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2002-11-26 Superconducting junctions eyed for quantum computing
Josephson junctions, a superconducting type of transistor, are being investigated as a possible route to scalable quantum computers by a physicist at the University of Michigan.
2012-12-12 Self-assembled monolayers create p-n junctions in graphene
Researchers at Georgia Tech created graphene p-n junctions in substrates without damaging the material's lattice structure or significantly reducing electron/hole mobility.
2014-09-25 Understanding electrostatic discharge
Here is an overview of electrostatic-discharge test models, failure modes, protection strategies, and Texas Instruments procedures to guard against ESD failures.
2011-03-14 Spin torque used to write info on memory devices
Researchers are exploring new magnetic devices that can write information using a spin torque instead of magnetic fields. They hope the study would pave the way for better non-volatile memory devices.
2015-02-05 How to prevent latchup in CMOS
Latchup is a reliability concern that plagued early CMOS processes. This article tackles this issue and lists several ways to minimise its occurrence.
2003-06-27 Ultratech readies gear to fab sub-65nm chips
Ultratech said that it has optimized its laser thermal processing (LTP) technology to form junctions down in the 20nm technology node, and is now ready to enter the commercialization phase of its LTP program.
2011-03-09 RFMD breakthrough advances PV commercialization
RF Micro Devices has fabricated dual-junction PV cells that integrate gallium arsenide (GaAs) and indium gallium phosphide (InGaP) PV junctions, clearing the way for triple-junction structures.
2002-08-21 Nanoscale metal deposition eyed for MRAMs
A new technique for fabricating magnetic tunnel junctions would enable MRAMs to be economically manufactured, according to researchers here at the Pacific Northwest National Laboratory.
2011-10-31 Magnetic control for thermoelectric voltage
Thermoelectric voltage effect in magnetic tunnel structures can be used in nano-electronic junctions.
2013-07-10 Hypres commercially debuts new chip fabrication process
The six-layer planarized chip fabrication process increases the integration level of superconducting ICs and critical current density of Josephson junctions.
2009-02-05 Cheaper thin-film solar cells topple crystalline
By using multiple layers with semiconductor junctions tuned to different wavelengths of light, AGT touts that their solar cells are not only cheaper, but could outperform expensive crystalline solar cells in many climates.
2003-07-16 A case for using hybrid optical switching in long-haul networks
There is a fundamental difference between using transparent elements at line sites - degree two junctions with only two fibre directions - and using them at switch sites that have a degree greater than two with three or more fibre directions.
2008-09-01 Winning the power challenge
Optimizing power consumption in SoCs, DSPs and MCUs has provided good results, but even more can be gained in a joint effort between ICs and the teams that design them. The Texas Instruments article addresses some solutions to today's growing power issues.
2015-05-11 Verilog-AMS vs SPICE view for DDR, LCD verification
In this instalment, we comparatively analyse the usage of both views from the perspective of DDR interfaces, LCD controllers and on-chip memories.
2014-03-06 Utilising audio amps for voltage splitting
Here's a look at several voltage splitters built around power audio amplifiers.
2006-11-22 UMC produces 45nm SRAM chip
United Microelectronics Corp. has cleared a key 45nm process hurdle by producing an SRAM chip with a bit cell size of less than 0.25?m?.
2011-02-04 Tyndall scientists create n-type junctionless transistor
With a 50nm channel length and a cross-section of about 8nm x 12nm, the new junctionless transistor is 30 percent more energy-efficient and could represent simpler manufacturing processes for transistors.
2002-09-24 Toshiba proposes double-junction MRAM structure
Toshiba Corp. has developed a magnetic RAM with a double-tunnel-junction structure to boost its MRAM product density to the 1Gb.
2009-01-06 Top 15 challenges to conquer for 22nm
What are the big challenges involved at the 22nm node?
2013-07-03 The outlook for charge-trapping flash memory
The planar cell structures will enable continued scaling of these charge-trap technologies, while new architectures will emerge and further extend the density-growth trend.
2009-05-29 Team sets solar cell record efficiency
Stuttgart University researchers claim to have achieved an efficiency record for laser-processed solar cells based on crystalline silicon.
2006-06-02 Symposium to mull 45nm challenges
Technologists attending the 2006 Symposium on VLSI Technology in mid-June will hear about multiple facets of 45nm processes
2004-02-02 Strained SOI on the move to mainstream
The advantage of strained silicon lies in its electrical properties. The crystalline lattice of the top, electrically active layer of silicon is strained so that electric charges flow faster.
2013-12-27 Simplify LED light assemblies with nano-ceramics
The latest nano-ceramic materials are now posing a challenge to existing metal-backed PCB technologies by providing a better combination of high performance and competitive cost.
2005-06-13 Semiconductor technologies for power management (Part 1)
Understand better why ICs and discrete transistors require very different methods of fabrication.
2005-06-13 Sematech subsidiary tapped to manufacture transistor technology
Acorn Technologies Inc. has selected ATDF, a subsidiary of Sematech, to fabricate its XMOS proprietary metal source drain transistor technology for advanced ICs, Sematech said Thursday (June 9).
2013-09-03 Select precision resistor for 4C20 mA current loop
The low output voltage level of the analog sensor and the long distance to the control room together contribute to considerable system design challenges. Here are clues on how to solve them.
2014-03-20 Samsung announces prod'n of 20nm-based 4Gb DDR3 memory
A key element of the latest design and manufacturing technology by Samsung is a modified double patterning and atomic layer deposition that allows for continued scaling.
2006-10-04 RGB LED modules deliver 480 lumens
Avago's new high-power LED modules, said to be the first to provide up to 480 lumens of light output, target customers who want an easy to use lighting solution that can display a variety of colors.
2007-04-02 Researchers pitch nanowires as litho replacement
HP Lab and a trio of academic labs have scored advances that will make it easier to use nanowires as a replacement for lithography in semiconductor manufacturing, potentially taking chipmaking to the angstrom scale.
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