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2009-11-19 Toshiba touts EUV photoresist for 20nm process
Toshiba Corp. has developed a photoresist suitable for use with EUV lithography and proved its viability in the first 20nm generation process technology
2007-10-19 Toshiba 'validates' imprint litho for 22nm CMOS
Toshiba Semiconductor has reportedly validated the use of imprint lithography technology in developing 22nm node CMOS devices
2010-02-17 Shortage looms in memory market
There is expected to be a tight supply of memory parts in 2010 due to rebound in demand; lack or under-investment of capital spending; and extended lead times for lithography gear from ASML
2005-11-09 Samsung delays DRAM fab, buys gear
Applied Materials, ASML, KLA-Tencor, Novellus and others have begun receiving a new round of semiconductor equipment orders at Samsung Electronics Co. Ltd. despite the chip maker's move to delay a DRAM fab project in South Korea, according to a report from an analyst on Monday (Nov. 7
2005-08-17 Obducat commits imprint litho to Samsung, storage
Nano-imprint lithograhy company Obducat AB has entered into an agreement with Samsung Electronics Co. Ltd on the production of stamping machines for DVD optical discs and said it would drop other projects to pursue its opportunities with Samsung
2008-07-17 Numonyx NOR reaches out to 65nm
Numonyx has extended its family of high-density NOR flash memory products to its 65nm process lithography to meet the demands of embedded customers
2012-01-03 New method can yield faster, denser ICs
Researchers at MIT have come up with a technique that allows the production of complex shapes rather than just lines on microchips
2005-12-22 NEC adopts Synopsys' PSM tech
Synopsys announced that NEC Electronics has adopted Synopsys' phase-shift mask technology for production of its high-performance 65nm processor and logic chips
2008-06-03 Maskless tools to boost ASIC throughputs
E-Shuttle Inc. is set to improve its direct-write e-beam capabilities and explore the future use of next-generation maskless tools from Mapper Lithography NV and other startups in the arena, making e-beam tools a probative technology in mainstream production fabs
2005-04-04 LCD makers to focus on technology upgrades
South Korea and Japan LCD manufacturers will develop process technologies that will advance production of LCD TVs
2011-03-16 Japan quake raises concerns over electronics supply chain
According to analysts, the devastating earthquake that hit Japan, a key source of chips supporting CE devices, could lead to production decrease, phenomenal price swings and large near-term shortages
2005-07-08 Intel, Corning codevelop ultraviolet photomask substrates
Intel Corp. and Corning Inc. have entered into an agreement to develop ultra low thermal expansion ULE glass photomask substrates required for Extreme Ultraviolet (EUV) lithography technology
2010-12-20 IMFlash Singapore set for Q2 2011
Intel and Micron Technologies? JV IM Flash Technologies LLC, whose Singapore NAND flash fab has been delayed, is set for commercial production in 2011, according to online reports
2011-02-04 Fab firms' focus on 450mm could disrupt supply chain
Analysts fear there is not enough 300mm capacity today and 450mm plants under construction may not start mass production until 2017 or 2018, a scenario that could trigger disruptions in the IC supply chain
2013-07-03 EVG unveils room-temperature debonding platform
The platform includes two new debonding processes that have been qualified for EVG's high-volume production temporary bonding/debonding systems in addition to the company's ZoneBOND technology
2011-03-07 Directed self-assembly gains steam
Despite its inherent defects, DSA could have applications in areas such as flash memory production where the regular structure of circuits and cost sensitivity of the market may make it attractive
2012-11-08 Customised lenset array prepped for advanced e-beam tool
Imec has designed and fabricated an electrostatic micro-lens array for KLA-Tencor's Reflective Electron Beam Lithography (REBL) tool
2002-03-15 Consortium may take over Bell Labs research facility
Lucent Technologies and Agere Systems Inc. are attempting to spin-off their nanotechnology and electron-beam lithography lab in Murray Hill, N.J. as an advanced prototyping foundry that would be run by a consortium of local public and private investors
2005-07-05 Therma-Wave sells product line to Tokyo Electron
Therma-Wave Inc., a vendor of process control metrology systems, has agreed to sell its Compact Critical Dimension-integrated (CCD-i) product line to Tokyo Electron Ltd (TEL) for about $9.95 million.
2010-01-13 Panelists debate IC manufacturing fate
At SEMI's Industry Strategy Symposium (ISS), panelists agreed to disagree on the fate of IC manufacturingabout the future of 450mm fabs, Moore's Law and the R&D funding gap.
2015-06-29 OSATS: Wafer-level packaging limitations hard to dismiss
The recent SEMI Packaging Tech Seminar focused on the need, in terms of under yield and packaging cost pressures, to move from fan-out wafer-level-packaging to fan-out panel-level-packaging.
2010-04-06 IM Flash starts hiring for Singapore fab
Signaling that the delayed 300mm fab in Singapore is moving closer to ramp up, IM Flash Technologies LLC is advertising dozens of jobs openings in the island city-state.
2010-01-06 Fearless IC forecasts for 2010
2010 is just beginning to unfold in the electronics industry and there is already uncertainty in the air. EE Times' Mark LaPedus offers his chip forecasts and other prediction for 2010.
2008-06-16 UMC tips roadmap, veers away from 450mm
Taiwan foundry United Microelectronics Corp. has outlined its process roadmap and disclosed several alliances with the EDA community at the Design Automation Conference (DAC).
2003-03-24 U.S., tech industry mull creation of mask consortium
The U.S. government, photomask companies and several semiconductor makers are reportedly in the final stages of forming a research consortium to help overcome the technical and economic difficulties associated with deep-submicron mask design.
2011-03-04 TSMC details 450mm fab plans
TSMC will install a 450mm pilot line in Fab 12 in Hsinchu then bring the line up in Taichung to process devices at the 14nm node. It aims to produce 14nm FinFETs at its Taichung fab by 2015 or 2016.
2016-01-25 Toshiba to sell chip business except NAND
The company will consolidate its investment and business operations on flash memory and nuclear energy businesses, and has now positioned them as the two pillars to carry the company's future.
2004-09-01 Synopsys CEO calls for DFM cooperation
Synopsys CEO called on the design and fab communities to develop
2007-10-25 Signs point to fab-lite route for Renesas
Renesas Technology is quietly altering its fab and foundry strategies, seeking to make up ground at the 65nm node and beyond.
2007-10-26 Samsung debuts 64Gbit MLC NAND flash memory
Samsung Electronics Co. Ltd has developed the world's first 64Gbit multilevel cell NAND flash memory chipusing 30nm-class process technology.
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