Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > lithography production equipment

lithography production equipment Search results

?
?
total search157 articles
2005-04-20 No signs of 2H recovery for ICs, equipment, says analyst
Contrary to popular belief, there are no signs of a recovery for the semiconductor and chip-equipment industries in the second half of 2005, according to an analyst with Adams Harkness Inc
2002-08-02 Canon to integrate Asyst robot in lithography tools
Canon Inc. will incorporate Asyst Technologies Inc.'s UTX-F5500C single-arm wafer-transfer robot for its advanced step-and-scan lithography systems used in 248nm, 193nm, and 157nm wavelengths
2010-07-20 Uncertainty marks future of advanced lithography
Industry players present in Semicon West's session on advanced lithography sparked arguments on what the future holds as complexities and costs increase
2003-01-24 SUSS MicroTec to install lithography line at Taiwan R&D firm
SUSS MicroTec has announced that they will install a lithography line at the National Nano Device Laboratories in Taiwan
2002-12-26 Nanoimprint lithography ready to make its mark
A potentially low-cost form of lithography affectionately known as
2003-02-10 JMAR streamlines lithography operations
JMAR Technologies Inc. will restructure and streamline its operations in order to improve profitability and better support the commercialization of its CPL semiconductor manufacturing systems and related technologies.
2003-09-04 Japan plays catch-up on EUV lithography
A consortium of nine Japanese companies working on extreme-ultraviolet lithography says it is making steady progress toward a spring 2006 target for fielding an alpha tool that would provide 10W of EUV output power
2011-11-22 Issues of EUV lithography
Chip makers need EUV to be ready well in advance of when they plan to use it in volume manufacturing so they can establish chip design rules and tweak their manufacturing processes.
2002-04-24 Intel orders scanner to develop commercial EUV lithography
Intel Corp. has ordered a beta-stage extreme ultraviolet lithography scanner from ASM Lithography to help it prepare for production of 45nm linewidth ICs using commercial EUV tools later this decade
2013-12-05 EVG unveils full-field UV nanoimprint lithography system
Featuring an integrated soft stamp/template fabrication capability, the EVG720 system enables throughputs of more than 60 wafers per hour with the lowest cost of ownership, stated the firm.
2014-12-03 EVG unlocks nanoimprint lithography hub for photonics apps
The Nanoimprint Lithography NILPhotonics Competence Centre aims to help customers assess the technology and equipment for nanoimprint lithography (NIL) in the field of photonics
2003-12-22 EVG equipment deployed in Beijing's Tsinghua-Foxconn Nanotechnology Center
EV Group (EVG), a manufacturer of MEMS and semiconductor wafer processing equipment, has successfully installed several advanced wafer processing tools at Tsinghua-Foxconn Nanotechnology Center at National Tsinghua University (NTHU), located in Beijing
2012-01-09 Drop in MOCVD spending drags LED equipment buy
Following a 36 percent increase in equipment spending last year, worldwide LED manufacturing equipment spending is seen to decline 18 percent this year
2002-04-18 CEO develops 1.5kW laser module for EUV lithography
Cutting Edge Optronics Inc. has demonstrated a 1.5kW laser module as a plasma source for extreme ultraviolet semiconductor lithography
2008-08-11 Carl Zeiss beefs up chip equipment biz with purchase
Carl Zeiss has purchased Pixer Technology Ltd, an Israel-based company that creates unique yield enhancement systems for photomasks in IC production
2013-04-24 Applied Materials reclaims top spot in chip equipment market
In 2012, Applied Materials reclaimed the No. 1 spot based on its relative strength in deposition and process control, Gartner said.
2003-11-20 EV Group made strategic supplier by DALSA
EV Group has been selected by Dalsa Semiconductor as the strategic supplier for MEMS wafer bonding and thick polymer lithography production equipment.
2007-11-27 ASE places litho order with Suss MicroTec
German semiconductor equipment manufacturer Suss MicroTec AG has received multiple orders for its lithography production equipment from Taiwan-based chip packaging technology provider ASE Group.
2014-12-09 TSMC guns for 7nm with EUV scanners
ASML said on November 24 that TSMC has ordered two NXE:3350B EUV systems for delivery in 2015 with the intention to use the systems in production
2010-01-18 TSMC denies taking on Nikon scanner
Foundry giant Taiwan Semiconductor Manufacturing Co. Ltd denies buying a new 193nm immersion lithography scanner from Nikon Corp.for now
2012-07-11 Zplasma in talks with ASML to develop EUV
EUV startup Zplasma has been in talks with several companies in hopes making a collaboration to develop a prototype source module.
2010-06-14 Will EUV litho be ready for 22nm?
EUV is creeping closer to the technical specifications that would allow high volume manufacturing but it now looks unlikely to arrive in time to take much part in the 22nm node.
2004-11-01 Wanted: New class of engineering generalists for DFM
Symposium sees need for 'tall and fat' engineers to help 'reintegrate' IC production
2009-06-15 TSMC weighs in on e-beam, EUV litho
Foundry giant Taiwan Semiconductor Manufacturing Co. Ltd is still backing two horses in the race to the next lithography extreme ultraviolet lithography (EUVL) and clustered electron-beam
2009-01-14 Trio works on e-beam solutions
Vistec Electron Beam Lithography Group, CEA/Leti and D2S Inc. have announced a collaboration focused on refining and validating advanced design-for-e-beam (DFEB) solutions for the 45nm and 32nm nodes
2008-10-14 Trio collaborates to develop maskless ICs
Fujitsu Microelectronics Ltd and e-Shuttle Inc. have agreed to adopt D2S' advanced design for e-beam (DFEB) technology, starting with a 65nm low power (LP) library.
2007-10-08 Toshiba mulls over 450mm fab, EUV litho
Aiming to maintain its edge in the IC market, Japan's Toshiba Corp. is exploring several new chip-production technologies, including 450-mm fabs and EUV lithography
2009-07-09 Top 10 industry issues
Here are the top 10 looming issues that the semiconductor capital equipment industry is facing
2006-01-31 Tool claims dramatic reduction in OPC closure time
Aprio introduced the Halo-Fix tool that makes available the LRC repair technology used by the company's Halo-OPC product to manufacturers using third-party LRC and OPC tool sets.
2009-10-01 SUSS MicroTec joins ITRI 3D consortium
The Advanced Stacked-System Technology and Application Consortium will implement SUSS MicroTec's 300mm technology.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top