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2013-11-20 Yole: Diamond materials market for chips to top $43M
The growing interest in diamond for optical and thermal applications, and for high-power, high-frequency devices working at high temperatures is expected to drive the market, said Yole Developpement.
2001-03-01 Via-fill materials for next-generation interconnect
Via-fill polymers for next-gen interconnects are designed to improve on the performance capabilities of traditional epoxy-based via-plug materials.
2013-07-11 Vacuum pump tweaked for Applied Materials' platforms
Edwards Group Limited's IPUP2 boasts increased tool throughput, achieving a peak pumping speed (180 m3/h) 89 per cent faster and pump down times up to 54 per cent faster than 1st generation pumps.
2013-11-18 Ultra-short laser deposition tech cuts materials costs
Picodeon's ColdAb technology is geared for the application of gold and platinum thin films, enabling thinner films and reducing precious metal costs.
2003-06-19 TTI acquires Capsco Materials
TTI Inc., a distributor of passive, interconnect, and electromechanical components, has agreed to acquire Capsco Materials Management. Capsco is an authorized distributor primarily serving the passive component market.
2003-07-21 TSMC, Applied Materials ink deal on ECP development
Taiwan Semiconductor Mfg Co. has entered into a joint development agreement with Applied Materials Inc. to develop TSMC's next-gen copper chips.
2003-05-21 Toyo FPD materials to be tested on Integral Vision system
Toyo Corp. has chosen Integral Vision Inc. to take part in the development of a Lifetime Testing system for FPD materials.
2002-10-23 Tower to produce 0.135m devices with Applied Materials
Applied Materials Inc. has received orders for chip making equipment worth more than $45 million from Tower Semiconductor Ltd.
2009-01-09 Tough '09 awaits fab-tool, materials sector
Based on the early returns, the fab-tool and electronic materials markets are off to a rough start in 2009. And don't expect the market to improve, prompting the possible acceleration of a shake-out in the sector.
2003-08-29 Toshiba to use Applied Materials low-k films
Toshiba has selected Applied Materials' Black Diamond and BLOk low-k dielectric films to be used for volume production of its 90nm CMOS4 process.
2003-11-14 Tohoku Pioneer to use Universal PHOLED materials
Tohoku Pioneer Corp. and Universal Display Corp. have entered into an agreement for the latter to provide PHOLED materials to Tohoku Pioneer.
2013-10-18 Thermal management materials post $1.8B for 2013
Lux Research forecasts that thermal management materials for LEDs and power electronics to grow by 4.8 billion market in 2020.
2002-04-01 Teradyne, Taconic tie-up for circuit board materials
Teradyne Inc.'s Connection Systems Division and Taconic have signed a joint agreement to manufacture and market Taconic's patent-pending TacPreg circuit board material for large format PWB applications.
2002-07-24 Tegal develops plasma etch process for FeRAM materials
Tegal Corp. has developed plasma etch processes for ferroelectric RAM (FeRAM) materials by implementing patented technologies for the closed-loop control and monitoring of wafer temperatures during etching.
2002-03-13 Switchable materials market to hit $13B in 2006
The total market for applications based on switchable materials was estimated to be worth $400 million in 2001, and could conceivably increase to over $13 billion in 2006, according to Business Communications Co. Inc.
2001-09-12 Surface characterization of semiconductor materials by AFM
This application note presents a comparison of roughness measurements by AFM (Atomic Force Microscope) and SEM (Scanning Electron Microscope) of silicon substrates bombarded and analyzed during SIMS (Secondary Ion Mass Spectrometry) experiments.
2004-02-10 Sumitomo, CDT co-develop polymer OLED materials
Sumitomo Chemical Co. Ltd and Cambridge Display Technology Ltd (CDT) have reached an agreement to jointly develop high efficiency polymer OLED (PLED) display materials.
2009-12-11 ST chooses Applied Materials' HKMG for 28nm
HKMG is an emerging technology that allows faster switching speed while reducing device power consumption.
2014-11-26 Soitec, SK team up to innovate semiconductor materials
Although the first phase of the agreement targets semiconductor materials development, the alliance could be extended to include manufacturing and commercial development.
2008-02-22 SOI consortium signs Applied Materials onboard
Applied Materials has joined the SOI Industry Consortium, a group aimed at accelerating silicon-on-insulator innovation into broad markets.
2002-09-20 Silicon materials market unaffected by electronics downturn
Kline & Co. Inc. reported that despite a general slowdown in the electronics industry the market for consumables in silicon-based semiconductor manufacturing registered over $3.8 billion in 2001 with 2002 being expected to register about the same level of sales.
2003-02-07 Shipley opens R&D facility for microelectronic materials
Shipley Co. L.L.C. has opened its Advanced Technology Center in Marlborough, Massachusetts.
2004-03-16 SEMI: Semiconductor packaging materials market to reach $11.7B
The market for semiconductor packaging materials is expected to grow from $7.9 billion in 2003 to $11.7 billion by 2008, according to SEMI and TechSearch International's latest report entitled
2006-01-25 Semi packaging materials to hit $20B in 2010
The market for semiconductor packaging materials is expected to grow from $12B in 2005 to $19.5B by 2010, according to SEMI and TechSearch International.
2014-04-01 Selecting housing materials for DDR4 memory module
The design and type of connector determines the set of materials that can be considered for the housing.
2007-10-22 Seashells inspire ultrathin yet ultrastrong materials
A University of Michigan engineering professor has succeeded in creating an ultrathin material as strong as steel by embedding nanomaterial in an organic polymer matrix, mimicking the way oysters embed calcium carbonate into an organic matrix to create seashells.
2002-03-27 SCT wins another patent for semiconductor technology materials
Single Crystal Technologies (SCT) has received another patent from the U.S. Patent Office for its cover materials purification and materials synthesis used in the semiconductor manufacturing industry.
2004-05-03 Russo-German startup claims laser materials breakthrough
Researchers at the University of Michigan have produced 1.3?m edge-emitting semiconductor lasers that have demonstrated temperature stability over the range 0 to 80C.
2005-11-09 Rogers displays new lines of adhesiveless, API circuit materials
Rogers Corp. disclosed that it will showcase its two new lines of 2L-FCCL adhesiveless at next week's Productronica in Germany
2013-03-04 Research: Magnetic materials control light at nanoscale
Researchers at the A*STAR Data Storage Institute, Singapore have created tiny spheres of silicon that can strongly interact with the magnetic field of visible-wavelength light.
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