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2008-02-05 Memory controller SSD modules integrate NAND flash
Intelliam has launched its LeanSTOR line of Advanced Memory Controller SSD modules with onboard NAN flash for AdvancedTCA and MicroTCA embedded systems
2012-09-05 How to optimize PCIe SSD performance
Know why it is important for interconnect and flash controller suppliers to work together to achieve the best results
2008-03-26 Toshiba readies 128GByte notebook SSD
Toshiba last week said it plans to ship before April a 128Gbyte SSD that will appear first in Toshiba notebooks sold in Japan
2012-03-27 TDK rolls 3Gb/s SSD with serial ATA interface
The single-chip eSSD series boasts a storage capacity of 1-4GB and integrates the TDK SSD controller GBDriver RS3 with NAND type flash memory in a single package
2015-06-22 SSD standard preps for much-awaited update
As flash becomes more pervasive in data centres, vendors are diversifying their SSD offerings, in part to address different workloads, which JEDEC described in full detail
2012-10-15 Module from Kontron extends lifecycle of PCI/ISA-based apps
The Kontron ETX module with AMD Embedded G-Series APU T16R claims to add an upgrade path for Geode-based ETX designs and low-power systems
2014-08-12 Flash Summit drives memory innovation
The biggest takeaway of the Flash Memory Summit was on the breadth and depth of work to turn solid-state drives into processing nodes for big data centres
2010-02-04 Computer-on-module handles extreme conditions
The microETXexpress-XL uses Intel Atom processor Z520PT and Intel System Controller Hub US15WPT in a COM Express Type 2 computer-on-module designed for use in extreme conditions
2007-12-14 Toshiba debuts SSDs with MLC NAND flash
Toshiba and TAEC announced their entry into the emerging market for NAND-flash-based solid-state drives with a series of products featuring multi-level cell (MLC) NAND flash memory
2009-08-14 Sun's Cornwell: NAND is moving to litho death march
A Sun Microsystems Inc. technologist scolded the NAND flash industry, saying vendors are ignoring the needs of the enterprise and moving towards the "lithography death march."
2007-12-18 Intel upgrades mobile platform, debuts SSDs
Intel announced plans to ship the upgraded version of its dual-core mobile platform based on the 45nm manufacturing process by January and launched a solid-state drive (SSD) for mobile devices
2008-10-02 256Gbyte SSDs with MLC ready for market debut
Toshiba has enhanced its line up of NAND-flash-based SSD with the addition of a 256Gbyte model and the launch of small-sized flash modules
2009-03-31 Analyst warns of further DDR3 delay
Is the transition to DDR3 delayedagain? If so, this would be another blow for DRAM makers, who are looking for relief amid the memory downturn
2008-05-01 MLC adds muscle to NAND
As solid-state drives change the way data is stored, several major memory chip vendors are applying their multilevel-cell technology prowess to this burgeoning market, helping to bring the NAND-based storage architecture forward, particularly for mobile electronics
2014-08-06 Flash-backed DRAM rides PCIe 3.0 bus
The Flashtec card from PCM claims to offer better performance than flash-based SSD without its endurance issues, delivering 10 million IOPS when used as additional system memory
2011-03-28 Yukyung marshals army of IC vendors for Viliv tablet
"Globally" designed and based on Windows, Yukyung Technologies' Viliv X70 EX 3G is a good example of a tablet that preceded the iPad.
2003-11-24 Parvus CPU based on AMD MCU
Parvus Corp. has unveiled its SpacePC 4200 CPU, a fanless 5 x 86 class PC/104-Plus processor board based around the 32-bit AMD ?lan SC520 microcontroller.
2007-12-18 Micron announces solid-state drive line
A family of solid state drives has been introduced by Micron Technology, Inc. The RealSSD family of products offers a range of form factors and densities designed for computing, enterprise server and networking applications.
2015-03-09 IoT drives chip packaging innovation
The need for high performance multi-functional devices in a single package is pushing the industry to innovate in multi-chip packaging. This high level of integration has presented huge challenge.
2006-08-16 6th ESC-Taiwan gathers world's leading embedded tool vendors
Design engineers in Taiwan will be treated to an array of leading-edge technologies as the world's major embedded tool suppliers gather to showcase their products at the 6th Embedded Systems Conference-Taiwan.
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