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2004-10-12 Actel IP core improves aircraft comm performance
Actel released an IP core designed to reduce development time and improve the performance of aircraft communications systems.
2002-09-10 Acromag acquisition boards have "mailbox" memories
The APC330 PCI and AcPC330 CompactPCI analog input boards from Acromag Inc. employ 16-bit ADCs that are able to scan channels in just 85s to achieve throughput rate of 125kHz.
2005-09-20 Accelerated Tech RTOS supports Atmel's AT91RM9200 MCU
Accelerated Technology, a Mentor Graphics division, announced the availability of the Nucleus real-time operating system (RTOS) for Atmel's AT91RM9200 MCU.
2008-02-26 8bit PCI digitizer adds DAQ options
Agilent Technologies Inc. has introduced two new options for its compact, low-power (less than 15W), high-speed Acqiris 8bit PCI digitizer.
2005-03-01 8bit MCU supports full-speed USB 2.0
ST's?PSD3400 Turbo Plus series of 8051-class embedded flash MCUs offers system-level-integration with flash and SRAM densities for general-purpose 8bit embedded apps.
2008-02-12 8/16-channel DAQ cards aim at PCIe
Strategic Test has announced two 250kHz, 16bit DAQ cards for PCIe, namely the UF2e-4721 and UF2e-4020.
2010-08-10 73S12xxF software user guide
This application note describes the Toolkit's hierarchical layers and how to use them.
2014-04-23 4Kbit I2C EEPROM for DDR4 features backward compatibility
The EEPROM from Microchip supports DDR4 SDRAM modules with up to 16B of data writing capability. It also features JEDEC Serial Presence Detect compliance and reversible software write protection.
2005-10-04 4GB embedded storage device to replace micro hard drives
SanDisk's iNAND is a small, high-speed NAND flash storage device that the company is touting as an alternative to micro hard drives in mobile applications.
2008-09-01 3D-TSVs spark packaging revolution
Chips face the so-called "More-than-Moore" 3D integration route in order to pursue the continued aggressive scaling demanded by the historical law. 3D integration with through-silicon vias (3D-TSV) will accelerate the consolidation happening in CMOS wafer fabs and the shift toward the fabless foundry model.
2011-03-09 3D TSVs get boost from IMEC, Microtech
Cascade Microtech and IMEC are working together to develop standards, test methods and methodologies for emerging 3D-TSV structures.
2007-04-02 32bit flash MCUs tout lowest power
Atmel announced what it claims as the industry's lowest power family of 32bit flash MCUs based on its AVR32 UC3 core.
2010-02-16 32-channel RF signal generator trims test costs
RF Engines Ltd has released a 32-channel RF signal generator that is designed to enable challenging RF environments to be recreated in labs to test RF equipment.
2006-04-03 3.5G wireless tester gets 1xEV-DO phone option
Willtek Communications' existing 4400 Mobile Phone Tester Series is now suitable for use by engineers at manufacturing sites, as well as by technicians at field repair centers.
2004-12-17 2kW front-end readies for advanced SSI apps
Cherokee International's DPS2000 (ac-dc) front-end delivers 2,000W at 48V.
2010-06-09 1GHz ARM-based MPU enables complex 3D rendering
Texas Instruments Inc.'s AM3715 microprocessor enables fluid, complex 3D rendering, picture-perfect visuals and increased GUI capabilities.
2012-03-05 16bit MCUs boast low pin count, power use
The PIC24F 'KL' MCU family from Microchip Technology flaunts a low cost solution to consumer, medical and safety/security applications.
2007-05-24 10G Ethernet IC has congestion management option
Jumping on a growing bandwagon of companies fielding chips for 10Gbps Ethernet, Mellanox claims its dual-port ConnectX EN delivers up to 17.6Gbps in bi-directional bandwidth and 6.9?s latency on standard TCP/IP flows.
2015-01-26 10 vital signs of the semicon industry
According to Bill McClean, president of IC Insights, the semiconductor industry can expect a bright year ahead with a growth forecast of 7 per cent, but things will become tougher in 2018.
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