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2002-08-28 Molex PGA socket suits mobile Pentium 4, Celeron
The Micro PGA socket is designed to be used with Intel's Mobile Pentium 4 and Mobile Celeron processors for applications such as blade servers or thin notebook PCs.
2010-04-19 Logic prototcol analyzer handles PCIe 3.0
Tektronix has released the TLA7SA16 and TLA7SA08 logic protocol analyzer modules that give PCIe 3.0 developers an time-correlated view of system behavior.
2006-11-22 Logic analyzers support PCI Express
Agilent is adding deeper memory to its new mainframe logic analyzers to support high-speed serial interconnects such as PCI Express, as well as adding support for FPGA architectures from Altera.
2015-10-15 Logic analyser supports up to 4Gb/s debugging data rates
Keysight unveiled a logic analyser module that claims to deliver the industry's highest-data-rate state mode, highest timing mode (10GHz) and deepest memory depth (up to 400MB).
2013-12-13 Latest developments in 3D IC technologies
Here's a look at the various forms of 3D IC technology, starting with the simpler incarnations and culminating in today's start-of-the-art implementations.
2015-08-19 Keysight unveils memory analysis software
The B4661A claims to deliver the industry's only functional-level compliance violation testing capability across DDR4 and LPDDR4 speed changes.
2011-12-21 JEDEC to release 3D IC standard
JEDEC will release in late December or early January 2012 the first 3D IC interface standard.
2015-03-09 IoT drives chip packaging innovation
The need for high performance multi-functional devices in a single package is pushing the industry to innovate in multi-chip packaging. This high level of integration has presented huge challenge.
2012-03-07 Introduction to 2.5D
We need evolutionary, instead of revolutionary, adjustments to current design flows and the supply chain to successfully leverage 2.5D.
2013-04-23 Interposers to dictate the future of 3D chip stacks
The market for silicon interposers will grow by 88 per cent annually through 2017 with all the big semiconductor makers looking to grow their 3D integration capabilities.
2014-11-05 Interconnects correlate signals across two or more wires
The core of the technology is a chordal code that delivers five bits over six correlated wires within each clock cycle. It translates received signals into bits, resulting in much higher overall link throughput.
2012-02-24 Integrated voltage regulators cut power by 20%
Inverted voltage regulation will be able to respond to the energy needs of future CMOS chips in nanoseconds, compared to microseconds with off-chip voltage regulators, the researchers said.
2011-04-06 Industry pushes TSV-based 3D chips development
Amid fears that IC scaling is becoming too costly for chipmakers, the IC industry is working to develop TSV-based 3D chips, and stack and connect devices in a 3D configuration using TSVs.
2007-10-18 Industrial affiliation program tackles 32nm IC packaging
Two research centers are inviting industry partners to participate in an advanced research program on next-generation flip-chip and substrate technologies.
2012-08-09 Improve SoC yields with diagnostic and repair tools for embedded memory
Learn about embedded memory test solutions, including fault detection in very deep submicron technologies, repair at the manufacturing level, as well as diagnosis for process improvement and field repair capabilities.
2015-10-26 Impact of wearables, IoT on electronic design
Today's IoT and wearable products must deliver ever-increasing capabilities in smaller packages with more aerodynamic shapes. Engineers will need all the help they can get.
2013-08-02 Imec, Cascade probe 25?m-diameter micro-bumps
The organisations revealed breakthroughs in probing stacked ICs (3D-SICs) on a wide I/O test wafer with its fully-automated CM300 probe solution using an advanced version of Pyramid Probe technology.
2013-01-24 Imec, Cadence team up for DFT solution for 3D memory
Cadence's and imec's solution includes generation of DRAM test control signals in the logic die and inclusion of the DRAM boundary scan registers test access mechanisms of the 3D test architecture.
2011-05-26 Imec, Atrenta develop exploration flows for 3D ICs
Atrenta and Imec have co-developed a design flow for heterogeneous 3D stacked ICs.
2006-04-10 IMEC presents 'bendy' packaging for ICs
Leading European research institute IMEC and the Intec laboratory at the University of Ghent have developed a process to produce ultra-thin flexible packaging for ICs.
2015-01-09 Identifying memory trends: Issues, standards and specs
Jennie Grosslight, the memory test product manager at Keysight Technologies, revealed what she thinks will be the prevailing memory trends in 2015.
2012-12-14 IBM showcases 3D server chip stacks
IBM has showcased its techniques for stacking 45nm processors at IEDM. The company's techniques could give the processors significant performance and power gains.
2015-12-01 HMC, HBM gain wider appeal for computing networking apps
An expert said that while HMC and HBM products are rolling out along with DDR4, it's clear there's room for all three technologies to find market share as standards take time to settle into place.
2006-12-12 FuturePlus, Agilent partner on DDR3 tool
Agilent Technologies and FuturePlus Systems announce a collaborative analysis approach with a toolset for DDR3 memory buses operating at data rates up to 1,066Mtransfers/s.
2005-03-22 Fully-Buffered DIMM testing enhances logic analyzers
Tektronix now has a Fully-Buffered dual in-line memory module tester for logic analyzers.
2011-10-28 FPGA boasts 6.8 billion transistors
Xilinx claims an industry-first with the most number of transistors for Virtex-7 2000T by using 2.5D IC stacking.
2013-03-07 Flip-chip platform to lift wafer shipments
Yole Dveloppement expects a threefold growth for the flip-chip platform to reach over 40 million 12" equivalent wafer start per year by 2018.
2013-01-28 Fit in large-capacity memory in advanced-node SoCs
Using large-capacity SRAMs can dramatically reduce leakage and deliver higher system performance while keeping mask costs in check.
2005-06-20 First ATCA probing product?
With a product that enables connectivity for protocol analysis and traffic generation of Advanced Switching Interconnect, Agilent announces its new Advanced Telecommunications Computing Architecture probing.
2011-06-17 FCI, Fujikura team up for IC packaging tech
FlipChip International and Fujikura Ltd are collaborating in innovating advanced semiconductor packaging technology.
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