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2004-02-12 Kulicke & Soffa sells flip-chip business
Kulicke & Soffa Ind. Inc. has sold all the assets associated with its advanced packaging technology segment.
2015-01-14 Kulicke & Soffa buys Assemblon for $98M
K&S aims to expand its presence in industrial, automotive and advanced packaging markets with its acquisition of Assemblon in accretive transaction.
2006-03-14 SV Probe acquires wafer test assets from K&S
SV Probe announced recently that it has executed the acquisition of the wafer test assets from Kulicke and Soffa Industries, one of the world's leading supplier of semiconductor wire bonding assembly equipment.
2002-07-23 Semiconductor equipment market to see gradual recovery
The recovery in the semiconductor market will be gradual, technology innovation will continue to be unabated, and China is expected to play an increasingly important supply and demand role in the coming years.
2005-07-13 Owens Design, Questar partner on automatic wire bonders
Owens Design has partnered with Questar Products to develop a product line of automatic wire bonders built on Kulicke and Soffa's former hybrid bonder platforms.
2003-03-06 Nantong Fujitsu to install K&S equipment in China plant
Nantong Fujitsu Microelectronics Co. Ltd has selected Kulicke & Soffa Ind. Inc.'s Nu-Tek wire bonders to be deployed in their newest facility in Nantong City, China.
2003-11-12 K&S, Nidec Tosok form joint development alliance
Kulicke & Soffa Ind. Inc. and Japan-based Nidec Tosok Corp. have agreed to combine their respective products and technologies to come up with integrated solutions for high-speed, reel-to-reel packaging of discreet devices.
2004-02-16 K&S, ASE establish test operations partnership
Kulicke & Soffa (K&S) and ASE Test Ltd have formed a strategic relationship under which K&S will provide onsite services at ASE Test's facilities in Taiwan.
2003-05-14 K&S to transfer wire bonder manufacturing facility
Kulicke & Soffa Ind. Inc. will relocate the manufacturing operations of its manual wire bonders from Haifa to its Yokneam, Israel facility.
2002-02-08 K&S stud bumper offers largest bondable area
Claimed to have the industry's largest bondable area at 400-by-300mm, Kulicke and Soffa's WaferPRO stud bumper includes their Accubump feature that enables single-pass bumping/coining of 75mm to 300mm wafer with 5?m accuracy at 3 sigma.
2003-09-22 K&S opens first manufacturing facility in China
Kulicke & Soffa Ind. Inc. has officially opened its new 13,500 square-meter facility located in the Suzhou-Singapore Industrial Park near Shanghai.
2003-07-02 K&S gets additional order from Nantong Fujitsu
Kulicke & Soffa Ind. Inc. has received another purchase order from Nantong Fujitsu Microelectronics Co. Ltd.
2003-07-03 K&S capillary allows thicker wires in UFP processes
Kulicke & Soffa Ind. Inc. (K&S) has developed a capillary that permits the use of thicker wires in fine pitch and ultra fine pitch (UFP) applications.
2004-01-14 K&S ball bonder offers 10 percent UPH improvement
Kulicke & Soffa Ind. Inc. has released the Max?mplus ultra high speed ball bonder that is suitable for all types of ultra-fine pitch apps.
2003-06-09 Fujitsu subsidiary deploys K&S ball bonders
Nantong Fujitsu Microelectronics Co. Ltd has made an additional order of Nu-Tek ball bonders made by Kulicke & Soffa Ind. Inc.
2002-02-27 Amkor to purchase ball bonders from K&S
Amkor Technology has issued a letter of intent indicating its intention to purchase 200 units of Kulicke & Soffa Ind. Inc.'s Maxum ball bonders to help support its ramp to ultra-fine pitch wirebond technology.
2005-07-26 K&S, Microbonds form bonder alliance
Kulicke & Soffa Ind. Inc. and Microbonds Inc. announced a joint process development project.
2002-08-30 K&S to shut down Milpitas substrate operations
Kulicke & Soffa Ind. Inc. has announced its plan to close substrate operations in Milpitas, California due to the extended downturn in the semiconductor industry.
2002-11-11 K&S opens alternatives for non-core business units
Kulicke & Soffa Ind. Inc. has announced that it is exploring options for some of its non-core business units.
2002-06-18 K&S bonding wire suits fine pitch package
Kulicke and Soffa Ind. Inc. has introduced the AW-99X bonding wire suitable for advanced fine pitch packages with <505m bond pad pitch.
2010-10-15 Lattice announces new CEO
Lattice Semiconductor Corp. named Darin Billerbeck president and CEO, effective Nov. 8, 2010 .
2002-06-17 K&S ball bonder targets HDM, SO packages
Specifically designed to be used with high-density matrix and SOP casings, the Nu-Tek automatic ball bonder from K&S Ind. Inc. is claimed to deliver up to 30 percent more productivity than the company's 8028-S.
2005-06-29 Hitachi, Tegal win fab-tool satisfaction rankings
Hitachi High-Technologies Corp. and Tegal Corp. separately received the highest ratings in their respective categories for customer satisfaction in the chip-equipment industry for 2005, according to an annual survey conducted by VLSI Research Inc.
2006-08-25 Copper prices rise amid BHP labor dispute
The ongoing labor strike at BHP Billiton Ltd's copper mine in Chile has made the electronics industry start worrying about copper supply and pricing.
2002-03-22 Chip equipment execs say the worst is over
An executive panel of semiconductor capital equipment vendors expressed cautious confidence at the SEMInvest conference that the worst of the downturn is over, and said the industry needs to think about managing the next ramp.
2008-08-27 Cadence tool steps up IC package, SiP designs
The release of SPB 16.2, due in November of this year, from Cadence Design Systems, delivers advanced IC package/system-in-package miniaturization, design cycle reduction and DFM-driven design, along with a new power integrity modeling solution.
2015-11-12 A*STAR set-ups high density, low-cost packaging consortium
Together with industry partners, A*STAR's IME has set-up a high-density FOWLP consortium to extend FOWLP capabilities for applications such as smartphones, tablets, navigation tools and gaming consoles.
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