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2003-08-01 Toshiba subsidiary pushes for lead-free manufacturing
Toshiba America Electronic Components Inc. has announced that it is implementing manufacturing procedures using new materials that support the current industry movement to lead-free manufacturing
2003-12-10 Toshiba offers lead-free packaging
Toshiba America Electronic Components Inc. (TAEC) announced that many of its power semiconductor package types will be manufactured using either lead-free packaging or lead-free finishes.
2002-05-28 TDK optical sensors use amorphous silicon semiconductor
TDK Corp.'s BCS3216G1 and BCS5030G1 optical sensors for visible light incorporate the use of an amorphous silicon semiconductor, making them highly receptive to visible light and unreceptive to infrared light
2004-06-08 Semiconductor firms unite in lead-free initiative
Freescale Semiconductor Inc., a subsidiary of Motorola Inc., has joined STMicroelectronics, Infineon Technologies AG and Philips Semiconductor to further promote a lead-free electronics packaging industry.
2005-06-02 National Semiconductor targets 100% lead-free products end of June
National Semiconductor Corp. is working on achieving 100 percent lead-free production by the end of June 2006
2002-03-20 Kyocera develops lead-free solution
Kyocera Corp. has developed a solution that enables lead-free manufacturing in its semiconductor components business, particularly in electroless plating for ceramic packages.
2003-07-18 Fairchild turns to lead-free finish packages
Fairchild Semiconductor has announced that they have initiated conversion of all products to lead-free finish packages.
2002-06-25 Catalyst Semiconductor rolls out lead-free packages
Catalyst Semiconductor Inc., an EEPROM memory supplier, has launched its environmentally safe lead-free package initiative.
2004-11-11 Microchip offers lead-free product packaging
Microchip Technology Inc., a provider of microcontroller and analog semiconductors, disclosed the conversion of its product packaging to environmentally friendly lead (Pb)-free plating, beginning January 2005.
2004-11-11 Problems seen ahead for supply chain from Pb-free directive
The road to lead-free semiconductor production and compliance with European Union directives is going to be complex and could cause major inventory issues, senior industry executives, distributors and manufacturers said here on Tuesday (Nov. 9) during the opening day of the Electronica exhibition.
2005-11-08 Philips Semiconductors completes RoHS conversion program
Royal Philips Electronics has announced that the conversion to RoHS compliant/lead-free semiconductor products has been completed well ahead of European legislation mandating the manufacture of lead-free electronic products by July 1, 2006
2010-04-23 IC firms join hands to drive Pb-free solutions
Five IC firms have formed the DA5 consortium to investigate and standardize the acceptance of alternatives for high-lead solder for attaching die to semiconductor packages during manufacturing
2006-03-31 White LED drivers feature dual-gain architecture
National Semiconductor introduced three new inductorless white LED drivers for display backlighting in cellphones, PDAs, portable gaming devices and MP3 media players
2003-09-22 Wafer bumping technology qualified at Chartered
Unitive Semiconductor Taiwan Corp. (UST) has announced that its electroplated wafer bumping technology has been qualified at Chartered Semiconductor
2004-11-05 TDK unveils three smart card interface circuits
TDK debuted its 73S8023C, 73S8024C and 73S8010C smart card interface circuits that possess an efficiency of 85 percent and a small size step-up/step-down converter.
2012-06-19 ST's Baraton discusses green manufacturing efforts
At the PSECE 2012 show, ST stressed the need to make semiconductors, the upstream sources of power consumption. We asked ST's Xavier Baraton about his company's green manufacturing practices.
2005-03-04 SigmaTel ramps up production in ASAT's Dongguan facility
SigmaTel Inc. has completed qualification and is ramping production on lead-free and green fine pitch ball grid array in ASAT Holdings Ltd's manufacturing facility in Dongguan, mainland China
2005-08-12 Regulator powers analog, RF ICs
The LP5900 CMOS linear regulator from National Semiconductor offers ultra-low noise, and high power supply ripple rejection, while consuming a mere 25?A
2005-12-09 Regulator IC extends adaptive power management
National's LP5550 is the first digitally-controlled EMU for handheld consumer products that implements the company's PowerWise architecture for adaptive voltage scaling.
2006-04-03 PFC controller reduces power loss up to 320mW
Fairchild Semiconductor introduced a PFC controller IC that is said to reduce standby power as much as 320mW
2004-12-09 Pericom rolls out five-channel analog video switches
Pericom's new high-bandwidth analog video switches enable easy switching between signal sources in video display devices such as video projectors.
2003-06-10 ON Semi package design reduces board space by 45 percent
ON Semiconductor has released more than 35 of its standard logic and diode array devices in 1.6-by-1.6-by-0.6mm SOT553 and SOT563 packages
2004-05-05 ON Semi expands MiniGate portfolio
ON Semiconductor has expanded its 100-plus MiniGate portfolio with a series of new sub-one volt logic devices in SOT-553 packaging
2006-05-23 ON Semi expands LVDS device family
ON Semiconductor introduced the NB6L11S and NB6N14S fully-differential interface ICs
2002-11-22 Oki brings environment-friendly packaging to its facilities
Oki Electric Ind. Co. Ltd has successfully developed a lead-free solder plating technology for semiconductor package terminals.
2004-10-15 National's new solution simplifies design of PoE systems
National said it has released the first single-chip PD solution to feature the high performance and tiny package footprint needed to simplify PoE system design.
2005-08-18 National's dc-dc converter provides wide input voltage range
National Semiconductor recently introduced a high power step-up dc-dc converter that features a wide input voltage range of 2.7V to 7V, a 0.15-ohm internal switch and pin selectable operating frequency
2004-11-24 National DC/DC converters target RF power amplifiers
National launched a family of DC/DC converters that is designed for powering RF power amplifiers from a single Li-ion battery.
2004-08-24 Microtune converts tuners to Pb-free packaging
Microtune has begun offering an extensive line of Pb-free RF ICs, including MicroTuner single chip tuners.
2005-08-15 LVDS buffer/repeaters extend signal integrity of FPGAs, ASICs
National Semiconductor's new high-performance buffer/repeaters for LVDS systems extend the signal reach of FPGAs and ASIC across backplanes and cables in telecom, datacom, industrial, medical, automotive and office imaging apps
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