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2007-04-13 Spansion, Qimonda to supply memory subsystems for mobile
Spansion and Qimonda announced a strategic supply agreement that will combine Qimonda's low-power DRAM with Spansion's MirrorBit NOR and ORNAND devices into MCP memory solutions.
2006-09-01 Solving the MCP memory test challenge
Multichip packages (MCPs) are the standard for cellphones, with nearly all modern cellphones having at least one MCP. Using MCPs allows manufacturers to offer the new multifunction devices while maintaining small form factors
2004-09-13 Samsung memory with 2Gbs of AND Flash, 512Mbs mobile DRAM
Samsung developed a 2.5Gb four-die multi-chip package designed for use in third-generation mobile phones.
2004-09-09 Samsung launches 2.5Gb memory for mobile phones
Samsung Electronics released a 2.5Gb multi-chip package memory for third-generation mobile phones
2006-03-02 NAND flash MCP designed for multimedia cellphones
STMicroelectronics announced a new multi-chip package memory portfolio that aims to meet the needs of multimedia applications in 3G and CDMA cellphones
2006-06-21 MCP memory has 2GB NAND, SD card controller
Toshiba's new MCP memory with 2Gbyte NAND flash memory and SD card interface targets mobile phones.
2009-11-10 MCP memory geared for smart phones, MIDs
Micron's multi-chip package (MCP) memory includes a 4Gbit NAND flash memory die and a 2Gbit low-power DDR die.
2002-10-25 ICSI combines NOR Flash, SRAM in MCP
Integrated Circuit Solution's MCP is able to stacks a NOR Flash and SRAM and is targeted for portable devices apps
2013-04-05 High demand for Samsung phones tighten eMCP/CI-MCP supplies
The large demand for the Korean giant's smartphones is expected to create a negative impact on various Chinese manufacturers' shipments as eMCP supplies become more constrained.
2006-09-01 Demand for features boggles portable memory
Handset models are changing yearly as designers strive to balance what end users want and what can actually be designed. Many trade-offs must be considered, including performance and features vs. price, size and battery life.
2012-09-21 Why GigaDevice gambles on NOR flash memory
China fabless firm GigaDevice is staying put in the NOR flash market even if the industry proves challenging for sales growth and expansion.
2007-11-12 Test system targets multiple memory MCP devices
A high-speed, high-throughput memory test system for MCPs has been introduced by Advantest Corp
2007-02-20 ST rolls out 'smallest' 65nm NOR flash memory
STMicroelectronics is sampling 1Gbit and 512Mbit 65nm NOR flash with what is claims is the smallest die size available on the market.
2005-04-13 Spansion displays NOR flash memory
Memory chip vendor Spansion LLC has joined the IIC-China tradeshow this year. The company exhibited its full-series of NOR flash memory, including 5V, 3V and 1.8V products, 1- to 512Mb products, as well as single-chip and multi-chip packaging products (MCP).
2010-09-13 Smart phone memory chips pioneer e-MMC 4.41 spec
The latest Samsung moviNAND embedded memory chips enable more efficient processing of orders with a high-priority interrupt feature that cuts latency
2005-02-24 Samsung commences production of MCP for mobile apps
Samsung Electronics Co. Ltd revealed that it is mass producing what it claims to be the largest-capacity multi-chip package (MCP
2006-11-03 Samsung announces 16-chip MCP technology
Samsung Electronics announced that it has developed the industry's 'first' process to enable the manufacture of a 16-chip multi-chip package of memory
2005-01-18 Samsung announces 'first eight-die MCP technology
Samsung has developed what it touts as the world's first eight-die MCP technology, designed for use in high capacity mobile devices
2014-11-05 Rethinking memory design for IoT and wearables
The space, power and application requirements of wearables and other mobile connected devices that collectively make up the growing IoT ecosystem require a fresh approach to system design.
2004-07-26 Renesas MCP incorporates CPU core, PCIC
Renesas developed a 32-bit microprocessor that incorporates the SH-4A and a PCI bus controller.
2007-03-16 Reduce memory subsystem power consumption in handsets
Less attention has been given to memory components despite the fact that the power demands of memoryat least 20 percent of total power budgetare equal to the demands of the application processor. Reducing the power used by memory can significantly extend handsets battery life
2013-12-11 Recognizing the issues with phase change memory
There are about half a dozen papers on phase change memory (PCM) devices at IEDM 2013, and most deal with known reliability problems associated with PCM
2005-07-26 Powerful final-test memory system debuts
Agilent Technologies now has a new final-test memory tester targeting MCPs and discrete flash. Dubbed the Versatest Series Model V5500, this ATE system offers a tester-per-site architecture
2008-08-18 Numonyx seeks flash memory supremacy
Looking into how Numonyx positions itself in the flash memory market and how it sees the competition with industry leader Samsung, Harrison said the company's strategy is to achieve profitability through the efficiency and cooperation between Intel and ST to lead in flash memory industry
2007-08-01 Memory tester allows small lot production
Verigy's V5000ep device allows customers to perform quality assurance, characterization and small lot production at wafer sort and final test on new memory devices
2006-03-16 Memory packages eye cellphones
Micron has developed a family of multichip-packaged memories for smart phones.
2008-11-24 MCP accords memory for OMAP35x processors
Micron has introduced its high-performance MCP solutions optimized to work seamlessly with Texas Instruments Inc.'s OMAP35x applications processors
2007-08-16 Implement the right flash memory interface
Mobile products need flash memory. Implementing the most appropriate interface will increase system performance and reduce the BOM
2002-11-13 Fujitsu stacked memory MCP targets new cellphone apps
The MB84VY6A4A1 MCP from Fujitsu Ltd stacks three Flash, one SRAM, and two FCRAM devices in a single 15-by-11-by-1.4mm case
2003-06-10 Fujitsu MCP features burst-mode functionality
Fujitsu Ltd announced the development of the MB84SR6H5K5K1 MCP that combines Mobile FCRAM and burst-mode flash memory for next-gen mobile phones apps.
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