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2015-11-12 A*STAR set-ups high density, low-cost packaging consortium
Together with industry partners, A*STAR's IME has set-up a high-density FOWLP consortium to extend FOWLP capabilities for applications such as smartphones, tablets, navigation tools and gaming consoles.
2008-11-21 Wafer-level packaging achieves prominence
Wafer-level packaging, the fabrication of the IC package directly on the wafer, is finally getting exposure after many years of promises, according to an expert in the field
2008-08-11 Trio seeks to cut costs in chip packaging
Infineon has granted licenses for its embedded Wafer-Level BGA chip packaging technology to competitor STMicroelectronics as well as STATS ChipPAC to lower costs and achieve higher market acceptance
2001-10-01 Thin-film process enables low-cost MCPs
This technical article describes a low-cost multi-chip packaging (MCP) technique with appropriate expansion that triples volume capacities.
2009-11-26 Terepac, IMEC unite for flexible packaging
Terepac's patented photochemical printing process places thinned silicon dies and passive components on flexible substrates.
2013-10-03 Spray-based carbon nanotubes used to create low cost sensors
A team of researchers from the Technische Universit?t Mnchen recently fabricated a gas detection sensor on a flexible polymer substrate.
2011-08-01 Sony, Audio Pixels to co-develop low-cost MEMS speakers
Sony and Audio Pixels are working on developing low-cost MEMS digital speakers to enable speaker products that are better than conventional speakers but come in a small, 1mm-thick package
2007-08-17 Shifting trends in packaging industry favor big players
Industry insiders agree the packaging business is getting increasingly expensive, a trend that naturally favors larger players
2011-04-14 RFID solutions boast improved performance, low cost
Alien Technology has introduced a trio of high-performance, business-class technologies: the Higgs 4 IC, ALH-900x family of mobile handheld readers and Squiggle inlay.
2008-06-16 PCIe packet switches enable low-cost solutions
Pericom announced the industry's first PCIe packet switch product family designed for power, size and value-sensitive applications, such as volume motherboard, wireless access points, docking stations, SOHO printers, DTV, video surveillance, graphics and mobile applications.
2006-05-08 Off-the-shelf gear drives offer compact size, low cost
Torque Transmission has introduced a line of right-angle gear drives designed for a wide variety of right-angle motion control applications.
2013-08-14 NTU, STATS ChipPAC work on advanced wafer level packaging
Singapore's NTU has entered a joint research programme with STATS ChipPAC to advance solutions for next generation semiconductor packaging technologies
2011-12-21 Low-cost technique targets flexible electronics
Solution-based processing technology pushes for smart applications with stretchable and plastic backplanes.
2007-02-19 Low-cost PS2 controller matches Sony's version sans the cord
The Game Elements GGE609U PS2 controller from Philips, available for about $22 to $25, matches up in price and function with Sony's own wired controller but dispenses with the cord.
2005-06-16 Low-cost FPGAs, IP propel Asian PLD market
Two recent developments in the programmable-logic space have been specifically significant for Asian designers.
2013-01-16 LED packaging to experience year upswing, says Yole
According to Yole Dveloppement's latest report, the LED packaging materials market will enjoy a 20 per cent CAGR during the period 2012-2017, with its growth driven by package substrate and phosphors
2015-02-26 Fan-out wafer level packaging to reach $200 million, analysts say
Market researchers predict in a new report that the Fan-Out Wafer Level Packaging (FOWLP) market is likely to reach an estimated $200 million in 2015, expects 30 per cent CAGR in the following years
2015-07-15 E-band cost, reliability concerns in MMIC packaging
Traditional semiconductor packaging approaches either cost too much or suffer from signal integrity issues. However, new techniques are becoming available that can address these problems
2003-02-28 CyOptics purchases CENiX automated packaging operations
CyOptics Inc. has acquired the optical component packaging capabilities of CENiX Inc
2004-09-23 CAMD regulators provide low cost power solutions
California Micro Devices released its CM3004 and CM3065 families of 1A and 2A low dropout linear regulators.
2011-12-01 BAN: The answer to low-cost consumer health devices
BAN is seen to be the answer to spiraling health care costs and provider shortages. Because of this, wireless standards groups and the IEEE are embracing BAN technology.
2007-07-19 Amkor, IMEC sign 3D wafer-level packaging pact
Amkor has agreed to develop 3D integration technology with IMEC based on its wafer-level processing techniques.
2013-10-18 Altera outs low-cost dev kits based on Cyclone V FPGAs
With an entry point of just $49, the company boasts the broadest portfolio of low-cost solutions that claim to deliver optimal power and performance based on customer's unique design requirements
2005-09-16 Altera Cyclone II FPGAs offered in new packaging options
Altera introduced new packaging options for its Cyclone II FPGA family, providing designers of high-volume applications with even lower-cost programmable solutions and smaller form factors
2005-02-14 SOT-89 FETs offer low cost, high linearity
Agilent announced two new members of its family of high-linearity E-pHEMT FETs in the industry-standard 4.5-by-4.1-by-1.5mm SOT-89 surface-mount package.
2006-12-04 NI rolls out low-cost PXI chassis with remote controller
Lowering the entry cost for a high-performance SPXI system, National Instruments is rolling out its PXI-1033 chassis with integrated MXI-Express remote controller.
2012-05-09 New packaging fits MachXO2 PLDs in tight spaces
Lattice's MachXO2 family of PLDs now come in a 5 x 5mm 32QFN form factor suitable for system, consumer and industrial applications.
2005-04-01 Migration path laid to low-cost 32bit MCUs
Moving from 8bit architectures to 32bits entails several hurdles to overcomeone of them is cost.
2007-07-02 Low-cost FPGAs prop up GbE, PCIe, RapidIO
Altera Corp. has officially rolled out a line of entry-level FPGAs built to support Gigabit Ethernet, PCI Express and serial RapidIO transceivers at the lowest possible price for a programmable part.
2010-09-10 Low-cost audio IC takes out amplifier, regulator
Nuvoton's latest ChipCorder IC eliminates need for separate amplifier, regulator
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