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2009-11-10 Land grid array (LGA) package rework
This application note describes rework considerations for the land grid array (LGA) style package. Freescale has introduced RF modules such as the MC1320x and MC1321x in LGA packages as an alternative package to BGA.
2001-06-07 Land grid array (LGA) handling, mounting and thermal considerations
This application note presents handling, mounting and thermal guidelines on land grid array (LGA) packaging.
2009-11-16 Considerations for the application of land grid array (LGA) style packages
This application note describes general considerations for application of the land grid array (LGA) style packages. Freescale has introduced RF modules such as the MC1320x and MC1321x in LGA packages as an alternative package to BGA.
2004-01-22 STATS offers FCLGA package for wireless apps
ST Assembly Test Services Ltd has qualified an environment-friendly version of its Flip-Chip Land Grid Array (FCLGA) package.
2012-06-28 M2M modules tip voice, data comms for telematics apps
Cinterion's AGS2 surface mount automotive machine-to-machine module offers a secure IP connection and best-in-class digital audio and advanced voice technology with voice prompts.
2006-06-20 LGA sockets target desktop, server MCUs
Tyco Electronics unveils its latest land grid array sockets targeted at desktop and server microprocessors.
2006-06-26 LGA capacitor offers very low ESL
AVX developed a land-grid array capacitor that offers extremely low equivalent series inductance.
2013-09-13 How to avoid PCB engineering change orders
Prevent engineering change orders in printed circuit board designs by paying attention to seven key areas where problems are likely to occur.
2004-01-22 ASAT to provide flip-chip technology to Shanghai Fudan
ASAT Holdings Ltd and ASAT Inc. will provide flip-chip land grid array (LGA) technology to Shanghai Fudan Microelectronics Co. Ltd.
2005-07-13 Actel makes LGA package available to RTAX-S FPGA offering
Actel disclosed that it has expanded its package selection to include a Land Grid Array option for its RTAX-S FPGA family.
2015-02-02 Optimising BGA signal routing in PCB designs
BGA packaging technology for embedded designs is steadily advancing, but signal escape routing is difficult. Know the strategies to ensure that a product is correct in terms of form, fit and function.
2013-06-13 Two-axis magnetic sensor operates from single 1.8V supply
MEMSIC's MMC246xMT Two-Axis Magnetic Sensor is provided in a miniature 2.0x2.0x1.0 mm. Land Grid Array (LGA) package and is capable of operating from a single 1.8 V supply.
2005-10-04 ST's latest acceleration sensors
STMicroelectronics extended its range of dual-axis acceleration sensors with the introduction of two new devices housed in the tiny, lead-free LGA (Land Grid Array) package measuring 5-by-5-by-1.5mm.
2005-10-19 Linear Tech ?Module simplifies power system development
The new ?Module (micro-module) from Linear Technology promises designers a complete 10A switching power supply in a tiny (15-by-15mm) footprint, low profile (2.8mm) land grid array package.
2010-09-21 15A DC/DC uModule regulator gives more power per mm2
Linear Technology introduced its LTM4627, a 15A DC/DC uModule regulator with onboard inductors, MOSFETs and supporting components in a 2.6g, 15 x 15mm and grid array (LGA) package
2009-09-11 Xeon processors make intelligent PCs
Intel's new processors bring the Nehalem microarchitecture to mainstream desktop and entry server markets.
2010-10-27 Xeon gets embedded for flight
Mercury's Xeon embedded computer houses two quad-core Jasper Forest Xeon processors in an OpenVPX module for use in high-end radar, multi-sensor electro-optical/IR and other embedded applications.
2006-06-26 Vendors working to make WUSB a standard
Wireless USB solutions are being developed by a number of vendors to eliminate USB cable tethers.
2007-06-13 Ultrathin MEMS-based sensor suits portable devices
Freescale Semiconductor has started sampling a MEMS-based sensor with a three-axis digital-output accelerometer that the company says is the thinnest on the market.
2012-10-08 u-blox unveils ultra-small GSM modules for M2M apps
u-blox's SARA module is is targeted at M2M applications requiring dual or quad-band GSM/GPRS, voice and/or data, optional Internet suite applications.
2005-10-20 STATS ChipPAC wants to be 3D king
Nearly two years after the big merger, Singapore's STATS ChipPAC Ltd is treading slightly above stormy waters in the competitive chip packaging and test market.
2005-05-17 STATS ChipPAC to offer 300mm electroplated wafer bumping services
STATS ChipPAC Ltd announced it will offer 300mm electroplated wafer bumping services in the third quarter of 2005 to complete its full turnkey service offering for advanced flip chip applications.
2005-10-19 ST's three new accelerometers
STMicroelectronics expanded its portfolio of three-axis accelerometers which, according to the company, embed world-class performance in ever smaller packages.
2014-11-13 ST delivers dust-free, water-resistant pressure sensor
At 0.76mm thin, the new pressure sensor is the only one in a fully moulded package, enabling higher-accuracy measurements.
2007-06-18 Single-chip Zigbee PiP boasts long battery life
Designed to support wireless applications, Freescale Semiconductor Inc.'s single-chip Zigbee platform-in-package (PiP) enables up to 20-year battery life and features up to 2Mbps TurboLink technology.
2008-06-24 Single-chip Zigbee IC promises low power consumption
Freescale has begun sampling the latest addition in its MC1322x single-chip IEEE 802.15.4/Zigbee family, designed to provide a highly integrated, total solution with very low power consumption.
2011-10-27 RF transceiver supports multimode 3G/4G
The MB86L12A speeds up RF implementation for multiband LTE, UMTS and EDGE mobile handsets.
2007-10-12 RF front-end module simplifies 802.11n design
SiGe Semiconductor Inc. today announced what it is calling the world's most integrated RF front-end module for Wi-Fi products designed to comply with the IEEE 802.11n specification.
2011-03-04 Renesas' RX MCU family expands with new RX200 series
Renesas' RX200 32-bit MCUs are targeted for applications such as smart meters, smartphones, intelligent sensors and almost all portable battery-operated devices.
2012-07-24 RDA rolls QFN front end modules for GSM handsets
Touted as industry's first, the RDA6641 and RDA6651 use the company's IPD technology and integrate quad-band power amplifiers and antenna switches.
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