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2007-07-20 WTO says Japan's tariff on Hynix chips illegal
WTO has ruled that Japan illegally applied countervailing duties on DRAM chips made by South Korean Hynix Semiconductor, under the international trade rules
2010-09-22 World's first two-terminal silicon-only memory chip created
Scientists strip out carbon to create world's first two-terminal silicon-only memory chip
2007-06-29 Winbond, Qimonda extend memory production deal
Winbond Electronics and Qimonda AG have signed an agreement to further expand their existing cooperation for the production of memory chips.
2006-12-05 Winbond invests in Korean fabless memory firm
Winbond Electronics announced that it invested $15.7 million in Emerging Memory & Logic Solution Inc. via its overseas subsidiary and received one seat on EMLSI's Board of Directors
2012-09-21 Why GigaDevice gambles on NOR flash memory
China fabless firm GigaDevice is staying put in the NOR flash market even if the industry proves challenging for sales growth and expansion.
2008-09-19 Which memory rival should buy SanDisk
SanDisk Corp. will most likely be acquired by a rival but the question is which of its NAND memory competitors or partners will buy the company
2008-03-25 Weak memory segment drags chip market
Surprising weakness in the memory chip market in Q4 took the wind out of the sails of the global semiconductor market, causing growth in 2007 to fall short of expectations, according to iSuppli
2013-06-25 Utilising non-volatile memory IP in SoC designs
Integrating anti-fuse NVM on chip for program storage results to increased margin as well as independence from vagaries of supply chain and component availability.
2011-08-17 U.S. beefs up control of fake chips in supply chain
An analysis of the U.S. government's effort to curb down fake chips, particularly from China, reveals a much serious problem within the supply chain and the country's important installations
2005-07-06 TSMC tipped to make Spansion chips, says report
Foundry chip maker Taiwan Semiconductor Mfg Co. Ltd (TSMC) has declined to comment on an Economic Daily News report that it has agreed to make flash memory chips for Spansion LLC, according to an AFX News report.
2004-01-28 Toshiba package achieve thinner chips
With a 1.4mm height, the Multi Chip Package (MCP) from Toshiba Corp. stacks a total of nine layers of components.
2006-10-27 Tiny Flash chips offer 16/32Mbit densities
Winbond Electronics' new Flash memory chips offer 16Mbit and 32Mbit densities that fit into space-saving and cost-effective 8-pin 5.28mm SO8 packaging.
2007-10-01 TI secures e-passport market with FRAM-based chips
Texas Instruments will embark on the secure government ID market with products built around ferroelectric RAM and MCU technologies.
2011-10-14 The move toward 3D chips
Semiconductor fabrication is moving toward 3D ICs and by next year, 3D chips will be available for commercialization
2005-03-31 THE memory card for cellphones
Samsung disclosed that it has started mass-production of what it claims as the smallest memory card available for mobile phones
2005-05-11 Tezzaron, PICC to collaborate on 3D flash memory
Tezzaron Semiconductor Inc. and startup Programmable Integrated Circuit Co. (PICC) announced plans to collaborate on the creation of three-dimensional (3D) flash memory components
2004-05-26 TDK launches Flash memory controller
TDK has developed the GBDriverXR NAND Flash memory controller IC that can manage at least eight NAND Flash memory chips from 64Mb to 16Gb.
2013-12-06 Strong memory market boosts semiconductor sales in 2013
IHS stated that following a 2.5 percent decline in 2012, the global semiconductor market has regained its footing in 2013 with revenue set to expand by nearly five percent.
2003-04-28 STMicro, Hynix to co-develop multimedia memory chips
STMicroelectronics and Hynix Semiconductor have agreed to jointly develop NAND Flash products that will be marketed by both companies.
2004-07-19 STMicro rolls out 256Mb, 128Mb memory devices
STMicro announced that it has completed its 'Small Page' NAND Flash memory roadmap with the release of 256Mb and 128Mb devices
2003-07-01 STMicro memory chip suits cellphones, GPS receivers
STMicro has expanded its M29 family of industry standard 3V Flash memories with the release of a 64Mb device.
2008-07-14 Standards for 3D memory chips set
The Intimate Memory Interconnect Standard (IMIS) being promoted by the 3D-IC Alliance recently released its official specification for 3D stacking memory chips.
2003-01-10 ST ships 100M MPEG-2 chips, eyes DVD
When General Motors subsidiary Hughes Electronics Corp. set out to pioneer a satellite-based digital TV service as an alternative to cable eight years ago, the onus of providing silicon came to STMicroelectronics.
2005-04-08 Software upgrade doubles test capacity for memory devices
An enhanced version of TCS for MOSAID's MS4205 family of memory test systems doubles the test capacity for memory chips to 8Gb.
2002-02-06 SMIC to make memory chips for Fujitsu
Fujitsu Ltd has signed a foundry agreement with China-based Semiconductor Mfg. Int. Corp. for the manufacture of 0.225m and 0.185m FCRAM (Fast Cycle RAM) products.
2010-09-13 Smart phone memory chips pioneer e-MMC 4.41 spec
The latest Samsung moviNAND embedded memory chips enable more efficient processing of orders with a high-priority interrupt feature that cuts latency.
2010-08-26 Smart memory chips may replace TCAMs, DRAMs
Huawei Technologies presented its work on a first-gen smart memory packing 32MB, consuming 60W that can eventually replace TCAMs and DRAMs. The device is still under verification
2014-04-10 Six hot tech trends emerge in high-speed memory
While DDR4 comes first to mind in consideration of the latest developments in high-speed memory, several others including embedded DRAM and SRAM cells make the top six list
2007-01-04 SIA president warns of tight memory IC supply
Semiconductor Industry Association president George Scalise warned that there are signs that memory chips are coming into tight supply due to strong demand for chips.
2002-01-02 Sharp stacked CSP memory boasts 200Mb capacity
The company has developed a four-chip stacked CSP memory device that integrates two 64Mb NOR Flash memory chips, a 64Mb RAM and an 8Mb low-power SRAM into a single package.
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