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2006-06-19 Vishay licenses TrenchFET tech to KEC
Vishay Intertechnology said it will license its power MOSFET technology to KEC, a Korean-based discrete components company.
2002-05-07 KEC surface-mount package has five terminals
Designed for use in power management ICs, the DPAK-5 surface-mount package from KEC Corp. provides five terminals, allowing designers to develop multiple functions for a single device.
2002-10-01 KEC MOSFET features improved current efficiency
KEC Inc.'s p-channel, small signal MOSFET device is claimed to exhibit faster switching characteristics with lower current consumption.
2002-04-15 KEC dielectric material has dielectric constant of 38
2006-01-01 Localizing non-memory devices in Korea
KEC was awarded the President's Prize in Best Electronic Components and its VP Yoon Dong-Hyun domesticated SPS and developed the PPT process.
2006-05-05 MOSFETs yield increased power density with PowerPAK cooling tech
STMicroelectronics has announced its first power MOSFETs to be assembled in the metal-topped PolarPAK package that provides high thermal efficiency and increased power density.
2009-02-27 Connectors free up space for components
AVX Corp. has developed a series of low-profile board-to-board connectors that feature a small form factor of 3mm stacking height with a 0.4mm pitch contact.
2009-04-30 Board-to-board connector flaunts ultraslim form
AVX Corp. has launched the 5802 series, claimed to be the smallest 0.4mm pitch board-to-board connector series featuring an ultraslim form factor of 0.8mm stacking height and 3.2mm width, including tails.
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