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2006-12-08 UTAC expands Thailand packaging operations
United Test and Assembly Center Ltd will pump more than $100 million into its Thailand operations over the next three years as it shifts more low-end packaging activities to the country.
2015-08-07 Global IC packaging markets log in $48B revenue in 2014
According to New Venture Research, the IC packaging market is experiencing robust health with worldwide revenues and YoY growth exceeding 10 per cent
2007-02-23 Freescale unrolls low-end MCU with 16KB flash
Offering 16Kbytes of flash memory, Freescale's highly integrated QC16 MCU is suitable for low-end consumer and industrial applications
2005-01-14 Taiwan reaffirms pledge to let some technology go to China
A Taiwanese official said the government would keep its promise to allow more technology companies to transfer manufacturing plants to China, particularly in the LCD and chip packaging industries
2006-05-03 Taiwan allows IC assemblers in China
The Taiwan government has reportedly relaxed the rules for Taiwanese IC-packaging and assembly houses to invest and set up shop in China
2005-08-03 Merger continues to weigh on STATS ChipPAC
With STATS ChipPAC Ltd continuing to post losses nearly a year after the merger that created it, and failing to leverage on a generally positive industry environment, observers said the immediate outlook for the test and packaging firm is grim
2008-01-23 Xilinx introduces three new Virtex-5 FPGAs
Xilinx Inc. has added three new devices and small form factor packaging to their 65 nm Virtex-5 LX and LXT FPGA platforms as the adoption of programmable logic in new markets drives new cost and density requirements
2005-04-13 Spansion displays NOR flash memory
Memory chip vendor Spansion LLC has joined the IIC-China tradeshow this year. The company exhibited its full-series of NOR flash memory, including 5V, 3V and 1.8V products, 1- to 512Mb products, as well as single-chip and multi-chip packaging products (MCP
2003-02-12 Java accelerator blends with memories to fit into cellphone
NanoAmp Solutions Inc. claims it has Flash and packaging partners who will make as early as May the combo chips for <$4 premium over the existing memory devices
2005-07-28 Heatsinks designed for BGAs
Vette has announced the availability of its thermal solutions for ICs in ball grid array (BGA) packaging. The new BGA heatsinks target traditional high-volume motherboard, video card and networking board apps
2004-10-26 Fujitsu expands high-speed interconnect system
Fujitsu added a new packaging option to its internal microGiGaCN mezzanine connector with the introduction of a right-angle surface mount plug connector
2013-04-26 Fujitsu Asia beefs up FM3 32bit MCUs
The company is releasing 38 new products, including the MB9BF529TPMC, which is equipped with high-capacity memory, and the MB9BF121JPMC, which features low pin count packaging
2005-06-24 Freescale MCU targets CE apps
Freescale's new MC908QB8 MCU is a highly integrated, feature-rich solution at a low-end price point, making it ideal for consumer electronics, industrial control and automotive systems
2003-01-03 DRAM makers prep multichip cell phone memories
Eyeing the growing market for cellular phones, DRAM vendors are seeking ways to fold more non-volatile memory and advanced packaging techniques into their game plans
2002-10-01 Verplex: Solutions for correct RTL design implementation
Taiwan started promoting electronics in the 1980s as part of its key economic development initiatives.
2006-12-18 Ultralow-cost handsets call for single chip
The market for ultralow-cost handsets is expected to grow quickly over the next three to four years, as more than two-thirds of new subscribers come from developing countries.
2016-03-21 TSMC unveils silicon plans
TSMC will enable silicon interposers larger than 1,200mm21.5x the reticle sizeat 7nm to enable giant 2.5-D stacks of logic and memory for the next gen of Cowos- chip on wafer on substrate.
2014-04-21 TSMC to post high Q1 revenue due to smartphones, 28nm tech
The company expects a 22 per cent quarterly increase in sales to between $5.96 billion and $6.06 billion, gross margins between 47.5 per cent and 49.5 per cent.
2014-04-25 TSMC fleshes out IC line-up with shrunk TSVs
Based on its work on chip stacks, TSMC will launch in July an enhanced version of the 16nm FinFET technology with up to 18 per cent faster data rates and lower leakage, in addition to a planned 10mm and 7mm processes.
2015-06-03 Touchscreen controllers support displays up to 10.1in
The latest Atmel maXTouch U series products claim to deliver remarkable touch performance and ultra-low power for devices that include smartphones and tablets.
2010-08-11 Richard Clemmer talks about NXP's IPO
NXP Chairman and CEO Richard Clemmer shared that NXP Semiconductor's stock, which opened on NASDAQ last week, is being received quite well.
2014-12-04 Protecting FPGA system with secure authenticator
Learn about the general problems that counterfeiters pose for original equipment manufacturers and end customers, and how these concerns can be addressed.
2008-09-04 NSF, research consortium team on multicore design
The U.S. National Science Foundation and Semiconductor Research Corp. have initiated a three-year joint project focused on multicore chip design and architecture.
2008-06-26 New iPhone carries $173 tag, reveals virtual teardown
Apple Inc.'s second-generation iPhone is expected to carry an initial hardware BOM and manufacturing expense of $173, according to a preliminary "virtual teardown" conducted by iSuppli Corp.
2002-10-24 NEC ships 8-, 32-bit MCUs for automotive apps
NEC Electronics has announced the availability of new Kx1 and Fx2 series MCUs for 8- and 32-bit designs in high-end safety systems for automotive systems.
2005-04-01 Migration path laid to low-cost 32bit MCUs
Moving from 8bit architectures to 32bits entails several hurdles to overcomeone of them is cost.
2007-08-16 MEMS pioneer draws up technology's course
MEMS pioneer Kurt Petersen of SiTime shares MEMS' development since the 1980s as well as his thoughts on where it is headed in the future.
2007-03-22 MCU family offers flexibility for automotive apps
Infineon Technologies has unveiled a new MCU family designed to meet the strong flexibility requirement of present and future automotive body and gateway applications.
2006-01-01 Making things matter in 'rest of Asia'
Rest-of-Asia countries are focusing on embedded design services, consumer-products manufacturing and back-end support.
2007-07-02 Low-cost FPGAs prop up GbE, PCIe, RapidIO
Altera Corp. has officially rolled out a line of entry-level FPGAs built to support Gigabit Ethernet, PCI Express and serial RapidIO transceivers at the lowest possible price for a programmable part.
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