP Semiconductors is set to unveil a suite of new power management solutionsGreenChip power factor correction, GreenChip synchronous rectification controllers and 30V power MOSFETs in LFPAKthat will reduce power consumption in desktop PCs and laptops for the mass market.
2015-03-17 New material tops silicon, graphene in electron mobility
Scientists recently discovered a new material believed to possess electron mobility that is 200 times greater than that of graphene and more than 1,700 times that of crystalline silicon.
2007-05-07 New IBM tech enables faster ICs
IBM scientists announced that they have devised a way to create vacuum spaces between copper wires in semiconductors, which will reportedly lead to chips that consume less power and run faster.
2005-12-07 NEC says 55nm process cuts power consumption
NEC Electronics announced that it has developed a 55nm node process named UX7LS that will employ emersion lithography and higher dielectric constant (high-k) material.
2006-09-14 NEC introduces 'first' 55nm CMOS-compatible eDRAM tech
NEC Electronics and its subsidiaries announced the industry's first 55nm CMOS-compatible embedded DRAM technology.
2005-08-04 NEC develops low standby leakage technology using high-k material
Two NEC Corp. units have developed technology to lower standby power for mobile devices by combining high-k technology and a body-biasing scheme.
2005-03-09 NEC debuts embedded DRAM on 90nm and high-k
Japan's NEC Electronics Corp. on Monday (March 7) rolled out a new embedded DRAM technology, based on its 90nm process.
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