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2008-10-14 Trio collaborates to develop maskless ICs
Fujitsu Microelectronics Ltd and e-Shuttle Inc. have agreed to adopt D2S' advanced design for e-beam (DFEB) technology, starting with a 65nm low power (LP) library.
2009-07-08 TSMC, CEA-Leti team on maskless litho
TSMC signs up for CEA-Leti's IMAGINE program on maskless lithography for IC manufacturing.
2009-03-03 TSMC details litho roadmap, taps maskless
Taiwan Semiconductor Manufacturing Co. Ltd has detailed it lithography roadmap and said it is still backing maskless technology at the SPIE Advanced Lithography conference
2008-06-03 Maskless tools to boost ASIC throughputs
E-Shuttle Inc. is set to improve its direct-write e-beam capabilities and explore the future use of next-generation maskless tools from Mapper Lithography NV and other startups in the arena, making e-beam tools a probative technology in mainstream production fabs
2005-10-26 IC Interconnect announces Ni/Au process qualification
Wafer bumping service company, IC Interconnect has announced the qualification of its Ni/Au pad resurfacing process for high-temperature wire bond applications. The new process produces high-temperature stable bonds with a thinner gold layer. These wire bonds can be used in avionics and automotive apps, and does not require additional lead time for production
2008-02-27 EU forms group to push for maskless litho at 32nm
The European Union has formed a program to push for the insertion of maskless lithography for IC manufacturing at the 32nm ''half-pitch'' node in 2009. The program is called Magic!for Maskless Lithography for IC manufacturing.
2009-10-06 D2S, Advantest partner on maskless SoCs
D2S unveils packed stencil technology that works with Advantest's e-beam direct write lithography equipment.
2010-01-21 ST joins CEA-Leti e-beam litho program
The program covers tool assessment, patterning and process integration, data handling, prototyping and cost analysis.
2007-04-16 Litho woes weigh down semicon industry
The lithography world has suddenly turned upside-down as the industry gets socked by a double whammy: The window of opportunity is slowly closing on EUV lithography for IC production, but the most likely alternative!a version of 193nm immersion!is proving expensive
2008-11-17 Fab tech roll call: survival of the fittest
Manufacturers are rolling out 45nm ICs, with 32nm designs in the works; 22nm and even smaller devices are in R&D. But delivery of chips at 32nm and beyond won't be a cool breeze.
2008-10-14 Analysis: Photomask faces market slowdown
For years, there has been an impression that the photomask business model is broken.
2010-04-07 Quest for the right road to lithography
The industry has long known that without a viable NGL solution!which most assumed would be EUV!Moore's Law scaling would slow and the secular growth rate of the IC industry would decline
2009-06-15 TSMC weighs in on e-beam, EUV litho
Foundry giant Taiwan Semiconductor Manufacturing Co. Ltd is still backing two horses in the race to the next lithography! extreme ultraviolet lithography (EUVL) and clustered electron-beam.
2009-01-06 Top 15 challenges to conquer for 22nm
What are the big challenges involved at the 22nm node?
2009-03-02 Panelists skeptical on next-gen litho
Experts debated and sparred over the future of patterning during a panel discussion at the SPIE Advanced Lithography conference.
2005-04-18 Nanoimprint litho makes its mark at SPIE
While nanoimprint vendors made impressive claims in a recent conference in California, analysts noted that the market is in its infancy.
2009-03-06 Litho woes: R&D gap, downturn
It was a triple-whammy for lithographers at the SPIE Advanced Lithography conference as the industry continues to be plagued by an R&D gap, technology delays, and, of course, the lousy economy.
2008-07-16 Litho options falling behind process needs
Who killed high-index lithography, and was politics the cause? These questions remain for chipmakers looking for a route to next-gen manufacturing in a shifting lithography landscape.
2010-02-24 Intel extends immersion litho to 11nm, delays EUV
Intel Corp.'s lithography roadmap plans to extend its 193nm immersion to the 11nm logic node and delay extreme ultraviolet (EUV)!again.
2009-07-22 Fab tool collaboration: Mission impossible?
Will the day come when rival fab tool vendors will throw out the rule book and collaborate with each other on new equipment R&D projects!just to help the industry keep pace on Moore's Law?
2010-03-24 Execs weigh in on right path for litho
Was EUV the wrong bet for the industry? If so, what should it be working on instead? And who will benefit in the long run? Litho experts and executives give their opinions on these hot questions.
2009-09-23 Canon litho dreams hit price roadblock
The end could be near for Canon Inc.'s lithography efforts, as the company is reportedly mulling plans to cease future, high-end scanner development, according to sources.
2009-05-19 ASML to benefit from Nikon EUV litho delay
Nikon is said to have put on hold development of some of its extreme ultraviolet (EUV) tools, which could give ASML a huge early advantage in commercial deployments of the emerging chip making technology.
2009-11-23 10 technologies to look forward to in 2010
EE Times has compiled emerging technologies that have potential to change the electronics landscape in 2010.
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