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2009-03-25 Mapper IC trims cost in Ethernet services
Maxim Integrated Products has launched the DS33M30/DS33M31/DS33M33, a family of highly integrated Ethernet-over-SONET/SDH (EoS) mapping devices.
2002-06-04 Agilent EoS mapper integrates serdes, CDR, framers
The HDMP-3002 Gigabit Ethernet over SONET (EoS) mapper IC from Agilent Technologies Inc. integrates a serdes, CDR, and OC-3 to OC-48 framers, all required to efficiently format data for SONET/SDH networks.
2002-11-12 10Gbps framer/mapper IC line rolls for ATM nets
The company's Columbia family of 10Gbps framer/mapper devices targets ATM and packet-over-SONET applications, including multiservice switches
2009-01-06 2009 IC fearless forecasts
2009 is just beginning to unfold in the electronics industry and there is already a looming uncertainty based on recent industry data.
2013-05-15 CTO: TSMC prepared to push beyond IC limits
TSMC technology chief Jack Sun discusses the future of semiconductors-such as super-systems that move beyond SoCs-and the path the microchip foundry aims to take.
2003-04-10 Agere multirate, multiprotocol line card ICs roll
Agere Systems Inc. bills its Mars T LT multirate, multiprotocol line card chips for framing and mapping applications in metro and access networks as a single hardware/software platform that can be used in many line card designs.
2008-06-03 Maskless tools to boost ASIC throughputs
E-Shuttle Inc. is set to improve its direct-write e-beam capabilities and explore the future use of next-generation maskless tools from Mapper Lithography NV and other startups in the arena, making e-beam tools a probative technology in mainstream production fabs
2008-11-17 Fab tech roll call: survival of the fittest
Manufacturers are rolling out 45nm ICs, with 32nm designs in the works; 22nm and even smaller devices are in R&D. But delivery of chips at 32nm and beyond won't be a cool breeze.
2008-02-27 EU forms group to push for maskless litho at 32nm
The European Union has formed a program to push for the insertion of maskless lithography for IC manufacturing at the 32nm ''half-pitch'' node in 2009. The program is called Magicfor Maskless Lithography for IC manufacturing
2009-07-08 TSMC, CEA-Leti team on maskless litho
TSMC signs up for CEA-Leti's IMAGINE program on maskless lithography for IC manufacturing
2005-09-22 LIU delivers redundancy w/o relays
With tremendous demand in the T1/E1 area, Exar has developed what it claims is the first integrated 28-channel T1/E1 (line interface units) LIU/framer with VT/TU Mapper/DeMapper and the M13 multiplexer for optical transport applications
2009-06-15 TSMC weighs in on e-beam, EUV litho
Foundry giant Taiwan Semiconductor Manufacturing Co. Ltd is still backing two horses in the race to the next lithography extreme ultraviolet lithography (EUVL) and clustered electron-beam.
2009-03-03 TSMC details litho roadmap, taps maskless
Taiwan Semiconductor Manufacturing Co. Ltd has detailed it lithography roadmap and said it is still backing maskless technology at the SPIE Advanced Lithography conference.
2003-10-01 SynApps customizes its tools for users
Following an unusual business model, SynApps Software Corp. leverages in-house technology to offer customized EDA tools that perform static timing analysis, synthesis, placement, clock tree synthesis and simulation.
2010-01-21 ST joins CEA-Leti e-beam litho program
The program covers tool assessment, patterning and process integration, data handling, prototyping and cost analysis.
2009-03-02 Panelists skeptical on next-gen litho
Experts debated and sparred over the future of patterning during a panel discussion at the SPIE Advanced Lithography conference.
2009-03-06 Litho woes: R&D gap, downturn
It was a triple-whammy for lithographers at the SPIE Advanced Lithography conference as the industry continues to be plagued by an R&D gap, technology delays, and, of course, the lousy economy.
2008-03-28 Device delivers Ethernet mapping over PDH
Maxim Integrated Products has introduced a new Ethernet mapping device that enables the delivery of new Carrier Ethernet services over existing PDH telecommunications infrastructure.
2009-11-23 10 technologies to look forward to in 2010
EE Times has compiled emerging technologies that have potential to change the electronics landscape in 2010.
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