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2011-09-30 Wireless system supports 802.11u, HotSpot 2.0
The wireless technologies allow users to automatically connect to the best available WiFi network with no need for tedious configurations.
2002-05-22 Vivace multiservice IP switches scale to 2.5Tbps
A multiservice IP switch family from Vivace Networks Inc. allows per-flow control and per-channel scheduling of as many as 256 interfaces operating at up to 10Gbps.
2003-08-29 TeamF1 rolls standards-based Layer-2 Port authentication
The X-Calibur from TeamF1 Inc. is an embedded implementation of the Port-based Network Access Control protocol.
2003-09-18 Platform for gateway apps ups ante for PICMG 2.16
Radisys Corp. will roll out a PICMG 2.16-enabled platform for gateway applications at this week's Intel Developer Forum
2004-01-16 Optimizing access networks with Layer 3 switching
Network operators and equipment vendors are facing many of the same decisions that once concerned enterprise and carrier networks.
2004-11-11 Layer 2 switches consume <600mW/port
The SparX series from Vitesse features what the company claims as the industry's lowest power, integrated switch-plus-copper-PHY technology.
2006-07-07 LAN switches feature embedded Layer 2-7 security
Foundry Networks' new SecureIronLS secure LAN switches is said to be the only LAN switches with embedded Layers 2 to 7 security for enterprise-wide protection
2013-06-07 Global Ethernet switch market grew 2.1% YoY in Q1
IDC reported that the worldwide Ethernet switch market (Layer 2/3) reached $5.28 billion in 1Q13 while on a sequential basis, the seasonally weaker 1Q13 declined 7.6 per cent over 4Q12.
2005-06-24 Foundry rolls layer 2/3 switches
Foundry Networks' FastIron Edge X424F (FES X424F) device is a compact, layer 2/3 edge switch that supports 24 small form factor hot-pluggable ports and options for one or two ports of 10GbE.
2011-08-04 Ethernet switches meet Layer 2, 3 requirements
Extreme Networks' Ethernet Access Switches promise cost effective Layer 2 connectivity for the access layer of the Enterprise network.
2003-08-06 Broadcom multi-layer switch runs on CX4 medium
The single-chip BCM5673 from Broadcom Corp. is the company's latest addition to the StrataXGS product line.
2005-10-21 VXS board packs dual 2.2GS/s A/D channels
The new Quixilica Neptune 2 VXS from TEK Microsystems combines field programmable gate arrays with dual 2.2GS/s data conversion channels
2014-10-06 Virtualisation moves into telecoms, NFV work enters phase 2
The ETSI NFV group's phase 1 work covers the publication of documents including an overall framework and standard terms. Phase 2 targets to define a virtualized network for telecom carriers
2012-11-23 Virtual prototype for Android HW-SW dev't (Part 2
Learn about the hardware/software integration flow for a sensor sub-system for use in an Android mobile device.
2007-12-06 Virtex-5 FPGA solutions fit SPI-4.2, SFI-4.1 interfaces
Xilinx has announced complete solutions for the Optical Internetworking Forum (OIF) SPI 4.2 and SerDes Framer Interface (SFI) 4.1 standards, the industry's highest performance channelized packet interfaces
2011-08-12 USB 3.0 hub controllers support 2-layer PCB designs
SMSC's family of SuperSpeed USB hubs that claims to deliver the industry's smallest footprint eases expansion in docking stations, port replicators and all-in-one monitors.
2013-09-23 UFS 2.0 boosts security, increases link bandwidth
Developed for mobile applications and computing systems, JEDEC's Universal Flash Storage version 2.0 enable significant improvements in throughput and system performance
2005-02-08 Teradyne releases 2-pair GbX connector
Boosting bandwidth with increased flexibility are two key advantages of Teradyne Inc. Connection Systems Division's new GbX 2-pair connector
2004-09-06 Synopsys unveils DesignWare USB 2.0 OTG PHY core
Synopsys introduced its DesignWare USB 2.0 On-The-Go (OTG) PHY (Physical Layer) core targeted at TSMC's 90-, 130- and 180nm processes.
2006-02-13 Synopsys extends DesignWare USB 2.0 PHY lineup
Synopsys announced the addition of the new DesignWare USB 2.0 nanoPHY intellectual property to its existing DesignWare USB 2.0 physical layer product line.
2012-07-31 StruxureWare Operation v7.2 maximizes optimization
Version 7.2 enables data center managers to maximize optimization at the server, rack, row and room levels
2005-11-11 Structured ASIC devices embed PCI Express physical layer
ChipX has introduced a new structured ASIC family that it claims is a low-risk alternative to traditional ASIC and FPGA devices
2000-03-15 STA013 MPEG 2.5 Layer III source decoder
This application note assists the user in working with the STA013 Evaluation Board, installing the PC software driver, understanding how STA013 MPEG 2.5 Layer III source decoder works, and explaining how to control the device functions.
2005-09-29 ST rolls new MPEG-2 decoder chips for STBs, DVD recording
STMicroelectronics introduced a new range of MPEG-2 decoder chips for low-cost STBs and DVD recording, which promise to increase the available computing power by over five times compared to earlier devices
2008-04-03 Spread-spectrum EMI reducer targets USB 2.0 links
PulseCore has introduced what it claims is the first spread-spectrum IC approach to radiated EMI reduction expressly designed for USB 2.0 links
2004-12-09 SPI-4.2 to quad SPI-3 bridge
This app note describes a reference design used to bridge one 4-channel Xilinx SPI-4.2(PL4) core (v6.1) to four 1-channel SPI-3 (PL3) link layer cores (v3.2).
2008-02-25 Smart sensor includes programmable MCU, LIN 2.0 interface
Micronas has announced the HAL 2810 smart sensor, said to be the first linear Hall-effect sensor to include programmable MCU and a LIN bus 2.0 interface
2011-05-18 Single-layer sensor delivers lower-cost capacitive touchscreens
Cypress has created proprietary algorithms that interface with a true single-layer sensor without bridges to deliver two-layer performance, enabling mobile device makers to save 30 percent on sensor costs
2008-04-23 Seiko touts 'thinnest' chip-type double-layer capacitor
Seiko Instruments will introduce the world's thinnest and smallest chip-type electric double layer capacitor, part number CP3225A, in October
2001-10-11 S3028B with 2 X 9 with no ref. clock (Serial datacom/Telecom
This application note describes a Physical Media Dependent (PMD) layer solution for SONET/SDH data transfer with the use of the AMCC S3028B transceiver, PMC PM5355 fiber-optic transceiver and a 2-by-9 fiber-optic transceiver with CRU and no reference clock.
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