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2014-09-02 | What's switching: Nine takeaways from Hot Interconnects The event sizzled with announcements and discussions¡ªFacebook introduced its high-profile switch, critics attacked Ethernet's shortfalls, experts scrutinised Wi-Fi, and silicon photonics took centre stage. |
2003-03-12 | Vativ rolls out transceivers, eyes interconnects Vativ Technologies is sampling the first member of a planned family of transceivers for copper-based networks operating at 2.5Gbps and above. |
2010-03-16 | Tiny interconnects handle 14A-23A per contact Samtec debuts PowerStrip/10 line of power interconnect solutions featuring an ultrasmall, space saving design and dual leaf blade contacts capable of carrying from 14A to 23A per contact. |
2004-08-02 | Testing SoC interconnects using boundary scan Delay violations occurring in the interconnects of high-speed SoCs can be tested using JTAG boundary scan architecture. |
2009-03-17 | Testing RF ICs with DigRF interconnects The content presented here covers four major areas¡ªdigital/physical, digital/protocol, RF/physical and RF/protocol¡ªbut focuses on the challenges of testing the RF ICs used in formats such as WiMAX and LTE. |
2004-09-16 | Signal integrity key for gigabit interconnects Interconnect performance becomes the key factor in reliable system operation as digital designs push to the gigabit ranges. |
2008-02-08 | SFP+ interconnects deliver up to 10Gbit/s Tyco Electronics has released its SFP+ product family, which extends the use of the small form-factor pluggable interconnects up to 10Gbit/s. |
2007-01-31 | Sematech, TEL advance work on 3D interconnects Sematech and Tokyo Electron entered into a multi-year joint development program to improve the use of 3D interconnect technology and high mobility channel materials in advanced manufacturing. |
2002-07-31 | Schott Optovance offers 2D VSCEL interconnects Schott Optovance Inc. has introduced a 2D VCSEL transceiver interconnect to address the emerging market of 2D parallel optical transceivers. |
2002-02-12 | Samtec micro interconnects made for blind mating Featuring a 1.27mm pitch, the company's TFM and SFM series of micro interconnects are designed for applications requiring blind mating or a high number of mating cycles. |
2002-02-14 | Samtec interconnects function up to 5GHz The Q-Pairs high-speed interconnects are fully-tested in 50-ohm or 100-ohm systems for impedance change, VSWR, crosstalk and propagation delay at frequencies from 10MHz to 5GHz. |
2006-01-27 | RF interconnects offer choices Samtec has expanded its portfolio of MMCX, MCX, SMA and MHF connectors with the GRF1 series addition of ganged RF board-to-board jacks, plugs and cable assemblies. |
2007-07-23 | Photovoltaic interconnects ease solar installations Tyco has added the SolKlip grounding connectors line and solar AWG cable to its SOLARLOK photovoltaic interconnect family. |
2006-11-16 | Perform trouble-free test of BGAs, interconnects One of the most confounding tasks a hardware engineer comes upon happens when the first spin of a PCB arrives on the desk. With no way to probe under a ball BGA chip, engineers need tips in performing easy test of board, BGAs and interconnects. |
2002-02-07 | Optical interconnects draw skepticism, scorn The possible use of optical interconnects on silicon ICs drew a skeptical response from a panel at the International Solid-State Circuits Conference Monday (Feb. 4). |
2007-06-04 | New interconnects, signal integrity devices roll Samtec Inc. unveils new interconnects and signal integrity services for panel and I/O, cable assemblies and board-to-board applications. |
2006-08-22 | New dice interconnects support up to 100Gbps NEC Electronics has a wafer-level packaging technology that it says permits more than 1,000 3D interconnections between the logic and memory dice used in an image-processing system. |
2006-06-08 | Matsushita process enables air-gap interconnects for ICs Matsushita Electric described what the company claims to be a viable replacement for conventional low-k films. |
2015-02-25 | Marvell unveils novel interconnects, memory architectures Marvell's MoChi interconnect is based on the ARM AXI link running at 8Gb/s or faster, while its Final-Level Cache technology aims to cut the amount of DRAM main memory needed in a system. |
2007-10-01 | Manufacturers tip hot chips, interconnects Manufacturers and researchers have provided a peek inside their advanced multicore processors and research into the on- and off-chip networks that those future microprocessors may use at the Hot Chips and Hot Interconnects conferences. |
2005-02-16 | Latency analysis of major chip-to-chip interconnects Compare and contrast the latency experienced by transactions carried over several of the leading chip-to-chip interconnect standards. |
2005-06-01 | Interconnects: Evolution at high-speed Evolving interconnect technologies pose new design considerations in meeting desired data-processing system performance |
2012-05-16 | Interconnects push LED solution upgrades Molex has presented solderless LED array holders and other microminiature connectors that the company says can enable advanced lighting solution designs. |
2005-10-19 | Interconnects provide flexible pitch and board spacing choices Samtec offers a new line of sub-millimeter micro pitch interfaces with 0.5mm, 0.635mm and 0.8mm pitches. |
2007-06-19 | Interconnects handle 3A at 80¡ãC Samtec has expanded its new high power-to-board interconnect system on 6.35mm pitch (PES/PET Series) with signal pins on 2.54mm pitch (PESC/PETC Series). |
2012-08-27 | Interconnects enter Intel, ARM server battle Recent developments in interconnect technology could prove useful for various chip-to-chip uses such as high-speed networking and future stable memory interfaces. |
2014-11-05 | Interconnects correlate signals across two or more wires The core of the technology is a chordal code that delivers five bits over six correlated wires within each clock cycle. It translates received signals into bits, resulting in much higher overall link throughput. |
2006-11-16 | Intel, AMD clash anew on interconnects A battle royal is shaping up as archrivals Advanced Micro Devices Inc. and Intel Corp. race to define interconnects for their next-generation multicore processors. |
2009-02-16 | Intel ventures into optical interconnects Intel Corp. is looking into optical interconnects with an eye toward replacing chip-to-chip electrical interconnects to overcome looming bandwidth issues as microprocessors with an increasing number of cores usher in the era of tera-scale computing. |
2012-09-12 | Intel preps its interconnects for next-gen supercomputers Timed to compete with AMD's recent announcement about its Freedom Fabric acquisition, Intel's next-gen interconnect will be integrated into future Xeon and Atom server processors. |
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