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2005-08-18 New micro pitch interfaces from Samtec
Samtec's line of sub-millimeter micro pitch interfaces on 0.5mm, 0.635mm and 0.8mm pitch promise space and cost savings along with the proven performance features of traditional blade and beam construction
2005-08-25 Protecting the HDMI interface
HDMI combines a high-speed unidirectional TMDS data link with low speed, bi-directional control and status links and configuration protocols in a single user-friendly high-performance connector.
2004-02-09 Lattice CPLD requires 13µA standby power
Lattice Semiconductor Corp. has released the final member of its ispMACH 4000Z family.
2003-05-20 Samtec releases three hermaphroditic connectors
Samtec Asia Pacific Pte Ltd has announced the availability of three combination socket/terminal interface systems having a pitch system of 2.54mm, 2mm, and 0.635mm, respectively
2006-07-04 I/O interfaces feature dust, waterproof sealing
Samtec has unveiled new circular I/O interfaces that meet IP68 specifications for dust and waterproof sealing in industrial or other rugged/harsh environment applications.
2006-12-14 Tiny flash LED driver suits advanced handsets
California Micro Devices has unveiled a new family of PhotonIC white LED drivers capable of supporting a wide range of high-current flash LEDs in advanced handsets
2008-12-03 Solution bridges MDDI/CPU, MIPI
California Micro Devices has announced CM5160, a Mobile Display Digital Interface (MDDI)/CPU to Mobile Industry Processor Interface (MIPI) bridge solution, the first to enable conversion
2005-12-21 Sockets designed for PCI Express
Samtec expanded its Micro Card socket interface line with the introduction of its PCIE series of PCI Express sockets. These devices support one, four, eight and sixteen PCI Express links
2007-02-26 DIMM sockets offer more memory at higher speeds
Molex has released a fully buffered DIMM socket that provides more memory capacity at higher speeds.
2005-03-09 Connector performs up to 3Gbps
The new low profile, high speed, Micro Card socket interface from Samtec promises to provide a unique card-to-board interface for serial ATA and other high speed daughtercard apps
2006-10-10 CMD display controller features MDDI-based serial client
California Micro Devices has introduced a dual display and audio controller that features a fully compliant, MDDI-based serial client
2008-04-10 High-retention USB interfaces tout minimum withdrawal
Samtec has introduced high-retention Type A and Type B USB interfaces that comply with the Class 1, DIV II minimum withdrawal requirement of 15N.
2011-12-21 JEDEC to release 3D IC standard
JEDEC will release in late December or early January 2012 the first 3D IC interface standard
2005-10-05 Ironwood's microBGA prototyping adapter simplifies device test
Ironwood Electronics offers a new prototyping adapter for 0.5mm pitch, 84-position, microBGA (µBGA) ICs
2009-04-24 Tiny charger IC fits slimmer portable apps
Summit Microelectronics has released the SMB239 charger IC that enables slimmer designs for portable consumer electronics.
2007-05-25 Telematics microprocessor rolls for automobiles
Freescale Semiconductor Inc. has unveiled a microprocessor that aims to integrate all the control electronics for an automobile cockpit into a single low-power device.
2005-03-04 ST flash memory chip tailored for 3G mobile phones
ST rolled out a 256Mb NOR flash memory chip that uses a 2bit/cell architecture to provide increased memory density in a small-sized die.
2003-09-11 NEC sound synthesizer LSI eyes cellphone apps
NEC Electronics has announced the availability of samples for a single-chip LSI synthesizer that implements surround sound technology.
2003-08-21 Nanowire approach to supercomputing touted at Hot Chips
Developers mapped out four routes to supercomputing - including one based on experimental work in nanotechnology - in the opening sessions of the annual Hot Chips conference.
2013-11-04 Miniature connectors tout up to 2Gb/s in rugged environments
Omnetics' Nano miniature connectors are designed and connected to impedance-controlled cable systems to provide high-quality signal integrity for high-speed Gigabit signal processing.
2004-05-13 IDT tri-port devices suit Asian handsets
IDT has introduced the industry's first family of tri-port devices designed for next-generation Asian wireless handsets.
2007-12-07 ESD protectors safeguard high-speed handset interfaces
CMD has expanded its product portfolio for mobile handsets with the addition of two ESD protection product families that address the needs of high-speed data interfaces in advanced handsets.
2011-09-02 DSPs cut active power consumption by half
TI has unleashed ultra-low-power DSPs that offer up to 50MHz and 100MHz performance
2011-12-08 Designing 3D-ICs (Part 2)
Here's the second instalment of this series that tackles the tools that can be used to handle a complete backend flow, and enable true 3D design partitioning, synthesis, placement, and routing.
2004-11-02 BiTMICRO launches 'world's first Ultra320 SCSI solid state flash disk drive'
BiTMICRO announced its recent shipment of the E-Disk 3S320D, touted to be the world's first Ultra320 SCSI solid state flash disk drive.
2006-08-07 Automatic die bonder offers increased precision, accuracy
Designed for fully automatic, high accuracy precision microelectronics assembly, Palomar's new die bonder performs adhesive dispense, component placement, die attach and flip chip operations over a 720inch2 work area.
2003-04-15 Assemblon component mounters boast modularity, scalability
Assemblon BV's A-Series of component mounting platform machines offer a flexible solution for 30,000cph to 100,000cph high-mix SMT apps.
2012-11-28 ARM rises from Acorn to lead system-chip revolution
Acorn was not destined to enjoy success in its own name. ARM evolved from the RISC machine fabricated by VLSI Technology and went to to lead the system-chip revolution of the 1990s.
2011-07-18 Applications processors enable EPDs, LCD devices
Freescale has released three members of the i.MX50 product family, which enable compelling end devices featuring LCD and/or electronic paper displays (EPDs).
2012-02-03 Advances in 3D-IC testing
Read about the design-for-3D-test architecture and implementation flow developed by researchers at Industrial Technology Research Institute based on the Synopsys test solution.
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