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2008-02-18 Printed electronics market to hit $30.1B by 2015
Electronics products manufactured by printing technologies will reach $30.1 billion by 2015, according to a report by NanoMarkets LC.
2013-06-06 Parasitic extraction in the double-patterning age
Determining the impact of double-patterning on electrical sign-off can be better achieved by understanding how PEX tools have evolved to handle this challenge.
2009-09-16 Opinion: HDDs need patterned media boost
It goes without saying that crossing the 1Tbit/in? areal density threshold by 2011 requires significant investment from the HDD manufacturers and the supporting supply chain.
2002-09-30 Numerical Technologies: Subwavelength - An opportunity for Taiwan's semiconductor industry?
Over the past 10 years, the emergence of Taiwan's contract semiconductor manufacturers, TSMC and UMC, as leaders in manufacturing have enabled many fabless companies to deliver these innovations cost-effectively to the market.
2015-06-09 Non-volatile RAM seen as replacement for DRAM, flash
Startup Nantero has raised $31.5 million that will be used to speed up development of its NRAM, sometimes known as Nano-RAM, for use in both enterprise and consumer applications.
2007-02-01 Next-gen memory market up for grabs
The frantic search for a next-generation memory technology took center stage at the IEEE International Electron Devices Meeting in December, amid growing concerns that DRAM and flash parts will no longer scale in the near future.
2013-05-09 Next-Gen EVG120 supports coating, developing apps
The EVG120 resist processing system features a new robot with dual arms for fast wafer swapping and additional processing chambers, which result in enhanced throughput and overall productivity.
2010-08-11 Naysayers, optimists clash on DRAM forecasts
Industry players and watchers have conflicting outlooks when it comes to forecasting DRAM supply and demand.
2002-04-05 NanoOpto seeks opto builders for its pillar structures
NanoOpto Corp. will work with developers of passive and active optical elements to identify optoelectronic products that could make use of the company's passive pillar elements, CEO Barry Weinbaum said.
2015-10-05 MEMS design, manufacturing on the microscale
The microelectromechnical system is a source of wonder in this modern world, so too is its design and manufacturing. Find out why.
2007-04-16 Making MEMS the new 'mouse'
This article features ST's MEMS Product Division General Manager Benedetto Vigna, who views MEMS as the new 'mouse.' ST first ventured into developing MEMS in 2001. Last year, the company inaugurated a 200mm semiconductor wafer fabrication line dedicated to MEMS devices.
2015-04-22 Is resistive RAM the next NVM star?
Resistive RAM features low power consumption and a small cell areaboth compelling reasons for their adoption as a non-volatile memory.
2010-10-27 Intel: 450-mm capable or just 450-mm ready?
Barclays Capital analysis concludes that Intel's new fab is 450-mm ready but not yet 450-mm capable.
2007-08-16 Intel pulls ahead in processor capex race
Advanced Micro Devices Inc. and Intel Corp. are taking different paths in IC manufacturing, but the traditional capital-spending race appears to be over in the x86-based processor arena.
2004-07-19 Intel moves up debut of billion-transistor chip
Not only does Intel Corp., the world's largest chipmaker, believe Moore's Law is alive and well, it is aiming to deliver a billion-transistor chip in 2005, rather than the original target date of 2007.
2007-06-18 Industry tackles approach to DFM, DFY issues
Experts from chip, EDA and foundry companies ask whether it's better to deal with DFM and DFY issues at tape-out or minister to the design starting at the register transfer level.
2016-01-25 Improvement in light source could speed up EUV progress
Prototype systems in commercial fabs now use an 85W light source, soon to be upgraded to 125W, while ASML recently demoed an 185W capability and promises it will hit 250W before the end of the year.
2003-02-13 IC makers look to alliances as China eyes recovery
Experts at the ISS Europe conference remain divided on whether the slumping global semiconductor industry has at last bottomed out.
2005-01-07 IBM-led consortium to build fab in N.Y., say reports
New York Gov. George Pataki is expected on Wednesday (Jan. 5) to unveil a plan for an IBM-led consortium that includes AMD, Infineon and Sony to invest more than $2.5 billion in a wafer fab, according to a
2008-09-25 IBM opens gates of 300mm fab
Up until recently, IBM Corp. and its secretive chip unit refused to reveal any information about its semiconductor operations.
2014-06-27 IBM fab sale: Retracing its x86 steps
IBM's focus on servers for businesses prevented it from seeing and responding to what one former employee calls "the biggest server buying spree in a decade."
2015-07-14 GlobalFoundries rolls out FD-SOI platform
GlobalFoundries' FDX platform, using an advanced FD-SOI transistor architecture, confirms the momentum of this technology by expanding the ecosystem and assuring a source of high-volume supply.
2008-01-08 Fearless IC forecasts for 2008
To help sort chip market confusion, EE Times' Mark LaPedus released his own chip forecastsand other predictionsfor 2008.
2015-07-03 Examining 3D embedded substrate power packaging
Here is a look at 3D embedded substrate power packaging technologies, which will be increasingly deployed in everything from cell phones to hybrid electric vehicles.
2007-01-01 End of Moore's Law prompts technology search
The search is on for a technology that could replace today's workhorse CMOS-based silicon.
2012-01-30 Could 450mm wafers play away from the leading edge?
When the processing of integrated circuits on 450mm diameter wafer comes, many assume that it will do so first for the most advanced digital manufacturing processes.
2006-08-16 CMOS scaling: painstaking but possible
CMOS scaling is, in fact, proving to be a painstaking and humbling taskalbeit a possible one.
2008-09-16 Cleantech investment boom begins
According to a report by CleanEdge Inc., total revenue of the biofuel, wind, solar photovoltaic (PV) and fuel cell markets is expected to top $250 billion within the decade, up from $77 billion last year.
2005-07-11 Challenges seen for seamless DFM, says expert
The semiconductor and EDA industries have poured millions of dollars to develop new and promising technologies for the emerging design-for-manufacturing (DFM) sector.
2009-10-14 Analysis: Will Tessera's optics venture pay off?
Realizing the need for new engine for growth Tessera ventured into the imaging and optics market in hopes to replicate its success in DRAM IP.
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