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2011-03-14 U.S. Circuits obtains Maskless Lithography DI system
Maskless Lithography Inc. reports that U.S. Circuits Inc. has taken delivery of a direct-write imaging system at its Southern California facility.
2009-07-08 TSMC, CEA-Leti team on maskless litho
TSMC signs up for CEA-Leti's IMAGINE program on maskless lithography for IC manufacturing.
2009-03-03 TSMC details litho roadmap, taps maskless
Taiwan Semiconductor Manufacturing Co. Ltd has detailed it lithography roadmap and said it is still backing maskless technology at the SPIE Advanced Lithography conference.
2008-10-14 Trio collaborates to develop maskless ICs
Fujitsu Microelectronics Ltd and e-Shuttle Inc. have agreed to adopt D2S' advanced design for e-beam (DFEB) technology, starting with a 65nm low power (LP) library.
2012-02-17 TEL joins DSA, maskless litho projects
Japan's Tokyo Electron Ltd (TEL) is working with on two collaborative lithography research projects spearheaded by the CEA-Leti research institute.
2003-09-11 Researchers reflect on maskless lithos
An invitation-only workshop has kicked off last September 8, to explore a form of maskless lithography based on arrays of micromirrors.
2008-06-03 Maskless tools to boost ASIC throughputs
E-Shuttle Inc. is set to improve its direct-write e-beam capabilities and explore the future use of next-generation maskless tools from Mapper Lithography NV and other startups in the arena, making e-beam tools a probative technology in mainstream production fabs.
2008-02-27 EU forms group to push for maskless litho at 32nm
The European Union has formed a program to push for the insertion of maskless lithography for IC manufacturing at the 32nm ''half-pitch'' node in 2009. The program is called Magic!for Maskless Lithography for IC manufacturing.
2009-10-06 D2S, Advantest partner on maskless SoCs
D2S unveils packed stencil technology that works with Advantest's e-beam direct write lithography equipment.
2010-01-21 ST joins CEA-Leti e-beam litho program
The program covers tool assessment, patterning and process integration, data handling, prototyping and cost analysis.
2003-12-17 Europe's Medea+ faces cash crunch
Medea+, an industry-initiated pan-European program for microelectronics R&D, faces the cancellation or drastic curtailment of newly selected projects as deficit-squeezed European national governments threaten to choke off funding.
2010-03-02 SPIE Litho wraps with delays, double-patterning
The themes of this year's SPIE Advanced Lithography event were clear: D and D!delays and double-patterning. Indeed, EUV is delayed. So is maskless. And nanoimprint is still stuck in R&D.
2008-10-20 Mapper, TSMC delve into multiple e-beam lithography
Mapper and TSMC have signed an agreement, according to which Mapper will ship its first 300mm multiple-electron-beam maskless lithography platform.
2002-09-23 Group to develop low-energy e-beam litho system
Toshiba Corp. and three partners have joined forces to develop a maskless, low-energy electron-beam direct-writing system for SoC devices.
2002-09-11 Verification company in Japan formed thru collaboration
Tokyo Electron Ltd, Ebara Corp., and Dainippon Screen Mfg. Co. Ltd have entered into a memorandum of agreement to form a joint venture company, tentatively named E-Beam Corp.
2009-06-15 TSMC weighs in on e-beam, EUV litho
Foundry giant Taiwan Semiconductor Manufacturing Co. Ltd is still backing two horses in the race to the next lithography! extreme ultraviolet lithography (EUVL) and clustered electron-beam.
2010-03-01 TSMC takes on 40nm yields, high-k, litho issues
At the TSMC Japan Executive Forum in Yokohama, Shang-Yi Chiang, senior VP of R&D at TSMC, addressed several issues about the silicon foundry giant.
2010-04-15 TSMC skips 22nm, leaps to 20nm half-node
Taiwan Semiconductor Manufacturing Co. Ltd announced plans to skip the 22nm "full node" after the 28nm node and move directly to the 20nm "half node."
2009-01-06 Top 15 challenges to conquer for 22nm
What are the big challenges involved at the 22nm node?
2008-08-14 Sematech reports progress on EUV litho for 22nm
Sematech has disclosed a way of using extreme ultraviolet (EUV) lithography to define silicon devices with a half-pitch resolution as small as 22nm.
2005-09-01 Road map rethinks process reductions
The ITRS draft scraps nodes and embraces 'cycles' for more incremental transitions.
2010-04-07 Quest for the right road to lithography
The industry has long known that without a viable NGL solution!which most assumed would be EUV!Moore's Law scaling would slow and the secular growth rate of the IC industry would decline.
2009-03-02 Panelists skeptical on next-gen litho
Experts debated and sparred over the future of patterning during a panel discussion at the SPIE Advanced Lithography conference.
2005-04-18 Nanoimprint litho makes its mark at SPIE
While nanoimprint vendors made impressive claims in a recent conference in California, analysts noted that the market is in its infancy.
2014-07-04 Nanoholes improve nanowire-based solar cells
Singapore researchers found a way to increase the cost-effectiveness of photovoltaic devices by improving the manufacturing of silicon nanoholes.
2010-03-11 Long road still to e-beam direct-write litho
While multiple development efforts on e-beam direct-write lithography have reported progress, a one prominent lithography researcher claims production tools are still a minimum of five years away.
2009-03-06 Litho woes: R&D gap, downturn
It was a triple-whammy for lithographers at the SPIE Advanced Lithography conference as the industry continues to be plagued by an R&D gap, technology delays, and, of course, the lousy economy.
2007-04-16 Litho woes weigh down semicon industry
The lithography world has suddenly turned upside-down as the industry gets socked by a double whammy: The window of opportunity is slowly closing on EUV lithography for IC production, but the most likely alternative!a version of 193nm immersion!is proving expensive.
2008-07-16 Litho options falling behind process needs
Who killed high-index lithography, and was politics the cause? These questions remain for chipmakers looking for a route to next-gen manufacturing in a shifting lithography landscape.
2005-05-25 Kodak licenses OLED technology to Fuji
Fuji became the latest licensee of Kodak's organic light-emitting diode (OLED) technology.
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