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2003-10-21 Researcher calls for new HDL approach for SoCs
A new approach to hardware design languages is needed in order to create a better "programmer's view" for SoC designs.
2003-09-26 New conference addresses system-level design
Two formerly independent research conferences will merge into one event scheduled for October 1-3, 2003.
2008-02-25 Power MOSFET package slims down
Toshiba America Electronic Components Inc.'s (TAEC) second-generation Smart Thin Package (STP2) surface-mount packaging for power MOSFETs, which is 20 percent smaller than the original, is now available.
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