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2005-04-07 Tessera, Hynix sign package license agreement
Packaging IP supplier Tessera Technologies has signed a new technology licensing agreement with Korea-based DRAM supplier Hynix Semiconductor.
2002-09-26 STMicro memory package reduces size by 23 percent
STMicroelectronics has introduced the MSOP8 package for use in their serial nonvolatile memory product that provides about 23 percent reduction in size, compared to the TSSOP8 package.
2005-06-23 Stacked package from Sharp allows 0.5-mm grid
Sharp Corp. has developed packaging technology that allows stacking of multiple packages with 0.5mm pitch ball grids, which the company claims is the industry's tightest pitch.
2009-11-10 Samsung slims down multi-die memory package
Samsung claims the thinnest multi-die memory package measuring 0.6mm in height, just half the thickness of a conventional memory package of eight stacked chips or dies.
2007-04-25 Samsung develops 'first' all-DRAM stacked package using TSV tech
Samsung claims to develop the 'first' all-DRAM stacked memory package using 'through silicon via' technology, which will result in memory packages that are faster, smaller and consume less power.
2010-11-12 MCUs tout more memory, new packages
Renesas refreshes 32-bit MCU line with higher-capacity memory, new package selections
2003-08-14 Irvine Sensors releases stacked memory line
Irvine Sensors has announced the availability of its line of stacked computer memory packages using BGA attachment technology
2004-06-25 Xilinx launches 200MHz QDR II SRAM memory tool kit
Xilinx developed a programmable 200MHz QDR II SRAM Memory Tool Kit that provides a comprehensive resource for system designers interfacing to QDR II SRAM devices
2004-02-16 Wireless memory modules go global
Wireless handset manufacturers may use all three types of integrated solutions: stacked silicon, package-on-package stacking and silicon with integrated functions
2007-07-25 Winbond tips new parallel flash memory devices
Winbond Electronics Corp. has added new products to its W19B family with the introduction of 16-, 32- and 64Mbit parallel flash memory devices
2008-05-16 What's the best flash memory flavor for your design
The embedded systems industry has been waiting for "universal memory" to come along. This article discusses the various flavors of NAND and NOR flash memory that may be the suitable to your design needs
2003-04-28 WEDC Flash memory saves 70 percent of board area
The W72M64V-XBX 3.3V Flash memory from White Electronic Designs Corp. is packaged in a 13-by-12mm, 159 PBGA package.
2003-04-16 WEDC Flash memory offers simultaneous R/W operation
The W72M64XV-XBX 2Mx64, 3.3V Flash memory device from White Electronic Designs Corp. allows simultaneous R/W operation
2004-04-20 WED module targets memory system apps
The 2GB DDR SDRAM registered ECC memory module from White Electronic Designs is claimed by the company to provide maximum performance for memory system apps
2009-03-04 Using CellularRAM memory to replace single- and dual-chip select SRAM
This technical note discusses the changes required to convert single- or dual-chip select (CE#) SRAM to Micron CellularRAM memory
2004-11-29 Upgraded tool speeds IC package analysis
Fluent's new offering may help prevent some of the packaging problems that have come to plague PCB designers.
2004-01-09 Transmeta launches processors in 21-by-21mm package
Transmeta has introduced its Crusoe TM5700 and TM5900 MPRs that feature an integrated Northbridge and are available in a 21-by-21mm package
2006-03-08 Translators target cellphone memory cards
STMicroelectronics announced two 6bit level translators intended for interfacing the 1.8V or 2.5V signals of cellphones and other products with the nominal 3.3V levels used by plug-in memory cards
2011-12-08 Transcoders integrate built-in memory
Fujitsu's transcoders offer low power-consumption, come in a compact package and are ideal for mobile devices
2003-11-05 Transcend DIMM features advance FBGA package
Transcend Information Inc. has announced the availability of its 1GB DDR400 (PC3200) unbuffered memory modules that apply advance FBGA package and original DDR400 high-capacity DDR DRAM.
2003-03-17 Toshiba samples 2Gb NAND Flash memory
Toshiba Corp. is sampling a 2Gb, single-die NAND Flash memory for use in digital consumer products such as digital-still cameras and PDAs
2004-01-28 Toshiba package achieve thinner chips
With a 1.4mm height, the Multi Chip Package (MCP) from Toshiba Corp. stacks a total of nine layers of components
2002-05-02 Toshiba chip package is 30 percent smaller
Toshiba Corp. has announced that it has developed a stacked multi-chip package (MCP) that measures 7-by-10mm30 percent smaller than the company's current MCPs that measure 9-by-12mm
2006-10-24 Tire pressure sensor includes all TPMS active functions in one package
The new SP35 tire pressure sensor from Infineon is touted to be the first device to incorporate all the major active functions of a wheel-mounted tire pressure monitoring system module into a single package
2014-04-09 TI unveils low-power MCUs in compact package
Developers can design smaller products with TI's FRAM-based MSP430FR5738 and Flash-based MSP430F51x2 MCUs in wafer-level chip scale packages (WLCSP) as small as 2.0 x 2.2 x 0.3mm.
2002-10-01 TI samples DDR-II logic register for memory evaluation
Texas Instruments is sampling the SN74SSTU32864 25-bit configurable registered buffer for evaluation in DDR-II memory apps
2012-11-29 Thermal lock-in analysis drives 3D package dev't
The ELITE thermal lock-in analysis system from DCG Systems claims to provide the ability to localise electrical faults within a 3D packaged device with the highest sensitivity and accuracy.
2007-11-12 Test system targets multiple memory MCP devices
A high-speed, high-throughput memory test system for MCPs has been introduced by Advantest Corp
2005-09-06 Termination networks deliver ESD protection to memory busses
Designed to terminate high-speed memory busses, TT electronics IRC Advanced Film Division has introduced a new series of termination and ESD protection networks
2015-07-22 Tearing down Hynix's high bandwidth memory
In this article, we explore the composition of Hynix's high bandwidth memory (HBM), which addresses bandwidth limitations with DDR4 type SDRAM and DDR5
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