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2002-04-18 UMC tunes low-k material to produce Trident graphics chip
United Microelectronics Corp. is seeing some return on its strategy to increase business among graphics chip suppliers while at the same time showing progress in its use of a low-k dielectric insulating material for copper interconnects.
2005-07-05 Type-Z material is extremely achromatic with high transmittance
Murata has developed a new material (Type-Z) based on transparent ceramics (LUMICERA), which is extremely achromatic and with high transmittance for short wavelength.
2002-10-22 TT Electronics MMG develops ferrite material for HF power supplies
TT Electronics MMG has developed the F2 NiZn ferrite material that is suitable for use in switch-mode and resonant-mode transformers or high-frequency power supplies.
2007-08-20 Thermoelectric material packs performance in paper-thin size
Nextreme's paper-thin thermoelectric material achieves temperature differentials of 55-60C at room temperature, comparable with the performance of larger conventional thermoelectric technology.
2006-05-19 Thermal dielectric material offers high temp/voltage properties
Laird Technologies has introduced the T-preg HTD, a thermally conductive, electrically insulating pre-impregnated composite fiber.
2003-04-30 Temex ceramic material boasts high Q performance
The E7000 series of high-frequency ceramic materials from Temex offers twice the performance of the company's previous materials over the 8GHz to 15GHz range.
2006-09-12 Tech bonds different material-based elements without wire bonding
Oki Electric Industry announced a new interconnect technology that allows bonding of different material-based device elements without using conventional wire bonding.
2003-02-17 TDK ferrite material has high inductance
The DN45 ferrite material from TDK Corp. is designed for use in pulse transformers for 100Base-T systems.
2003-07-16 TDK ferrite material eyes transformer LAN systems
TDK Corp. has announced that it has completed the development of DNW45, an industry-leading ferrite material designed for networking apps.
2002-09-12 TDK ferrite material eyes ADSL, xDSL transformer apps
TDK Corp. has developed the DN70 ferrite material that offers lower total harmonic distortion and is targeted for use in ADSL and xDSL modem line transformers.
2014-01-28 Stratasys touts first colour multi-material 3D printer
The Objet500 Connex3 Color Multi-material 3D Printer promises to improve design and manufacturing efficiencies and deliver better products through a unique triple-jetting technology.
2012-06-26 Silver to replace gold as Fano resonance material
Silver nanostructures exhibit a resonance feature that is useful for a multitude of sensing applications.
2002-04-16 Sichuan silicon material venture begins volume production
China Export Bases Sichuan Import & Export Co. Ltd and Sichuan Huadu Hi-tech Group Co. Ltd's silicon material venture in Sichuan, China, has commenced mass production with an annual capacity of 10,000 tons.
2002-02-28 Semiconductor material plant breaks ground in Beijing
Beijing New Building Material Co. Ltd has established a new company named Beijing New Material Incubator Co. Ltd located in Beixin Material Park, Zhong Guan Cun, Beijing, China.
2002-02-04 SEI magnetic material offers 140MPa bending strength
2011-04-07 See through force sensing material for touchscreens
The QTC Clear force sensing material developed by Peratech aims to replace current resistive touch screen technologies or enhance capacitive ones to create solutions with more features such as 3D input.
2002-03-26 Rohm and Haas to construct specialty material plant in India
Specialty materials supplier Rohm and Haas Co. will construct a manufacturing facility in Mumbai, India worth $20 million.
2003-06-17 Rogers polymer material suits thin-film PCBs
Rogers Corp. has expanded its R/flex 3000 family of Liquid Crystalline Polymer-based circuit materials with the introduction of the R/flex 3850 double-clad laminate.
2003-09-02 Rogers adhesive material is electrically conductive
Rogers Corp. has introduced a conductive adhesive for its BISCO EC-2000 electrically conductive solid silicone series.
2014-01-22 Researchers explore CCTO as material for supercapacitors
Researchers are studying the possibility of fabricating a new class of high heat-tolerant electronics that would employ supercapacitors made from a material called calcium-copper-titanate.
2013-06-17 Research team improves hexagonal material
Rice University and ORNL researchers have enhanced the growth of molybdenum disulfide semiconducting films for atom-thick circuits.
2001-08-24 RDRAM thermal interface material specification
This application note specifies the thermal interface material properties for robust thermal/mechanical performance of the RIMM assembly. It applies to RIMMs with cover assemblies over the RDRAM components
2016-02-03 Promising 2D material opens path for next-gen spintronics
Researchers from NUS and Yale-NUS College have established the mechanisms for spin motion in molybdenum disulphide (MoS2), an emerging 2D material that shows potential for low-power devices.
2003-01-06 Philips develops EL material that generates red, green light
Researchers at Philips, collaborating with the University of Amsterdam, have developed the first electroluminescent (EL) material that can generate either red or green light.
2013-01-22 Phase-change material opens new path for data storage
A research team from A*STAR Data Storage Institute has found that materials made of iron and tellurium can change their property known as optical reflectivity depending on their crystalline state.
2005-11-28 Phase change material offers performance and easy use
Laird Technologies introduced a new high-performance phase change material that meets the thermal resistance and reliability requirements needed for advanced apps such as microprocessors, chipsets, graphic processing chips and custom ASICs.
2009-02-23 PCB dielectric material selection and fiber weave effect on high-speed channel routing
This application note is for printed circuit board (PCB) designers planning to use the high-speed transceivers available in Stratix II GX and Stratix IV GX devices and addresses two key design topics.
2014-03-20 Patterning technique reduces material coercivity
North Carolina State University researchers came up with a technique to reduce the coercivity of nickel ferrite (NFO) thin films by as much as 80 per cent by patterning the surface of the material.
2004-03-22 Park Electrochemical sets up PCB material plant in China
Park Electrochemical Corp. is establishing a manufacturing facility in China to support the growing customer demand for advanced multilayer printed circuitry materials in the region. The facility will operate under the name Nelco Technology (Zhuhai FTZ) Ltd.
2006-07-19 Paint-on semiconductor outperforms crystalline material
Researchers at the University of Toronto produced a semiconductor device by painting a liquid carrier onto a piece of glass and claimed that the device outperforms conventional crystal-based devices.
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