total search53 articles
| 2011-03-14 | U.S. Circuits obtains Maskless Lithography DI system Maskless Lithography Inc. reports that U.S. Circuits Inc. has taken delivery of a direct-write imaging system at its Southern California facility. |
| 2009-07-08 | TSMC, CEA-Leti team on maskless litho TSMC signs up for CEA-Leti's IMAGINE program on maskless lithography for IC manufacturing. |
| 2009-03-03 | TSMC details litho roadmap, taps maskless Taiwan Semiconductor Manufacturing Co. Ltd has detailed it lithography roadmap and said it is still backing maskless technology at the SPIE Advanced Lithography conference. |
| 2008-10-14 | Trio collaborates to develop maskless ICs Fujitsu Microelectronics Ltd and e-Shuttle Inc. have agreed to adopt D2S' advanced design for e-beam (DFEB) technology, starting with a 65nm low power (LP) library. |
| 2012-02-17 | TEL joins DSA, maskless litho projects Japan's Tokyo Electron Ltd (TEL) is working with on two collaborative lithography research projects spearheaded by the CEA-Leti research institute. |
| 2003-09-11 | Researchers reflect on maskless lithos An invitation-only workshop has kicked off last September 8, to explore a form of maskless lithography based on arrays of micromirrors. |
| 2008-06-03 | Maskless tools to boost ASIC throughputs E-Shuttle Inc. is set to improve its direct-write e-beam capabilities and explore the future use of next-generation maskless tools from Mapper Lithography NV and other startups in the arena, making e-beam tools a probative technology in mainstream production fabs. |
| 2008-02-27 | EU forms group to push for maskless litho at 32nm The European Union has formed a program to push for the insertion of maskless lithography for IC manufacturing at the 32nm ''half-pitch'' node in 2009. The program is called Magic—for Maskless Lithography for IC manufacturing. |
| 2009-10-06 | D2S, Advantest partner on maskless SoCs D2S unveils packed stencil technology that works with Advantest's e-beam direct write lithography equipment. |
| 2010-01-21 | ST joins CEA-Leti e-beam litho program The program covers tool assessment, patterning and process integration, data handling, prototyping and cost analysis. |
| 2003-12-17 | Europe's Medea+ faces cash crunch Medea+, an industry-initiated pan-European program for microelectronics R&D, faces the cancellation or drastic curtailment of newly selected projects as deficit-squeezed European national governments threaten to choke off funding. |
| 2010-03-02 | SPIE Litho wraps with delays, double-patterning The themes of this year's SPIE Advanced Lithography event were clear: D and D—delays and double-patterning. Indeed, EUV is delayed. So is maskless. And nanoimprint is still stuck in R&D. |
| 2008-10-20 | Mapper, TSMC delve into multiple e-beam lithography Mapper and TSMC have signed an agreement, according to which Mapper will ship its first 300mm multiple-electron-beam maskless lithography platform. |
| 2002-09-23 | Group to develop low-energy e-beam litho system Toshiba Corp. and three partners have joined forces to develop a maskless, low-energy electron-beam direct-writing system for SoC devices. |
| 2002-09-11 | Verification company in Japan formed thru collaboration Tokyo Electron Ltd, Ebara Corp., and Dainippon Screen Mfg. Co. Ltd have entered into a memorandum of agreement to form a joint venture company, tentatively named E-Beam Corp. |
| 2009-06-15 | TSMC weighs in on e-beam, EUV litho Foundry giant Taiwan Semiconductor Manufacturing Co. Ltd is still backing two horses in the race to the next lithography— extreme ultraviolet lithography (EUVL) and clustered electron-beam. |
| 2010-03-01 | TSMC takes on 40nm yields, high-k, litho issues At the TSMC Japan Executive Forum in Yokohama, Shang-Yi Chiang, senior VP of R&D at TSMC, addressed several issues about the silicon foundry giant. |
| 2010-04-15 | TSMC skips 22nm, leaps to 20nm half-node Taiwan Semiconductor Manufacturing Co. Ltd announced plans to skip the 22nm "full node" after the 28nm node and move directly to the 20nm "half node." |
| 2009-01-06 | Top 15 challenges to conquer for 22nm What are the big challenges involved at the 22nm node? |
| 2008-08-14 | Sematech reports progress on EUV litho for 22nm Sematech has disclosed a way of using extreme ultraviolet (EUV) lithography to define silicon devices with a half-pitch resolution as small as 22nm. |
| 2005-09-01 | Road map rethinks process reductions The ITRS draft scraps nodes and embraces 'cycles' for more incremental transitions. |
| 2010-04-07 | Quest for the right road to lithography The industry has long known that without a viable NGL solution—which most assumed would be EUV—Moore's Law scaling would slow and the secular growth rate of the IC industry would decline. |
| 2009-03-02 | Panelists skeptical on next-gen litho Experts debated and sparred over the future of patterning during a panel discussion at the SPIE Advanced Lithography conference. |
| 2005-04-18 | Nanoimprint litho makes its mark at SPIE While nanoimprint vendors made impressive claims in a recent conference in California, analysts noted that the market is in its infancy. |
| 2014-07-04 | Nanoholes improve nanowire-based solar cells Singapore researchers found a way to increase the cost-effectiveness of photovoltaic devices by improving the manufacturing of silicon nanoholes. |
| 2010-03-11 | Long road still to e-beam direct-write litho While multiple development efforts on e-beam direct-write lithography have reported progress, a one prominent lithography researcher claims production tools are still a minimum of five years away. |
| 2009-03-06 | Litho woes: R&D gap, downturn It was a triple-whammy for lithographers at the SPIE Advanced Lithography conference as the industry continues to be plagued by an R&D gap, technology delays, and, of course, the lousy economy. |
| 2007-04-16 | Litho woes weigh down semicon industry The lithography world has suddenly turned upside-down as the industry gets socked by a double whammy: The window of opportunity is slowly closing on EUV lithography for IC production, but the most likely alternative—a version of 193nm immersion—is proving expensive. |
| 2008-07-16 | Litho options falling behind process needs Who killed high-index lithography, and was politics the cause? These questions remain for chipmakers looking for a route to next-gen manufacturing in a shifting lithography landscape. |
| 2005-05-25 | Kodak licenses OLED technology to Fuji Fuji became the latest licensee of Kodak's organic light-emitting diode (OLED) technology. |
Bloggers Say
See what engineers like you are posting on our pages.
All rights reserved.