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2013-05-06 Transparent thin film metrology system for 28nm node
The latest member of the S3000 family uses focused beam ellipsometry and newly-designed small site measurement optics to measure the thickness of single layer and multi-layer films on product wafers.
2003-12-22 Therma-Wave, Tokyo Electron partner on CD metrology developments
Therma-Wave Inc., a semiconductor metrology company, has received a multi-system, multi-million dollar order from Tokyo Electron (TEL). Under the terms of the order, Therma-Wave's advanced INTEGRA CD metrology products will be used with TEL's CLEAN TRACK ACT and CLEAN TRACK LITHIUS series of coater/developer products.
2005-10-17 Singapore tips sub-surface wafer metrology
Researchers from Nanyang Technological University in Singapore are developing a metrology system that claims to detect
2002-12-23 Shipley, Therma-Wave ink nano-metrology development deal
Shipley Co. has signed a joint development agreement with Therma-Wave Inc. in which the two companies will co-develop scatterometric methods to better measure 130nm photoresist features for polysilicon gate and shallow trench applications.
2002-09-16 Scatterometry-based critical dimension and profile metrology
This technical article discuss how as geometries are pushed below 0.15m, critical dimensions and feature profile metrology has become key to overall control of lithography.
2002-06-14 Rudolph develops enhanced metrology solutions
Rudolph Technologies Inc. has developed an enhanced metrology solutions roadmap to address the technology requirements outlined in the 2001 ITRS.
2003-12-05 Philips metrology technology selected by Ebara
Royal Philips Electronics announced that Ebara Corp.'s Precision Machinery Group has chosen Philips' SurfaceWave Technology for its primary metal thickness characterization metrology.
2014-10-08 Nikon Metrology delivers software for advanced BGA analysis
The new BGA tool provides powerful image processing, fully automated analysis and detailed reporting to inspect complex packages such as Package on Package (PoP) or dual-layered boards.
2002-04-18 Newport to divest its metrology business
Newport Corp. has expressed its intentions to sell majority of its industrial metrology systems division in two separate transactions to unrelated buyers.
2003-05-05 Newport opens new systems test, metrology lab
Newport Corp. has launched its newly-enhanced systems test & metrology lab located at the company's global headquarters in California, U.S.A.
2005-04-22 New mask metrology tool supports 65nm and beyond
Leica Microsystems has unveiled its new mask metrology tool Leica LMS IPRO3 that is designed to support mask metrology for the 65nm technology node and beyond
2013-08-23 Nanotech ups demand for high-precision dimensional metrology
Frost & Sullivan said the high-precision dimensional metrology equipment used in electronic manufacturing earned revenue of $1.91 billion in 2012 and estimates this to reach $2.55 billion in 2017.
2004-01-19 Nanometrics to supply Ebara with CMP metrology
Nanometrics Inc. and Ebara Corp. have concluded a purchase agreement whereby Nanometrics will supply Ebara with integrated metrology (IM) units for integration into Ebara's CMP products.
2005-09-13 Metrology tool offers atomic layer measurement accuracy
A manual, benchtop non-destructive R&D metrology tool that offers atomic layer measurement accuracy to 7 angstroms of oxide has been launched by Metryx.
2006-01-12 Metrology tool handles high volume production of 300mm wafers
The new, non-destructive, nanotechnology weight metrology tool from Metryx is designed to handle high volume production of 300mm semiconductor wafers.
2011-04-01 Metrology tool boasts improved modeling capability
The Spectrashape dimensional metrology systems released by KLA-Tencor features AcuShape2 modeling software developed jointly with Tokyo Electron Limited.
2013-07-26 Metrology system configured for advanced packaging
Rudolph Technologies' metrology suite includes specially-designed configurations for wafer level packaging, 2.5D (interposer) and 3D ICs using through-silicon via (TSV) as interconnects.
2004-03-01 Metrology must advance to support 45nm
The emerging method of small-angle X-ray spectrometry and ellipsometric porosimetry are competing for acceptance as commercial porosimetry solutions.
2007-04-03 Mask metrology tool suits 45nm and beyond
Vistec Semiconductor Systems has introduced its next-generation mask metrology toolthe LMS IPRO4that's designed to support mask metrology for the 45nm technology node and beyond.
2006-05-17 Magnetic metrology system accelerates storage devices development
KLA-Tencor unveiled the MRW3, its third-generation magnetic metrology system for the hard disk drive and semiconductor memory markets.
2010-08-11 Low-cost film metrology tool rolls
KLA-Tencor Corp. makes available a low-cost version of its metrology solution for measuring thickness, refractive index and stress of non-critical films at the 32nm node and beyond.
2004-09-03 KLA-Tencor, SIINT to bring surface metrology solution
KLA-Tencor Corp. and SII NanoTechnology (SIINT), a subsidiary of Seiko Instruments, have formed a partnership to distribute SIINT's Nanopics 2100 high-speed, high-resolution atomic force profilometer to markets outside of Japan.
2006-02-17 KLA-Tencor unveils latest-gen optical CD metrology system
KLA-Tencor's latest-generation optical CD metrology system provides cost-effective inline CD and profile measurements of critical device structures that help enable early prediction of IC performance and yield at the 90nm and 65nm nodes.
2003-09-17 KLA-Tencor metrology tool provides in-line monitoring
KLA-Tencor has introduced what it claims is the industry's first in-line, non-contact metal films metrology system to provide independent measurements.
2002-06-26 KLA-Tencor metrology tool features wafer monitoring
KLA-Tencor Corp. has introduced the SpectraFx 100, its fifth-generation optical thin-film metrology system, which enables product wafer monitoring for 193nm DUV lithography and copper interconnect processes.
2002-12-05 KLA-Tencor metrology tool drives down 100nm costs
KLA-Tencor Corp.'s NanoPro NP1 metrology tool enables silicon wafer and SOI manufacturers to drive down 100nm and below device apps.
2002-07-11 KLA-Tencor enhances metrology system
KLA-Tencor Corp. has introduced the Archer Analyzer software for its Archer 10 optical overlay metrology system.
1999-04-08 Integrated solutions for solid state electricity metrology
This paper gives an overview of electricity meter design using solid state electronics. It discusses various architectures and some of the key technologies that allow reliable and cost-effective solid-state meters to be implemented. It also discusses semiconductor reliability issues and the challenges posed by the EMI/EMC requirements for solid-state meter approval.
2004-06-01 For metrology, nano changes everything
International Technology Roadmap for Semiconductors said that the transistor gate length of microprocessors at the 45nm node will be <20nm in 2010.
2003-07-17 FEI metrology system speeds-up chip development
The CLM-3D is an in-fab fully automated DualBeam metrology system designed for rapid process development of new chip technologies below 130nm.
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